"3D" Parametric and Nonparametric Description of Surface Topography in Manufacturing Processes |
Autore | Królczyk Grzegorz |
Pubbl/distr/stampa | Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021 |
Descrizione fisica | 1 electronic resource (337 p.) |
Soggetto topico | Technology: general issues |
Soggetto non controllato |
profile
two-process surface correlation length austenitization cryogenic microstructure microhardness abrasive wear tempering thermoplastic polyurethane heat-welded V-belt IR thermography hardness surface roughness SEM morphology optical microscopy machining sintered aluminum 3D surface roughness parameters surface defects contact profilometry surface topography thermal disturbance thermal expansion thermal chamber micro turning material removal rate RSM Ti6Al4V alloy tool wear surface texture anisotropy multiscale roping ridging topography autocorrelation function roughness EDM craters multiscale analysis microgeometry bimodal distribution material ratio parameters fiber-reinforced polymers automated fiber placement path planning abrasive water jet machining cutting kerf soda-lime glass radius of the cutting head trajectory quality contact mechanics equivalent sum rough surface β-phase TNTZ alloy nano-finishing magnetic abrasive finishing material removal optimization parametric appraisal circulated coins surface condition optical methods measurements and analysis mechanical engineering roughness analysis high-efficiency video coding (HEVC) texture feature descriptors texture image classification support vector machine (SVM) electroplated grinding wheel grinding wheel wear grinding wheel surface texture |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910557334003321 |
Królczyk Grzegorz
![]() |
||
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021 | ||
![]() | ||
Lo trovi qui: Univ. Federico II | ||
|
Symmetry in Mechanical Engineering |
Autore | Glowacz Adam |
Pubbl/distr/stampa | Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2020 |
Descrizione fisica | 1 electronic resource (372 p.) |
Soggetto topico | History of engineering & technology |
Soggetto non controllato |
traveling waves
vibration stability self-excited vibration thin spur gear variational mode decomposition signal analysis time-frequency analysis center frequency method of double thresholds Hilbert transform finite-time control terminal sliding mode chattering neural network thin-walled structures higher-order deformation modes identification doubly symmetric cross-sections shell-like deformation dual mass flywheel absolute sensitivity relative sensitivity torsional vibration spring Dempster's rule evidence distance pattern recognition maritime surveillance customer needs bad parameters core problems design process conceptual design time-varying P-type IL method MFA control imprecise probability active control piezoelectric cantilever plate image processing particle distribution rolling bearings Fault diagnosis second-order tristable stochastic resonance seeker optimization algorithm output signal-to-noise ratio global optimization meta-heuristic butterfly optimization algorithm cross-entropy method engineering design problems grinding rheology breakage parameters relative viscosity tool wear state CNN BiLSTM attention mechanism signal features vibrations symmetries two-engine vehicle rear clutch front clutch vibration modes granulation on-line monitoring fertilizers parallel robot minimally invasive procedures algebraic modeling Study parameters fractional damping vibration dynamic behaviour hybrid mechanism helicopter abrasive belt grinding predictive model regression material removal electric vehicles PMSM auxiliary slot response surface methodology |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910557134803321 |
Glowacz Adam
![]() |
||
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2020 | ||
![]() | ||
Lo trovi qui: Univ. Federico II | ||
|