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Design and Applications of Additive Manufacturing and 3D Printing



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Autore: Salmi Mika Visualizza persona
Titolo: Design and Applications of Additive Manufacturing and 3D Printing Visualizza cluster
Pubblicazione: Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Descrizione fisica: 1 electronic resource (104 p.)
Soggetto topico: Technology: general issues
History of engineering & technology
Soggetto non controllato: additive manufacturing
modular design
design-for-manufacturability
design optimization
part consolidation
product re-design
topology optimization
design for additive manufacturing
3D printing
aerospace
full-life cycle manufacturing flow
airfoil
carbon fiber tubes
telescoping spars
chevrons
porous scaffold design
tetrahedral implicit surface modeling
triply periodic minimal surface
selective laser melting (SLM)
Ti6Al4V
structure-property relationship
microstructure
Hall-Petch relationship
Persona (resp. second.): SalmiMika
Sommario/riassunto: Additive manufacturing (AM), more commonly known as 3D printing, has grown trememdously in recent years. It has shown its potential uses in the medical, automotive, aerospace, and spare part sectors. Personal manufacturing, complex and optimized parts, short series manufacturing, and local on-demand manufacturing are just some of its current benefits. The development of new materials and equipment has opened up new application possibilities, and equipment is quicker and cheaper to use when utilizing the new materials launched by vendors and material developers. AM has become more critical for the industry but also for academics. Since AM offers more design freedom than any other manufacturing process, it provides designers with the challenge of designing better and more efficient products.
Titolo autorizzato: Design and Applications of Additive Manufacturing and 3D Printing  Visualizza cluster
Formato: Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione: Inglese
Record Nr.: 9910566461303321
Lo trovi qui: Univ. Federico II
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