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Computational Methods for Fatigue and Fracture
Computational Methods for Fatigue and Fracture
Autore Branco Ricardo
Pubbl/distr/stampa MDPI - Multidisciplinary Digital Publishing Institute, 2022
Descrizione fisica 1 online resource (144 p.)
Soggetto topico History of engineering & technology
Technology: general issues
Soggetto non controllato ANSYS mechanical
critical load
critical plane
design flaws
fatigue crack growth
fatigue failure
fatigue life
fatigue life prediction
FEM
finite element method
Finite Element Model
fracture
gears
hinge kit system
lead crowning modifications
LEFM
material characterization
mechanical system
mesh density
meshing errors
metal casting
mixed mode stress intensity factors
mold design
multiaxial fatigue
n/a
optimization
parametric ALT
reliability
simulation
Single Tooth Bending Fatigue
smart crack growth
STBF
stress intensity factors
Taguchi method
theory of critical distances
tooth profile deviations
tooth surface contact stress
tubular cantilever beam
U-notch
XFEM
ISBN 3-0365-5300-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910619470603321
Branco Ricardo  
MDPI - Multidisciplinary Digital Publishing Institute, 2022
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
SiC based Miniaturized Devices
SiC based Miniaturized Devices
Pubbl/distr/stampa Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2020
Descrizione fisica 1 online resource (170 p.)
Soggetto topico History of engineering and technology
Soggetto non controllato 3C-SiC
4H-SiC
4H-SiC, epitaxial layer
6H-SiC
aluminum nitride
amorphous SiC
Berkovich indenter
bulge test
bulk micromachining
circular membrane
cleavage strength
critical depth of cut
critical load
deep level transient spectroscopy (DLTS)
deformation
doped SiC
electrochemical characterization
electrochemical etching
electron beam induced current spectroscopy (EBIC)
epitaxial growth
FEM
grazing incidence X-ray diffraction (GIXRD)
high-power impulse magnetron sputtering (HiPIMS)
high-temperature converters
indentation
material removal mechanisms
MEA
mechanical properties
MEMS devices
MESFET
microelectrode array
microstrip detector
n-type
n/a
nanoscratching
negative gate-source voltage spike
neural implant
neural interface
neural probe
p-type
PAE
point defects
power electronics
power module
pulse height spectroscopy (PHS)
radiation detector
Raman spectroscopy
residual stress
Rutherford backscattering spectrometry (RBS)
Schottky barrier
semiconductor radiation detector
SiC
SiC power electronic devices
silicon carbide
simulation
thermally stimulated current spectroscopy (TSC)
thin film
vibrometry
Young's modulus
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910557498703321
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2020
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui