High-Density Solid-State Memory Devices and Technologies |
Autore | Monzio Compagnoni Christian |
Pubbl/distr/stampa | Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022 |
Descrizione fisica | 1 electronic resource (210 p.) |
Soggetto topico |
Technology: general issues
History of engineering & technology |
Soggetto non controllato |
resistive switching memory
in-memory computing crosspoint array artificial intelligence deep learning dielectric RTN TAT Wiener-Khinchin transient analysis phonon surface roughness spectral index power spectrum program suspend 3D NAND Flash Solid State Drives MOSFET low-frequency noise random telegraph noise evaluation method array test pattern STT-MRAM spintronics CoFeB composite free layer low power electronics NAND Flash memory endurance reliability oxide trapped charge artificial neural networks neuromorphic computing NOR Flash memory arrays program noise pulse-width modulation 3D NAND floating gate cell charge-trap cell CMOS under array bumpless TSV WOW COW BBCube bandwidth yield power consumption thermal management |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910566470403321 |
Monzio Compagnoni Christian | ||
Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Small Scale Deformation using Advanced Nanoindentation Techniques |
Autore | Tsui Ting |
Pubbl/distr/stampa | MDPI - Multidisciplinary Digital Publishing Institute, 2019 |
Descrizione fisica | 1 electronic resource (168 p.) |
Soggetto non controllato |
nanoscale
fracture toughness helium irradiation cement paste solder fracture Pop-in fatigue strain rate sensitivity viscoelasticity nuclear fusion structural materials biomaterials transmission electron microscopy mammalian cells quasicontinuum method brittleness and ductility morphology creep dimensionless analysis size effect mechanical properties hardness shear transformation zone TSV micro-cantilever beam multiscale InP(100) single crystal surface pit defect mixed-mode micromechanics soft biomaterials metallic glass atomic force microscopy (AFM) Bi2Se3 thin films constitutive model pop-in rate factor FIB nickel nanoindenter miniaturized cantilever beam hydrogen embrittlement nanoindentation irradiation hardening reduced activation ferritic martensitic (RAFM) steels tantalum |
ISBN | 3-03897-967-8 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910346841203321 |
Tsui Ting | ||
MDPI - Multidisciplinary Digital Publishing Institute, 2019 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
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