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MEMS Packaging Technologies and 3D Integration
| MEMS Packaging Technologies and 3D Integration |
| Autore | Seok Seonho |
| Pubbl/distr/stampa | MDPI - Multidisciplinary Digital Publishing Institute, 2022 |
| Descrizione fisica | 1 electronic resource (210 p.) |
| Soggetto topico |
Research & information: general
Biology, life sciences |
| Soggetto non controllato |
heterogeneous integration
wafer bonding wafer sealing room-temperature bonding Au-Au bonding surface activated bonding Au film thickness surface roughness microelectromechanical systems (MEMS) packaging inkjet printing redistribution layers capacitive micromachined ultrasound transducers (CMUT) fan-out wafer-level packaging (FOWLP) adhesion thin film metal parylene neural probe scotch tape test FEM MEMS resonator temperature coefficient thermal stress millimeter-wave redundant TSV equivalent circuit model S-parameters extraction technology evaluation MEMS and IC integration MCDM fuzzy AHP fuzzy VIKOR fan-out wafer-level package finite element glass substrate reliability life packaging-on-packaging thermal sensors TMOS sensor finite difference time domain optical and electromagnetics simulations finite element analysis ultrasonic bonding metal direct bonding microsystem integration biocompatible packaging implantable reliability Finite element method (FEM) simulation multilayer reactive bonding integrated nanostructure-multilayer reactive system spontaneous self-ignition self-propagating exothermic reaction Pd/Al reactive multilayer system Ni/Al reactive multilayer system low-temperature MEMS packaging crack propagation microbump deflection angle stress intensity factor (SIF) polymer packaging neural interface chronic implantation |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910576876203321 |
Seok Seonho
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| MDPI - Multidisciplinary Digital Publishing Institute, 2022 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Neural Microelectrodes: Design and Applications
| Neural Microelectrodes: Design and Applications |
| Autore | Pancrazio Joseph |
| Pubbl/distr/stampa | MDPI - Multidisciplinary Digital Publishing Institute, 2019 |
| Descrizione fisica | 1 electronic resource (378 p.) |
| Soggetto non controllato |
closed-loop
in vivo imaging education thermoresistance neural probe electroless plating neural stimulation and recording peripheral nerve stimulation shape-memory-polymer artifact sensor interface magnetic coupling neuroprosthetics intracortical implant µECoG neural interfaces implantable electrochemistry shape memory polymer neuroscience micromachine microelectromechanical systems stiffness Parylene C intracranial electrodes chronic implantation neural interfacing microelectrodes multiplexing microstimulators freely-behaving windowed integration sampling system-on-chip brain-machine interfaces insertion force microelectrode array vagus nerve diversity micro-electromechanical systems (MEMS) technologies mixed-signal feedback temperature monitoring foreign body reaction peripheral nerves brain-computer interface multi-disciplinary neurotechnology photolithography micro-electrocorticography robust microelectrode conscious recording electrode array dopamine softening sciatic nerve bio-inspired neural prostheses neuroscientific research bidirectional LED chip microfluidic device electrode-tissue interface impedance intracortical silicon carbide three-dimensional bias micro-electromechanical systems (MEMS) silicon neural probes electrode degradation chronic microelectrode biocompatibility optogenetics fast-scan cyclic voltammetry (FSCV) glial encapsulation deep brain stimulation electrocorticography electrophysiology fast scan cyclic voltammetry precision medicine microfabrication BRAIN Initiative polymer magnetic resonance imaging polymer nanocomposite liquid crystal elastomer silicon probe training tissue response graphene electrode glassy carbon electrode immune response electrode implantation dextran immunohistochemistry neural interface response amorphous silicon carbide Utah electrode arrays neural amplifier neural electrode array neuromodulation in vivo electrophysiology neuronal recordings neural recording ECoG gene modification neural interface wireless enteric nervous system cellulose nanocrystals |
| ISBN | 3-03921-320-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | Neural Microelectrodes |
| Record Nr. | UNINA-9910367568503321 |
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Pancrazio Joseph
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| MDPI - Multidisciplinary Digital Publishing Institute, 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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SiC based Miniaturized Devices
| SiC based Miniaturized Devices |
| Pubbl/distr/stampa | Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2020 |
| Descrizione fisica | 1 electronic resource (170 pages) |
| Soggetto topico |
Engineering - History
Technology |
| Soggetto non controllato |
high-power impulse magnetron sputtering (HiPIMS)
silicon carbide aluminum nitride thin film Rutherford backscattering spectrometry (RBS) grazing incidence X-ray diffraction (GIXRD) Raman spectroscopy 6H-SiC indentation deformation material removal mechanisms critical load 4H-SiC critical depth of cut Berkovich indenter cleavage strength nanoscratching power electronics high-temperature converters MEMS devices SiC power electronic devices neural interface neural probe neural implant microelectrode array MEA SiC 3C-SiC doped SiC n-type p-type amorphous SiC epitaxial growth electrochemical characterization MESFET simulation PAE bulk micromachining electrochemical etching circular membrane bulge test vibrometry mechanical properties Young's modulus residual stress FEM semiconductor radiation detector microstrip detector power module negative gate-source voltage spike 4H-SiC, epitaxial layer Schottky barrier radiation detector point defects deep level transient spectroscopy (DLTS) thermally stimulated current spectroscopy (TSC) electron beam induced current spectroscopy (EBIC) pulse height spectroscopy (PHS) |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910557498703321 |
| Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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