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Computational Intelligence for Modeling, Control, Optimization, Forecasting and Diagnostics in Photovoltaic Applications
| Computational Intelligence for Modeling, Control, Optimization, Forecasting and Diagnostics in Photovoltaic Applications |
| Autore | Vitelli Massimo |
| Pubbl/distr/stampa | Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2020 |
| Descrizione fisica | 1 online resource (280 p.) |
| Soggetto topico | History of engineering and technology |
| Soggetto non controllato |
adaptive neuro-fuzzy inference systems
ANFIS artificial neural network artificial neural networks clear sky irradiance clustering-based PV fault detection COA complex network analysis data fusion deterioration deterministic optimization algorithm diffractive grating diffractive optical element double flames generation (DFG) strategy duty cycle environmental parameters fault prognosis feed-forward neural networks finite difference time domain genetic algorithm global horizontal irradiance global optimization gradient descent hot spot image processing implicit model solution integrated energy systems linear approximation long short-term memory LSTM cell machine learning mathematical modeling maximum power point tracking metaheuristic optimization algorithm moth-flame optimization MPPT algorithm multiple regression model national power system optical modelling parameter extraction partial shading particle swarm optimization-artificial neural networks performances evaluation persistent predictor photovoltaic array photovoltaic model photovoltaic module photovoltaic plants photovoltaic power prediction photovoltaic system photovoltaic systems photovoltaics publicly available weather reports PV fleet PV power prediction PVs power output forecasting recurrent neural networks renewable energy self-imputation sensor network series-parallel single stage grid connected systems single-diode model smart energy management solar cell optimization Solar cell parameters solar concentrator solar irradiation spectral beam splitting statistical method sustainable development thermal image two-diode model unsupervised learning |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910557297703321 |
Vitelli Massimo
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| Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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MEMS Packaging Technologies and 3D Integration
| MEMS Packaging Technologies and 3D Integration |
| Autore | Seok Seonho |
| Pubbl/distr/stampa | MDPI - Multidisciplinary Digital Publishing Institute, 2022 |
| Descrizione fisica | 1 online resource (210 p.) |
| Soggetto topico |
Biology, life sciences
Research & information: general |
| Soggetto non controllato |
adhesion
Au film thickness Au-Au bonding biocompatible packaging capacitive micromachined ultrasound transducers (CMUT) chronic implantation crack propagation deflection angle equivalent circuit model fan-out wafer-level package fan-out wafer-level packaging (FOWLP) FEM finite difference time domain finite element finite element analysis Finite element method (FEM) fuzzy AHP fuzzy VIKOR glass substrate heterogeneous integration implantable inkjet printing integrated nanostructure-multilayer reactive system low-temperature MEMS packaging MCDM MEMS and IC integration MEMS resonator metal direct bonding microbump microelectromechanical systems (MEMS) packaging microsystem integration millimeter-wave multilayer reactive bonding n/a neural interface neural probe Ni/Al reactive multilayer system optical and electromagnetics simulations packaging-on-packaging parylene Pd/Al reactive multilayer system polymer packaging redistribution layers redundant TSV reliability reliability life room-temperature bonding S-parameters extraction scotch tape test self-propagating exothermic reaction simulation spontaneous self-ignition stress intensity factor (SIF) surface activated bonding surface roughness technology evaluation temperature coefficient thermal sensors thermal stress thin film metal TMOS sensor ultrasonic bonding wafer bonding wafer sealing |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910576876203321 |
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Seok Seonho
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| MDPI - Multidisciplinary Digital Publishing Institute, 2022 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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