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MEMS Packaging Technologies and 3D Integration
| MEMS Packaging Technologies and 3D Integration |
| Autore | Seok Seonho |
| Pubbl/distr/stampa | MDPI - Multidisciplinary Digital Publishing Institute, 2022 |
| Descrizione fisica | 1 online resource (210 p.) |
| Soggetto topico |
Biology, life sciences
Research & information: general |
| Soggetto non controllato |
adhesion
Au film thickness Au-Au bonding biocompatible packaging capacitive micromachined ultrasound transducers (CMUT) chronic implantation crack propagation deflection angle equivalent circuit model fan-out wafer-level package fan-out wafer-level packaging (FOWLP) FEM finite difference time domain finite element finite element analysis Finite element method (FEM) fuzzy AHP fuzzy VIKOR glass substrate heterogeneous integration implantable inkjet printing integrated nanostructure-multilayer reactive system low-temperature MEMS packaging MCDM MEMS and IC integration MEMS resonator metal direct bonding microbump microelectromechanical systems (MEMS) packaging microsystem integration millimeter-wave multilayer reactive bonding n/a neural interface neural probe Ni/Al reactive multilayer system optical and electromagnetics simulations packaging-on-packaging parylene Pd/Al reactive multilayer system polymer packaging redistribution layers redundant TSV reliability reliability life room-temperature bonding S-parameters extraction scotch tape test self-propagating exothermic reaction simulation spontaneous self-ignition stress intensity factor (SIF) surface activated bonding surface roughness technology evaluation temperature coefficient thermal sensors thermal stress thin film metal TMOS sensor ultrasonic bonding wafer bonding wafer sealing |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910576876203321 |
Seok Seonho
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| MDPI - Multidisciplinary Digital Publishing Institute, 2022 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Sustainable Industrial Engineering along Product-Service Life Cycle/Supply Chain
| Sustainable Industrial Engineering along Product-Service Life Cycle/Supply Chain |
| Autore | Matias João Carlos de Oliveira |
| Pubbl/distr/stampa | Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021 |
| Descrizione fisica | 1 online resource (474 p.) |
| Soggetto topico | Technology: general issues |
| Soggetto non controllato |
3D printing
additive manufacturing ammunition incineration and social ANP applications Bayesian approach beta-binomial distribution blockchain cap-and-trade carbon credit carbon emissions reduction circular economy collaboration collection strategy comparative index complexity conjugacy consumers' environmental preferences cross-country analysis demand uncertainty DEMATEL down-cycling eco-efficiency eco-industrial parks economic education energetic material recycling energy intensity environmental environmental cost accounting equipment development task evolution mechanism evolutionary game theory express delivery service finite population foreseeable rework fuzzy VIKOR game model green degree green supply chain hidden rework human factor in JIT hybrid information aggregation income indicators industrial ecology industrial symbiosis Industry 4.0 information and communication technologies IVTFN JIT implementation last mile delivery Lean Manufacturing life-cycle assessment market share material flow memetic algorithm metrics Monte-Carlo based sample average approximation method multi-choice goal programming multi-objective linear programming newsvendor model one-shot devices operational benefits potential industrial symbiosis pricing product life cycle production pulp and paper industry pyrolysis quality level rapid prototyping real case study recycling investment strategy reliability demonstration test research methods reverse supply chain reward-penalty mechanism scientific production sequential sampling single- and multi-objective optimization method social change social impacts software application solid waste Stochastic nonlinear Programming structural equation model structure equations modeling suppliers in JIT supply chain sustainability sustainability design constraint sustainable global supply chain sustainable supplier selection sustainable supply chain management TBL theory uncertainty update and sustainable use cases vendor selection waste mobile phones |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910557504003321 |
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Matias João Carlos de Oliveira
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| Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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