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MEMS Packaging Technologies and 3D Integration
| MEMS Packaging Technologies and 3D Integration |
| Autore | Seok Seonho |
| Pubbl/distr/stampa | MDPI - Multidisciplinary Digital Publishing Institute, 2022 |
| Descrizione fisica | 1 electronic resource (210 p.) |
| Soggetto topico |
Research & information: general
Biology, life sciences |
| Soggetto non controllato |
heterogeneous integration
wafer bonding wafer sealing room-temperature bonding Au-Au bonding surface activated bonding Au film thickness surface roughness microelectromechanical systems (MEMS) packaging inkjet printing redistribution layers capacitive micromachined ultrasound transducers (CMUT) fan-out wafer-level packaging (FOWLP) adhesion thin film metal parylene neural probe scotch tape test FEM MEMS resonator temperature coefficient thermal stress millimeter-wave redundant TSV equivalent circuit model S-parameters extraction technology evaluation MEMS and IC integration MCDM fuzzy AHP fuzzy VIKOR fan-out wafer-level package finite element glass substrate reliability life packaging-on-packaging thermal sensors TMOS sensor finite difference time domain optical and electromagnetics simulations finite element analysis ultrasonic bonding metal direct bonding microsystem integration biocompatible packaging implantable reliability Finite element method (FEM) simulation multilayer reactive bonding integrated nanostructure-multilayer reactive system spontaneous self-ignition self-propagating exothermic reaction Pd/Al reactive multilayer system Ni/Al reactive multilayer system low-temperature MEMS packaging crack propagation microbump deflection angle stress intensity factor (SIF) polymer packaging neural interface chronic implantation |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910576876203321 |
Seok Seonho
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| MDPI - Multidisciplinary Digital Publishing Institute, 2022 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Sustainable Industrial Engineering along Product-Service Life Cycle/Supply Chain
| Sustainable Industrial Engineering along Product-Service Life Cycle/Supply Chain |
| Autore | Matias João Carlos de Oliveira |
| Pubbl/distr/stampa | Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021 |
| Descrizione fisica | 1 electronic resource (474 p.) |
| Soggetto topico | Technology: general issues |
| Soggetto non controllato |
information and communication technologies
green supply chain update and sustainable sustainability green degree game model sustainable supplier selection DEMATEL ANP fuzzy VIKOR IVTFN hybrid information aggregation TBL theory energy intensity income education eco-efficiency circular economy equipment development task foreseeable rework hidden rework uncertainty complexity blockchain supply chain use cases applications quality level reliability demonstration test Bayesian approach conjugacy beta-binomial distribution sequential sampling one-shot devices finite population express delivery service last mile delivery pricing collaboration market share reverse supply chain collection strategy waste mobile phones evolutionary game theory evolution mechanism reward-penalty mechanism ammunition incineration down-cycling energetic material recycling industrial ecology life-cycle assessment cap-and-trade production carbon emissions reduction consumers’ environmental preferences newsvendor model Lean Manufacturing Industry 4.0 economic environmental and social structure equations modeling sustainable global supply chain single- and multi-objective optimization method sustainability design constraint software application real case study pulp and paper industry comparative index cross-country analysis JIT implementation suppliers in JIT operational benefits human factor in JIT material flow structural equation model carbon credit environmental cost accounting pyrolysis solid waste vendor selection product life cycle multi-objective linear programming multi-choice goal programming additive manufacturing social change social impacts 3D printing rapid prototyping recycling investment strategy demand uncertainty Stochastic nonlinear Programming Monte-Carlo based sample average approximation method memetic algorithm industrial symbiosis potential industrial symbiosis eco-industrial parks sustainable supply chain management research methods scientific production metrics indicators |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910557504003321 |
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Matias João Carlos de Oliveira
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| Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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