Info
- Utilizzare la checkbox di selezione a fianco di ciascun documento per attivare le funzionalità di stampa, invio email, download nei formati disponibili del (i) record.
MEMS Packaging Technologies and 3D Integration
| MEMS Packaging Technologies and 3D Integration |
| Autore | Seok Seonho |
| Pubbl/distr/stampa | MDPI - Multidisciplinary Digital Publishing Institute, 2022 |
| Descrizione fisica | 1 online resource (210 p.) |
| Soggetto topico |
Biology, life sciences
Research & information: general |
| Soggetto non controllato |
adhesion
Au film thickness Au-Au bonding biocompatible packaging capacitive micromachined ultrasound transducers (CMUT) chronic implantation crack propagation deflection angle equivalent circuit model fan-out wafer-level package fan-out wafer-level packaging (FOWLP) FEM finite difference time domain finite element finite element analysis Finite element method (FEM) fuzzy AHP fuzzy VIKOR glass substrate heterogeneous integration implantable inkjet printing integrated nanostructure-multilayer reactive system low-temperature MEMS packaging MCDM MEMS and IC integration MEMS resonator metal direct bonding microbump microelectromechanical systems (MEMS) packaging microsystem integration millimeter-wave multilayer reactive bonding n/a neural interface neural probe Ni/Al reactive multilayer system optical and electromagnetics simulations packaging-on-packaging parylene Pd/Al reactive multilayer system polymer packaging redistribution layers redundant TSV reliability reliability life room-temperature bonding S-parameters extraction scotch tape test self-propagating exothermic reaction simulation spontaneous self-ignition stress intensity factor (SIF) surface activated bonding surface roughness technology evaluation temperature coefficient thermal sensors thermal stress thin film metal TMOS sensor ultrasonic bonding wafer bonding wafer sealing |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910576876203321 |
Seok Seonho
|
||
| MDPI - Multidisciplinary Digital Publishing Institute, 2022 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Nonlinear Dynamics in Complex Systems via Fractals and Fractional Calculus
| Nonlinear Dynamics in Complex Systems via Fractals and Fractional Calculus |
| Pubbl/distr/stampa | MDPI - Multidisciplinary Digital Publishing Institute, 2023 |
| Descrizione fisica | 1 online resource (276 p.) |
| Soggetto topico |
Mathematics & science
Research & information: general |
| Soggetto non controllato |
6G communication
adaptive synchronization atmosphere attractor autocorrelation dimension bearing fault diagnosis bifurcation ceilometer ceramics chaos circuit implementation circuit simulation coexisting attractors conductivity correlation dimension delayed feedback dispersion entropy electronic circuit feature extraction fractal fractal analysis fractal antenna fractal dimension fractal geometry fractional order fuzzy dispersion entropy global bifurcation heteroclinic orbit hidden attractor homoclinic orbit hyperchaos lacunarity MEMS resonator Minkowski's loop multifractal multifractality n/a non-autonomous discrete systems offset boosting PBL dynamics permutation entropy phase space pull-in instability radiometer data safe basin scale relativity theory SEM micrographs sensitivity slope entropy symbolic dynamics time series time series complexity uniformly converge unstable periodic orbit Zircaloy-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910743271203321 |
| MDPI - Multidisciplinary Digital Publishing Institute, 2023 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||