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Fundamentals and Recent Advances in Epitaxial Graphene on SiC
Fundamentals and Recent Advances in Epitaxial Graphene on SiC
Autore Yakimova Rositsa
Pubbl/distr/stampa Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Descrizione fisica 1 online resource (94 p.)
Soggetto topico Technology: general issues
Soggetto non controllato 2D peak line shape
3C-SiC on Si
AFM
atomic layer deposition
buffer layer
carrier concentration
charge density
chronoamperometry
copper
deposition
DFT
electrodeposition
electronic properties
epitaxial graphene
epitaxial graphene on SiC
flat band
free charge carrier properties
G peak
graphene
high-k insulators
high-temperature sublimation
intercalation
ion implantation
material engineering
mobility
monolayer graphene
quasi-free-standing graphene
Raman
Raman spectroscopy
redox reaction
SiC
silicon carbide
strain
sublimation
substrate interaction
surface functionalization
terahertz optical Hall effect
twisted bilayer graphene
twistronics
voltammetry
XPS
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910557896703321
Yakimova Rositsa  
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Wide Bandgap Based Devices: Design, Fabrication and Applications, Volume II
Wide Bandgap Based Devices: Design, Fabrication and Applications, Volume II
Autore Verzellesi Giovanni
Pubbl/distr/stampa Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Descrizione fisica 1 online resource (320 p.)
Soggetto topico Energy industries and utilities
History of engineering and technology
Technology: general issues
Soggetto non controllato 2DEG
AlGaN/GaN
AlGaN/GaN heterojunction
AlGaN/GaN heterostructures
AlN
AlN buffer layer
aluminum nitride
annealing temperature
auto-compensation
band structure
bias stability
blue and yellow luminescence
breakdown field
breakdown voltage
buffer layer
carbon doping
charge traps
compensation ratio
crystal growth
crystallite size
cubic and hexagonal structure
current collapse
density functional theory
density of states
digital signal processor
driving technology
dry processing
electrochromic device
electron lifetime
energy storage system
equivalent-circuit modeling
fabrication
first-principles
gallium nitride
gallium nitride (GaN)
GaN
GaN power HEMTs
GaN-based LED
GaN-HEMT mesa structures
gate bias modulation
heterogeneous integration
high electron mobility transistor
high electron mobility transistor (HEMT)
high electron-mobility transistor (HEMT)
high-electron mobility devices
high-electron mobility transistor
high-temperature
HTA
HVPE
indium oxide thin film
laser micromachining
laser processing
laser thermal separation
low defect density
low-resistance SiC substrate
magnetron sputtering
metal-oxide-semiconductor field effect transistor (MOSFET)
microwave frequency
MIS-HEMTs
n/a
NH3 growth interruption
nickel oxide
nitridation
nitrogen dioxide gas sensor
noise
non-polar
normally off
optical absorption
optical band gap
p-GaN gate
p-GaN gate HEMT
p-type doping
palladium catalyst
photovoltaic module
piezoelectric micromachined ultrasonic transducers
plasma surface treatment
polar
power conditioning system
pure β-Ga2O3
QST
radio frequency
radio frequency sputtering
ranging
rectifying electrode
sapphire
scattering-parameter measurements
Schottky barrier diode
Schottky barrier diodes
semi-polar
SiC
silicon carbide
silicon carbide (SiC)
SOI
solution method
Sr-doped β-Ga2O3
stealth dicing
strain relaxation
supercritical technology
synchronous buck converter
temperature
threshold voltage stability
time of flight (TOF)
time to digital converter circuit (TDC)
unidirectional operation
vanadium redox flow batteries
wafer dicing
wide bandgap semiconductor
wide-bandgap (WBG)
X-ray diffraction
X-ray imaging
X-ray photoelectron spectroscopy
X-ray sensor
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti Wide Bandgap Based Devices
Record Nr. UNINA-9910576886103321
Verzellesi Giovanni  
Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Wide Bandgap Semiconductor Based Micro/Nano Devices / Jung-Hun Seo
Wide Bandgap Semiconductor Based Micro/Nano Devices / Jung-Hun Seo
Autore Seo Jung-Hun
Pubbl/distr/stampa MDPI - Multidisciplinary Digital Publishing Institute, 2019
Descrizione fisica 1 electronic resource (138 p.)
Soggetto topico History of engineering and technology
Soggetto non controllato ohmic contact
MESFET
optical band gap
wide-bandgap semiconductor
annealing temperature
junction termination extension (JTE)
channel length modulation
silicon carbide (SiC)
amorphous InGaZnO (a-IGZO)
light output power
GaN
electrochromism
large signal performance
passivation layer
4H-SiC
positive gate bias stress (PGBS)
asymmetric power combining
ultrahigh upper gate height
high electron mobility transistors
space application
gallium nitride (GaN)
phase balance
edge termination
distributed Bragg reflector
cathode field plate (CFP)
ammonothermal GaN
anode field plate (AFP)
W band
GaN high electron mobility transistor (HEMT)
1T DRAM
growth of GaN
tungsten trioxide film
thin-film transistor (TFT)
micron-sized patterned sapphire substrate
power added efficiency
T-anode
analytical model
AlGaN/GaN
harsh environment
high-temperature operation
amplitude balance
buffer layer
characteristic length
Ku-band
DIBL effect
I-V kink effect
flip-chip light-emitting diodes
high electron mobility transistors (HEMTs)
power amplifier
sidewall GaN
external quantum efficiency
breakdown voltage (BV)
threshold voltage (Vth) stability
regrown contact
AlGaN/GaN HEMT
TCAD
high electron mobility transistor (HEMT)
ISBN 9783038978435
3038978434
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910346846903321
Seo Jung-Hun  
MDPI - Multidisciplinary Digital Publishing Institute, 2019
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui