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2D Nanomaterials Processing and Integration in Miniaturized Devices
2D Nanomaterials Processing and Integration in Miniaturized Devices
Autore Pirri Fabrizio
Pubbl/distr/stampa Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Descrizione fisica 1 online resource (122 p.)
Soggetto topico Technology: general issues
Soggetto non controllato 10-nm nanogap
2D materials
adhesion strength
Au/Pd
biodevices
chemical vapor deposition (CVD)
coalescence
doping level
electrical resistivity
fabrication
fano resonance
film
flexible
friction
graphene
illumination
inkjet printing
integration
localized surface plasmon resonance
lubrication
metal-organic decomposition
microstructure
miniaturized devices
monolayer MoS2
n/a
naked-eye 3D
nanomorphology
nanoparticle
patterning
percolation
photo-assisted etching
photoluminescence
plasmonic sensor
porous silicon
Pt
reflectance
scanning electron microscopy
Si3N4
SiC
silver thin film
temperature rise
total current
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910557736203321
Pirri Fabrizio  
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Advanced Composites : From Materials Characterization to Structural Application
Advanced Composites : From Materials Characterization to Structural Application
Autore Gribniak Viktor
Pubbl/distr/stampa Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Descrizione fisica 1 online resource (378 p.)
Soggetto topico Technology: general issues
Soggetto non controllato 3D warp interlock fabric
accelerated bridge construction
acoustic characteristics of a submarine
acoustic coating
acoustic stealth
active sound absorption
aluminum alloys
aluminum honeycomb
AZ91
bending test
bond behavior
cement composite
CFRP
CFRP laminate
cleavage unit
cold-formed profiles
composite beam
composite laminates
composite material
composite materials
concrete
constitutive analysis
counter-intuitive behavior
crack deflection
crack propagation
Cu-Cr system
cyclic loading
cyclic tests
damage
deformation modes
direct tension tests
dissimilar welding materials
electron-beam welding
energy distribution
epoxy resins
failure mode
fiber-reinforced composite
finite element (FE) analysis
finite element analysis
finite element method (FEM)
flexural behavior
flexure
fracture morphology
fracture toughness
FRP
gradient material model
group studs
heat monitoring
high-strength steel
hysteretic response
in situ amorphous coating
irreversible thermochromic
laser surface remelting
load-bearing capacity
local deformations
magnesium alloy
manganese violet
material characterization
mechanical alloying
mechanical characterization
mechanical test
mechanically fastened joints
metal matrix composites
misorientation angles
n/a
NSM
numerical analysis
numerical modeling
para-aramid fiber
passive sound absorption
pipeline steel
power cables
reinforced concrete
residual stiffness
residual stresses
resonance zone
shape memory alloys
shear
shock wave
SiC
slender beams
slip
smeared crack model
soft body armor
solid solubility extension
sound radiation
steel fiber
steel fiber reinforced concrete (SFRC)
steel fiber-reinforced concrete (SFRC)
strengthening
structural behavior
structural evolution
synergy
temperature indication
tension softening
tension stiffening
tests
thermal environment
thermodynamic
three-point bending test
Ti-based alloy
toughness
transmission lines
tribology
vibrations
warp yarn interchange ratio
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti Advanced Composites
Record Nr. UNINA-9910557373803321
Gribniak Viktor  
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Advanced DC-DC Power Converters and Switching Converters
Advanced DC-DC Power Converters and Switching Converters
Autore Musumeci Salvatore
Pubbl/distr/stampa Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Descrizione fisica 1 online resource (188 p.)
Soggetto topico History of engineering and technology
Soggetto non controllato automotive
battery charger
bidirectional
bidirectional converter
buck-boost converter
burst-mode switching
circuit modelling
Component Connection Method
DC-DC converters
DC/DC converter
electric vehicle (EV)
energy storage
fast charging
GaN
high efficiency
high step-up DC-DC converter
high switching frequency
high-frequency transformer configurations
interleaved dc-dc converter
interleaved operation
intermittent switching
multi-input-port
multi-port dual-active bridge (DAB) converter
phase-shift modulation
photovoltaics
power converter
power electronics
power electronics-based systems
Si devices
SiC
SiC devices
SiC MOSFET
silicon carbide (SiC) MOSFETs
single-diode model
stability analysis
state-space
state-space methods
three-phase bidirectional isolated DC-DC converter
three-phase dual-active bridge
three-winding coupled inductor
virtual synchronous generators
wide-band-gap (WBG) semiconductors
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910557117103321
Musumeci Salvatore  
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Exclusive Papers of the Editorial Board Members (EBMs) of the Materials Chemistry Section of Molecules
Exclusive Papers of the Editorial Board Members (EBMs) of the Materials Chemistry Section of Molecules
Autore Cirillo Giuseppe
Pubbl/distr/stampa Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Descrizione fisica 1 online resource (294 p.)
Soggetto topico Technology: general issues
Soggetto non controllato amplified spontaneous emission
anti-counterfeit
antiferromagnet
biodistribution
blood-brain barrier (BBB)
caffeine
carbon nanosheets
central nervous system (CNS)
colloidal heterostructures
controlled drug delivery
cross-coupling reactions
crosslinking polymerization (curing)
decomposition
deep eutectic solvents
degradation
dendrimers
double perovskite
electrochemical sensors
fullerols
gold nanoparticles
graphene nanoplatelets
heterogeneous nucleation
hexaazatrinaphthylenes
high-κ dielectric
honeycomb structures
hybrid hydrogels
hydroxycinnamic acids
hypergolic reactions
inkjet printing
intranasal delivery
ionic liquids
lead halide perovskites
liquid and solid state
lysozyme
mechanochemistry
microwave irradiation
microwaves
modified couple stress theory
nanocomposites
nanoink
nanomaterials
nickel
nitrite
PbS/TiO2 heterostructure
phase transitions
photoluminescence
photothermal effect
polymer-derived ceramics
protein crystallization
quasi-3d hyperbolic shear deformation theory
sandwich structures
secure writing
seed mediated growth
self-assembled polymeric nanoparticles
sensors
Si3N4
SiC
sodium peroxide
solvent-free
structural properties
sustainability
tellurium
thermal analysis
thin films
TiC
TiN
TiO2 nanocrystal defects
tungsten
ultrasounds
useful energy
vibration analysis
water
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti Exclusive Papers of the Editorial Board Members
Record Nr. UNINA-9910557364403321
Cirillo Giuseppe  
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Fundamentals and Recent Advances in Epitaxial Graphene on SiC
Fundamentals and Recent Advances in Epitaxial Graphene on SiC
Autore Yakimova Rositsa
Pubbl/distr/stampa Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Descrizione fisica 1 online resource (94 p.)
Soggetto topico Technology: general issues
Soggetto non controllato 2D peak line shape
3C-SiC on Si
AFM
atomic layer deposition
buffer layer
carrier concentration
charge density
chronoamperometry
copper
deposition
DFT
electrodeposition
electronic properties
epitaxial graphene
epitaxial graphene on SiC
flat band
free charge carrier properties
G peak
graphene
high-k insulators
high-temperature sublimation
intercalation
ion implantation
material engineering
mobility
monolayer graphene
quasi-free-standing graphene
Raman
Raman spectroscopy
redox reaction
SiC
silicon carbide
strain
sublimation
substrate interaction
surface functionalization
terahertz optical Hall effect
twisted bilayer graphene
twistronics
voltammetry
XPS
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910557896703321
Yakimova Rositsa  
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
SiC based Miniaturized Devices
SiC based Miniaturized Devices
Pubbl/distr/stampa Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2020
Descrizione fisica 1 online resource (170 p.)
Soggetto topico History of engineering and technology
Soggetto non controllato 3C-SiC
4H-SiC
4H-SiC, epitaxial layer
6H-SiC
aluminum nitride
amorphous SiC
Berkovich indenter
bulge test
bulk micromachining
circular membrane
cleavage strength
critical depth of cut
critical load
deep level transient spectroscopy (DLTS)
deformation
doped SiC
electrochemical characterization
electrochemical etching
electron beam induced current spectroscopy (EBIC)
epitaxial growth
FEM
grazing incidence X-ray diffraction (GIXRD)
high-power impulse magnetron sputtering (HiPIMS)
high-temperature converters
indentation
material removal mechanisms
MEA
mechanical properties
MEMS devices
MESFET
microelectrode array
microstrip detector
n-type
n/a
nanoscratching
negative gate-source voltage spike
neural implant
neural interface
neural probe
p-type
PAE
point defects
power electronics
power module
pulse height spectroscopy (PHS)
radiation detector
Raman spectroscopy
residual stress
Rutherford backscattering spectrometry (RBS)
Schottky barrier
semiconductor radiation detector
SiC
SiC power electronic devices
silicon carbide
simulation
thermally stimulated current spectroscopy (TSC)
thin film
vibrometry
Young's modulus
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910557498703321
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2020
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Wide Bandgap Based Devices: Design, Fabrication and Applications, Volume II
Wide Bandgap Based Devices: Design, Fabrication and Applications, Volume II
Autore Verzellesi Giovanni
Pubbl/distr/stampa Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Descrizione fisica 1 online resource (320 p.)
Soggetto topico Energy industries and utilities
History of engineering and technology
Technology: general issues
Soggetto non controllato 2DEG
AlGaN/GaN
AlGaN/GaN heterojunction
AlGaN/GaN heterostructures
AlN
AlN buffer layer
aluminum nitride
annealing temperature
auto-compensation
band structure
bias stability
blue and yellow luminescence
breakdown field
breakdown voltage
buffer layer
carbon doping
charge traps
compensation ratio
crystal growth
crystallite size
cubic and hexagonal structure
current collapse
density functional theory
density of states
digital signal processor
driving technology
dry processing
electrochromic device
electron lifetime
energy storage system
equivalent-circuit modeling
fabrication
first-principles
gallium nitride
gallium nitride (GaN)
GaN
GaN power HEMTs
GaN-based LED
GaN-HEMT mesa structures
gate bias modulation
heterogeneous integration
high electron mobility transistor
high electron mobility transistor (HEMT)
high electron-mobility transistor (HEMT)
high-electron mobility devices
high-electron mobility transistor
high-temperature
HTA
HVPE
indium oxide thin film
laser micromachining
laser processing
laser thermal separation
low defect density
low-resistance SiC substrate
magnetron sputtering
metal-oxide-semiconductor field effect transistor (MOSFET)
microwave frequency
MIS-HEMTs
n/a
NH3 growth interruption
nickel oxide
nitridation
nitrogen dioxide gas sensor
noise
non-polar
normally off
optical absorption
optical band gap
p-GaN gate
p-GaN gate HEMT
p-type doping
palladium catalyst
photovoltaic module
piezoelectric micromachined ultrasonic transducers
plasma surface treatment
polar
power conditioning system
pure β-Ga2O3
QST
radio frequency
radio frequency sputtering
ranging
rectifying electrode
sapphire
scattering-parameter measurements
Schottky barrier diode
Schottky barrier diodes
semi-polar
SiC
silicon carbide
silicon carbide (SiC)
SOI
solution method
Sr-doped β-Ga2O3
stealth dicing
strain relaxation
supercritical technology
synchronous buck converter
temperature
threshold voltage stability
time of flight (TOF)
time to digital converter circuit (TDC)
unidirectional operation
vanadium redox flow batteries
wafer dicing
wide bandgap semiconductor
wide-bandgap (WBG)
X-ray diffraction
X-ray imaging
X-ray photoelectron spectroscopy
X-ray sensor
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti Wide Bandgap Based Devices
Record Nr. UNINA-9910576886103321
Verzellesi Giovanni  
Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui