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Terahertz Technology and Its Applications
Terahertz Technology and Its Applications
Autore Peña Victor Pacheco
Pubbl/distr/stampa Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Descrizione fisica 1 electronic resource (162 p.)
Soggetto topico Research & information: general
Soggetto non controllato W band
Schottky Diode Detectors
ZBD modeling
wire bonding
flip-chip
Terahertz radar
radar cross-section
signal-to-noise ratio
adaptive range gates
cascaded doubler
quadrupler
Schottky varactor
hybrid integrated circuit
terahertz spectroscopy
optical delay line
correction
optical encoder
terahertz spectra
terahertz metrology
bias
sub-harmonic mixer
anti-series
Schottky diode
conversion loss
terahertz wave generation
InGaAs
molecular beam epitaxy
time-domain spectroscopy
photoconductive antenna
open stone relics
hollowing
weathered
preservation of cultural heritage
THz-TDS
rubber
vulcanization
silica dispersion
terahertz imaging
light field imaging
synthetic aperture imaging
image distortion
resolving power
THz detector
rectangular inset-feed patch antenna
catadioptric horn-like lens
CMOS process
resonances
periodic waveguides
reflection phases
topological properties
oscillator
THz
high output power
CMOS
terahertz waves
honeycomb sandwiches
foreign materials
time-of-flight
electric field
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910557366803321
Peña Victor Pacheco  
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Wide Bandgap Semiconductor Based Micro/Nano Devices
Wide Bandgap Semiconductor Based Micro/Nano Devices
Autore Seo Jung-Hun
Pubbl/distr/stampa MDPI - Multidisciplinary Digital Publishing Institute, 2019
Descrizione fisica 1 electronic resource (138 p.)
Soggetto non controllato ohmic contact
MESFET
optical band gap
wide-bandgap semiconductor
annealing temperature
junction termination extension (JTE)
channel length modulation
silicon carbide (SiC)
amorphous InGaZnO (a-IGZO)
light output power
GaN
electrochromism
large signal performance
passivation layer
4H-SiC
positive gate bias stress (PGBS)
asymmetric power combining
ultrahigh upper gate height
high electron mobility transistors
space application
gallium nitride (GaN)
phase balance
edge termination
distributed Bragg reflector
cathode field plate (CFP)
ammonothermal GaN
anode field plate (AFP)
W band
GaN high electron mobility transistor (HEMT)
1T DRAM
growth of GaN
tungsten trioxide film
thin-film transistor (TFT)
micron-sized patterned sapphire substrate
power added efficiency
T-anode
analytical model
AlGaN/GaN
harsh environment
high-temperature operation
amplitude balance
buffer layer
characteristic length
Ku-band
DIBL effect
I-V kink effect
flip-chip light-emitting diodes
high electron mobility transistors (HEMTs)
power amplifier
sidewall GaN
external quantum efficiency
breakdown voltage (BV)
threshold voltage (Vth) stability
regrown contact
AlGaN/GaN HEMT
TCAD
high electron mobility transistor (HEMT)
ISBN 3-03897-843-4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910346846903321
Seo Jung-Hun  
MDPI - Multidisciplinary Digital Publishing Institute, 2019
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui