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High-Density Solid-State Memory Devices and Technologies
High-Density Solid-State Memory Devices and Technologies
Autore Monzio Compagnoni Christian
Pubbl/distr/stampa Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Descrizione fisica 1 electronic resource (210 p.)
Soggetto topico Technology: general issues
History of engineering & technology
Soggetto non controllato resistive switching memory
in-memory computing
crosspoint array
artificial intelligence
deep learning
dielectric
RTN
TAT
Wiener-Khinchin
transient analysis
phonon
surface roughness
spectral index
power spectrum
program suspend
3D NAND Flash
Solid State Drives
MOSFET
low-frequency noise
random telegraph noise
evaluation method
array test pattern
STT-MRAM
spintronics
CoFeB
composite free layer
low power electronics
NAND Flash memory
endurance
reliability
oxide trapped charge
artificial neural networks
neuromorphic computing
NOR Flash memory arrays
program noise
pulse-width modulation
3D NAND
floating gate cell
charge-trap cell
CMOS under array
bumpless
TSV
WOW
COW
BBCube
bandwidth
yield
power consumption
thermal management
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910566470403321
Monzio Compagnoni Christian  
Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Small Scale Deformation using Advanced Nanoindentation Techniques
Small Scale Deformation using Advanced Nanoindentation Techniques
Autore Tsui Ting
Pubbl/distr/stampa MDPI - Multidisciplinary Digital Publishing Institute, 2019
Descrizione fisica 1 electronic resource (168 p.)
Soggetto non controllato nanoscale
fracture toughness
helium irradiation
cement paste
solder
fracture
Pop-in
fatigue
strain rate sensitivity
viscoelasticity
nuclear fusion structural materials
biomaterials
transmission electron microscopy
mammalian cells
quasicontinuum method
brittleness and ductility
morphology
creep
dimensionless analysis
size effect
mechanical properties
hardness
shear transformation zone
TSV
micro-cantilever beam
multiscale
InP(100) single crystal
surface pit defect
mixed-mode
micromechanics
soft biomaterials
metallic glass
atomic force microscopy (AFM)
Bi2Se3 thin films
constitutive model
pop-in
rate factor
FIB
nickel
nanoindenter
miniaturized cantilever beam
hydrogen embrittlement
nanoindentation
irradiation hardening
reduced activation ferritic martensitic (RAFM) steels
tantalum
ISBN 3-03897-967-8
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910346841203321
Tsui Ting  
MDPI - Multidisciplinary Digital Publishing Institute, 2019
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui