top

  Info

  • Utilizzare la checkbox di selezione a fianco di ciascun documento per attivare le funzionalità di stampa, invio email, download nei formati disponibili del (i) record.

  Info

  • Utilizzare questo link per rimuovere la selezione effettuata.
Compounds with Polar Metallic Bonding / Constantin Hoch
Compounds with Polar Metallic Bonding / Constantin Hoch
Autore Hoch Constantin
Pubbl/distr/stampa MDPI - Multidisciplinary Digital Publishing Institute, 2019
Descrizione fisica 1 electronic resource (154 p.)
Soggetto topico Chemistry
Soggetto non controllato bonding analyses
coloring problem
X-ray diffraction
magnetism
band structure
group-subgroup
alkaline-earth
Zintl
nitridometalate
structure optimizations
electronic structure
polar intermetallics
polar intermetallic
intermetallic compounds
XPS
Zintl compounds
stannides
total energy
COHP method
symmetry reduction
chemical bond
plumbides
ternary Laves phases
powder diffraction
intermetallics
magnetic properties
Ca14AlSb11
thermoelectric
crystal structure
liquid ammonia
ISBN 9783039210718
3039210718
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910346673903321
Hoch Constantin  
MDPI - Multidisciplinary Digital Publishing Institute, 2019
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Graphene for Electronics
Graphene for Electronics
Autore Kogan Eugene
Pubbl/distr/stampa Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Descrizione fisica 1 electronic resource (180 p.)
Soggetto topico Physics
Soggetto non controllato graphene
scattering
dephasing
relaxation time
band structure
tight-binding model
angle-resolved photoemission
electron scattering
augmented plane waves
nanoscroll
first-principle
Klein tunneling
borophene
Dirac fermions
electric field
valence charge density
image potential
image-plane position
image-potential states
liquid conductor
graphene solution
circulating system
microfluidic channel
temperature
optical power
CVD graphene
polycrystalline
grain size
single-crystalline grain
grain boundary (GB)
GB distribution
sheet resistance
transmission-line model measurement
Bose-Einstein condensation
superfluidity
dipolar exitons
low-dimensional semimetals
electronic transport in graphene
quantum hall effect
ion-selective field-effect transistor
sodium ions
real-time monitoring
mechanochemistry
graphene nanosheets
conductive ink
inkjet printing
printed electronics
ISBN 3-0365-6167-6
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910639992603321
Kogan Eugene  
Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Wide Bandgap Based Devices: Design, Fabrication and Applications, Volume II
Wide Bandgap Based Devices: Design, Fabrication and Applications, Volume II
Autore Verzellesi Giovanni
Pubbl/distr/stampa Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Descrizione fisica 1 online resource (320 p.)
Soggetto topico Energy industries and utilities
History of engineering and technology
Technology: general issues
Soggetto non controllato 2DEG
AlGaN/GaN
AlGaN/GaN heterojunction
AlGaN/GaN heterostructures
AlN
AlN buffer layer
aluminum nitride
annealing temperature
auto-compensation
band structure
bias stability
blue and yellow luminescence
breakdown field
breakdown voltage
buffer layer
carbon doping
charge traps
compensation ratio
crystal growth
crystallite size
cubic and hexagonal structure
current collapse
density functional theory
density of states
digital signal processor
driving technology
dry processing
electrochromic device
electron lifetime
energy storage system
equivalent-circuit modeling
fabrication
first-principles
gallium nitride
gallium nitride (GaN)
GaN
GaN power HEMTs
GaN-based LED
GaN-HEMT mesa structures
gate bias modulation
heterogeneous integration
high electron mobility transistor
high electron mobility transistor (HEMT)
high electron-mobility transistor (HEMT)
high-electron mobility devices
high-electron mobility transistor
high-temperature
HTA
HVPE
indium oxide thin film
laser micromachining
laser processing
laser thermal separation
low defect density
low-resistance SiC substrate
magnetron sputtering
metal-oxide-semiconductor field effect transistor (MOSFET)
microwave frequency
MIS-HEMTs
n/a
NH3 growth interruption
nickel oxide
nitridation
nitrogen dioxide gas sensor
noise
non-polar
normally off
optical absorption
optical band gap
p-GaN gate
p-GaN gate HEMT
p-type doping
palladium catalyst
photovoltaic module
piezoelectric micromachined ultrasonic transducers
plasma surface treatment
polar
power conditioning system
pure β-Ga2O3
QST
radio frequency
radio frequency sputtering
ranging
rectifying electrode
sapphire
scattering-parameter measurements
Schottky barrier diode
Schottky barrier diodes
semi-polar
SiC
silicon carbide
silicon carbide (SiC)
SOI
solution method
Sr-doped β-Ga2O3
stealth dicing
strain relaxation
supercritical technology
synchronous buck converter
temperature
threshold voltage stability
time of flight (TOF)
time to digital converter circuit (TDC)
unidirectional operation
vanadium redox flow batteries
wafer dicing
wide bandgap semiconductor
wide-bandgap (WBG)
X-ray diffraction
X-ray imaging
X-ray photoelectron spectroscopy
X-ray sensor
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti Wide Bandgap Based Devices
Record Nr. UNINA-9910576886103321
Verzellesi Giovanni  
Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui