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MEMS Packaging Technologies and 3D Integration
MEMS Packaging Technologies and 3D Integration
Autore Seok Seonho
Pubbl/distr/stampa MDPI - Multidisciplinary Digital Publishing Institute, 2022
Descrizione fisica 1 electronic resource (210 p.)
Soggetto topico Research & information: general
Biology, life sciences
Soggetto non controllato heterogeneous integration
wafer bonding
wafer sealing
room-temperature bonding
Au-Au bonding
surface activated bonding
Au film thickness
surface roughness
microelectromechanical systems (MEMS) packaging
inkjet printing
redistribution layers
capacitive micromachined ultrasound transducers (CMUT)
fan-out wafer-level packaging (FOWLP)
adhesion
thin film metal
parylene
neural probe
scotch tape test
FEM
MEMS resonator
temperature coefficient
thermal stress
millimeter-wave
redundant TSV
equivalent circuit model
S-parameters extraction
technology evaluation
MEMS and IC integration
MCDM
fuzzy AHP
fuzzy VIKOR
fan-out wafer-level package
finite element
glass substrate
reliability life
packaging-on-packaging
thermal sensors
TMOS sensor
finite difference time domain
optical and electromagnetics simulations
finite element analysis
ultrasonic bonding
metal direct bonding
microsystem integration
biocompatible packaging
implantable
reliability
Finite element method (FEM)
simulation
multilayer reactive bonding
integrated nanostructure-multilayer reactive system
spontaneous self-ignition
self-propagating exothermic reaction
Pd/Al reactive multilayer system
Ni/Al reactive multilayer system
low-temperature MEMS packaging
crack propagation
microbump
deflection angle
stress intensity factor (SIF)
polymer packaging
neural interface
chronic implantation
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910576876203321
Seok Seonho  
MDPI - Multidisciplinary Digital Publishing Institute, 2022
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Neural Microelectrodes: Design and Applications
Neural Microelectrodes: Design and Applications
Autore Pancrazio Joseph
Pubbl/distr/stampa MDPI - Multidisciplinary Digital Publishing Institute, 2019
Descrizione fisica 1 electronic resource (378 p.)
Soggetto non controllato closed-loop
in vivo imaging
education
thermoresistance
neural probe
electroless plating
neural stimulation and recording
peripheral nerve stimulation
shape-memory-polymer
artifact
sensor interface
magnetic coupling
neuroprosthetics
intracortical implant
µECoG
neural interfaces
implantable
electrochemistry
shape memory polymer
neuroscience
micromachine
microelectromechanical systems
stiffness
Parylene C
intracranial electrodes
chronic implantation
neural interfacing
microelectrodes
multiplexing
microstimulators
freely-behaving
windowed integration sampling
system-on-chip
brain-machine interfaces
insertion force
microelectrode array
vagus nerve
diversity
micro-electromechanical systems (MEMS) technologies
mixed-signal feedback
temperature monitoring
foreign body reaction
peripheral nerves
brain-computer interface
multi-disciplinary
neurotechnology
photolithography
micro-electrocorticography
robust microelectrode
conscious recording
electrode array
dopamine
softening
sciatic nerve
bio-inspired
neural prostheses
neuroscientific research
bidirectional
LED chip
microfluidic device
electrode-tissue interface
impedance
intracortical
silicon carbide
three-dimensional
bias
micro-electromechanical systems (MEMS)
silicon neural probes
electrode degradation
chronic
microelectrode
biocompatibility
optogenetics
fast-scan cyclic voltammetry (FSCV)
glial encapsulation
deep brain stimulation
electrocorticography
electrophysiology
fast scan cyclic voltammetry
precision medicine
microfabrication
BRAIN Initiative
polymer
magnetic resonance imaging
polymer nanocomposite
liquid crystal elastomer
silicon probe
training
tissue response
graphene
electrode
glassy carbon electrode
immune response
electrode implantation
dextran
immunohistochemistry
neural interface response
amorphous silicon carbide
Utah electrode arrays
neural amplifier
neural electrode array
neuromodulation
in vivo electrophysiology
neuronal recordings
neural recording
ECoG
gene modification
neural interface
wireless
enteric nervous system
cellulose nanocrystals
ISBN 3-03921-320-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti Neural Microelectrodes
Record Nr. UNINA-9910367568503321
Pancrazio Joseph  
MDPI - Multidisciplinary Digital Publishing Institute, 2019
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui