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A Conversation with the Brain: Can We Speak Its Language?
| A Conversation with the Brain: Can We Speak Its Language? |
| Autore | Barriga-Rivera Alejandro |
| Pubbl/distr/stampa | Frontiers Media SA, 2020 |
| Descrizione fisica | 1 online resource (155 p.) |
| Soggetto topico |
Neurosciences
Science: general issues |
| Soggetto non controllato |
bionics
cochlear electrode electrostimulation modeling nervous system neural interface prosthesis |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | Conversation with the Brain |
| Record Nr. | UNINA-9910557786603321 |
Barriga-Rivera Alejandro
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| Frontiers Media SA, 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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MEMS Packaging Technologies and 3D Integration
| MEMS Packaging Technologies and 3D Integration |
| Autore | Seok Seonho |
| Pubbl/distr/stampa | MDPI - Multidisciplinary Digital Publishing Institute, 2022 |
| Descrizione fisica | 1 online resource (210 p.) |
| Soggetto topico |
Biology, life sciences
Research & information: general |
| Soggetto non controllato |
adhesion
Au film thickness Au-Au bonding biocompatible packaging capacitive micromachined ultrasound transducers (CMUT) chronic implantation crack propagation deflection angle equivalent circuit model fan-out wafer-level package fan-out wafer-level packaging (FOWLP) FEM finite difference time domain finite element finite element analysis Finite element method (FEM) fuzzy AHP fuzzy VIKOR glass substrate heterogeneous integration implantable inkjet printing integrated nanostructure-multilayer reactive system low-temperature MEMS packaging MCDM MEMS and IC integration MEMS resonator metal direct bonding microbump microelectromechanical systems (MEMS) packaging microsystem integration millimeter-wave multilayer reactive bonding n/a neural interface neural probe Ni/Al reactive multilayer system optical and electromagnetics simulations packaging-on-packaging parylene Pd/Al reactive multilayer system polymer packaging redistribution layers redundant TSV reliability reliability life room-temperature bonding S-parameters extraction scotch tape test self-propagating exothermic reaction simulation spontaneous self-ignition stress intensity factor (SIF) surface activated bonding surface roughness technology evaluation temperature coefficient thermal sensors thermal stress thin film metal TMOS sensor ultrasonic bonding wafer bonding wafer sealing |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910576876203321 |
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Seok Seonho
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| MDPI - Multidisciplinary Digital Publishing Institute, 2022 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Neural Microelectrodes : : Design and Applications / / Stuart Cogan, Joseph Pancrazio
| Neural Microelectrodes : : Design and Applications / / Stuart Cogan, Joseph Pancrazio |
| Autore | Cogan Stuart |
| Pubbl/distr/stampa | MDPI - Multidisciplinary Digital Publishing Institute, 2019 |
| Descrizione fisica | 1 electronic resource (378 p.) |
| Soggetto topico | History of engineering and technology |
| Soggetto non controllato |
closed-loop
in vivo imaging education thermoresistance neural probe electroless plating neural stimulation and recording peripheral nerve stimulation shape-memory-polymer artifact sensor interface magnetic coupling neuroprosthetics intracortical implant µECoG neural interfaces implantable electrochemistry shape memory polymer neuroscience micromachine microelectromechanical systems stiffness Parylene C intracranial electrodes chronic implantation neural interfacing microelectrodes multiplexing microstimulators freely-behaving windowed integration sampling system-on-chip brain-machine interfaces insertion force microelectrode array vagus nerve diversity micro-electromechanical systems (MEMS) technologies mixed-signal feedback temperature monitoring foreign body reaction peripheral nerves brain-computer interface multi-disciplinary neurotechnology photolithography micro-electrocorticography robust microelectrode conscious recording electrode array dopamine softening sciatic nerve bio-inspired neural prostheses neuroscientific research bidirectional LED chip microfluidic device electrode-tissue interface impedance intracortical silicon carbide three-dimensional bias micro-electromechanical systems (MEMS) silicon neural probes electrode degradation chronic microelectrode biocompatibility optogenetics fast-scan cyclic voltammetry (FSCV) glial encapsulation deep brain stimulation electrocorticography electrophysiology fast scan cyclic voltammetry precision medicine microfabrication BRAIN Initiative polymer magnetic resonance imaging polymer nanocomposite liquid crystal elastomer silicon probe training tissue response graphene electrode glassy carbon electrode immune response electrode implantation dextran immunohistochemistry neural interface response amorphous silicon carbide Utah electrode arrays neural amplifier neural electrode array neuromodulation in vivo electrophysiology neuronal recordings neural recording ECoG gene modification neural interface wireless enteric nervous system cellulose nanocrystals |
| ISBN |
9783039213207
3039213202 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910367568503321 |
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Cogan Stuart
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| MDPI - Multidisciplinary Digital Publishing Institute, 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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SiC based Miniaturized Devices
| SiC based Miniaturized Devices |
| Pubbl/distr/stampa | Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2020 |
| Descrizione fisica | 1 online resource (170 p.) |
| Soggetto topico | History of engineering and technology |
| Soggetto non controllato |
3C-SiC
4H-SiC 4H-SiC, epitaxial layer 6H-SiC aluminum nitride amorphous SiC Berkovich indenter bulge test bulk micromachining circular membrane cleavage strength critical depth of cut critical load deep level transient spectroscopy (DLTS) deformation doped SiC electrochemical characterization electrochemical etching electron beam induced current spectroscopy (EBIC) epitaxial growth FEM grazing incidence X-ray diffraction (GIXRD) high-power impulse magnetron sputtering (HiPIMS) high-temperature converters indentation material removal mechanisms MEA mechanical properties MEMS devices MESFET microelectrode array microstrip detector n-type n/a nanoscratching negative gate-source voltage spike neural implant neural interface neural probe p-type PAE point defects power electronics power module pulse height spectroscopy (PHS) radiation detector Raman spectroscopy residual stress Rutherford backscattering spectrometry (RBS) Schottky barrier semiconductor radiation detector SiC SiC power electronic devices silicon carbide simulation thermally stimulated current spectroscopy (TSC) thin film vibrometry Young's modulus |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910557498703321 |
| Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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