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MEMS Packaging Technologies and 3D Integration
| MEMS Packaging Technologies and 3D Integration |
| Autore | Seok Seonho |
| Pubbl/distr/stampa | MDPI - Multidisciplinary Digital Publishing Institute, 2022 |
| Descrizione fisica | 1 online resource (210 p.) |
| Soggetto topico |
Biology, life sciences
Research & information: general |
| Soggetto non controllato |
adhesion
Au film thickness Au-Au bonding biocompatible packaging capacitive micromachined ultrasound transducers (CMUT) chronic implantation crack propagation deflection angle equivalent circuit model fan-out wafer-level package fan-out wafer-level packaging (FOWLP) FEM finite difference time domain finite element finite element analysis Finite element method (FEM) fuzzy AHP fuzzy VIKOR glass substrate heterogeneous integration implantable inkjet printing integrated nanostructure-multilayer reactive system low-temperature MEMS packaging MCDM MEMS and IC integration MEMS resonator metal direct bonding microbump microelectromechanical systems (MEMS) packaging microsystem integration millimeter-wave multilayer reactive bonding n/a neural interface neural probe Ni/Al reactive multilayer system optical and electromagnetics simulations packaging-on-packaging parylene Pd/Al reactive multilayer system polymer packaging redistribution layers redundant TSV reliability reliability life room-temperature bonding S-parameters extraction scotch tape test self-propagating exothermic reaction simulation spontaneous self-ignition stress intensity factor (SIF) surface activated bonding surface roughness technology evaluation temperature coefficient thermal sensors thermal stress thin film metal TMOS sensor ultrasonic bonding wafer bonding wafer sealing |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910576876203321 |
Seok Seonho
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| MDPI - Multidisciplinary Digital Publishing Institute, 2022 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Silicon Photonics Bloom
| Silicon Photonics Bloom |
| Autore | Boyraz Ozdal |
| Pubbl/distr/stampa | Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2020 |
| Descrizione fisica | 1 online resource (184 p.) |
| Soggetto topico | History of engineering and technology |
| Soggetto non controllato |
amorphous silicon oxycarbide
Bragg gratings carrier plasma chemical vapor deposition defect dispersion control electrostatic actuator frequency combs germanium heterogeneous integration integrated optics integrated photonics integrated polarimeter integrated silicon photonic circuits light emitting diode Mach-Zehnder interferometers micro-platform microelectromechanical systems (MEMS) mode-locked lasers modulator multimode interferometer n/a nanophononics nitrogen doping nonlinear optics off-chip coupling optical interconnects optical switch optical waveguide optoelectronics parallel plate actuation phase change material photoconductivity photoluminescence photonic processors photonics integrated circuit physical vapor deposition plasma enhanced chemical vapor deposition polarisation controller polarisation multiplexing polarisation shift keying quantum dot second-harmonic generation silicon nanocrystals silicon nitride photonics silicon optical modulator silicon oxynitride silicon photonics Silicon Photonics silicon-on-insulator (SOI) supercontinuum terahertz thin film unitary transformation vertical grating coupler WDM transmitter |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910557287403321 |
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Boyraz Ozdal
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| Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Wide Bandgap Based Devices: Design, Fabrication and Applications, Volume II
| Wide Bandgap Based Devices: Design, Fabrication and Applications, Volume II |
| Autore | Verzellesi Giovanni |
| Pubbl/distr/stampa | Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022 |
| Descrizione fisica | 1 online resource (320 p.) |
| Soggetto topico |
Energy industries and utilities
History of engineering and technology Technology: general issues |
| Soggetto non controllato |
2DEG
AlGaN/GaN AlGaN/GaN heterojunction AlGaN/GaN heterostructures AlN AlN buffer layer aluminum nitride annealing temperature auto-compensation band structure bias stability blue and yellow luminescence breakdown field breakdown voltage buffer layer carbon doping charge traps compensation ratio crystal growth crystallite size cubic and hexagonal structure current collapse density functional theory density of states digital signal processor driving technology dry processing electrochromic device electron lifetime energy storage system equivalent-circuit modeling fabrication first-principles gallium nitride gallium nitride (GaN) GaN GaN power HEMTs GaN-based LED GaN-HEMT mesa structures gate bias modulation heterogeneous integration high electron mobility transistor high electron mobility transistor (HEMT) high electron-mobility transistor (HEMT) high-electron mobility devices high-electron mobility transistor high-temperature HTA HVPE indium oxide thin film laser micromachining laser processing laser thermal separation low defect density low-resistance SiC substrate magnetron sputtering metal-oxide-semiconductor field effect transistor (MOSFET) microwave frequency MIS-HEMTs n/a NH3 growth interruption nickel oxide nitridation nitrogen dioxide gas sensor noise non-polar normally off optical absorption optical band gap p-GaN gate p-GaN gate HEMT p-type doping palladium catalyst photovoltaic module piezoelectric micromachined ultrasonic transducers plasma surface treatment polar power conditioning system pure β-Ga2O3 QST radio frequency radio frequency sputtering ranging rectifying electrode sapphire scattering-parameter measurements Schottky barrier diode Schottky barrier diodes semi-polar SiC silicon carbide silicon carbide (SiC) SOI solution method Sr-doped β-Ga2O3 stealth dicing strain relaxation supercritical technology synchronous buck converter temperature threshold voltage stability time of flight (TOF) time to digital converter circuit (TDC) unidirectional operation vanadium redox flow batteries wafer dicing wide bandgap semiconductor wide-bandgap (WBG) X-ray diffraction X-ray imaging X-ray photoelectron spectroscopy X-ray sensor |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | Wide Bandgap Based Devices |
| Record Nr. | UNINA-9910576886103321 |
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Verzellesi Giovanni
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| Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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