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Advanced DC-DC Power Converters and Switching Converters
Advanced DC-DC Power Converters and Switching Converters
Autore Musumeci Salvatore
Pubbl/distr/stampa Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Descrizione fisica 1 electronic resource (188 p.)
Soggetto topico History of engineering & technology
Soggetto non controllato interleaved operation
three-winding coupled inductor
high step-up DC–DC converter
DC/DC converter
multi-input-port
bidirectional
energy storage
three-phase bidirectional isolated DC-DC converter
burst-mode switching
high-frequency transformer configurations
phase-shift modulation
intermittent switching
three-phase dual-active bridge
bidirectional converter
high efficiency
GaN
SiC
buck-boost converter
high switching frequency
electric vehicle (EV)
fast charging
interleaved dc–dc converter
SiC devices
Si devices
Component Connection Method
power electronics-based systems
stability analysis
state-space methods
virtual synchronous generators
DC-DC converters
photovoltaics
single-diode model
state-space
multi-port dual-active bridge (DAB) converter
wide-band-gap (WBG) semiconductors
silicon carbide (SiC) MOSFETs
power converter
automotive
battery charger
circuit modelling
power electronics
SiC MOSFET
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910557117103321
Musumeci Salvatore  
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Feature Papers in Electronic Materials Section
Feature Papers in Electronic Materials Section
Autore Roccaforte Fabrizio
Pubbl/distr/stampa Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Descrizione fisica 1 electronic resource (438 p.)
Soggetto topico Technology: general issues
History of engineering & technology
Energy industries & utilities
Soggetto non controllato vertical GaN
quasi-vertical GaN
reliability
trapping
degradation
MOS
trench MOS
threshold voltage
nanomanufacturing
high-throughput method
material printing
flexible bioelectronics
nanomembrane
hybrid integration
GaAs
InGaAs channel
epitaxial lift-off
HEMT
van der Waals
3C-SiC
stacking faults
doping
KOH etching
silicon carbide
radiation hardness
proton and electron irradiation
charge removal rate
compensation
irradiation temperature
heteroepitaxy
bulk growth
compliant substrates
defects
stress
cubic silicon carbide
power electronics
thin film
iron-based superconductor
pulsed laser deposition
transmission electron microscopy
diamond
MPCVD growth
electron microscopy
chemical vapour deposition
2D materials
MoS2
silica point defects
optical fibers
radiation effects
4H-SiC
ohmic contact
SIMS
Ti3SiC2
simulation
Schottky barrier
Schottky diodes
electrical characterization
graphene absorption
Fabry–Perot filter
radio frequency sputtering
CVD graphene
GaN
thermal management
GaN-on-diamond
CVD
arrhythmia detection
cardiovascular monitoring
soft biosensors
wearable sensors
flexible electronics
gate dielectric
aluminum oxide
interface
traps
instability
insulators
binary oxides
high-κ dielectrics
wide band gap semiconductors
energy electronics
ultra-wide bandgap
diodes
transistors
gallium oxide
Ga2O3
spinel
ZnGa2O4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910557620303321
Roccaforte Fabrizio  
Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Micro- and Nanotechnology of Wide Bandgap Semiconductors
Micro- and Nanotechnology of Wide Bandgap Semiconductors
Autore Piotrowska Anna B
Pubbl/distr/stampa Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Descrizione fisica 1 electronic resource (114 p.)
Soggetto topico Technology: general issues
Soggetto non controllato GaN HEMT
self-heating effect
microwave power amplifier
thermal impedance
thermal time constant
thermal equivalent circuit
GaN
crystal growth
ammonothermal method
HVPE
ion implantation
gallium nitride
thermodynamics
ultra-high-pressure annealing
diffusion
diffusion coefficients
molecular beam epitaxy
nitrides
laser diode
tunnel junction
LTE
AlN
AlGaN/GaN
interface state density
conductance-frequency
MISHEMT
gallium nitride nanowires
polarity
Kelvin probe force microscopy
selective area growth
selective epitaxy
AlGaN/GaN heterostructures
edge effects
effective diffusion length
MOVPE
nanowires
AlGaN
LEDs
growth polarity
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910557343303321
Piotrowska Anna B  
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Miniaturized Transistors, Volume II
Miniaturized Transistors, Volume II
Autore Filipovic Lado
Pubbl/distr/stampa Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Descrizione fisica 1 electronic resource (352 p.)
Soggetto topico Research & information: general
Mathematics & science
Soggetto non controllato FinFETs
CMOS
device processing
integrated circuits
silicon carbide (SiC) metal-oxide-semiconductor field-effect transistors (MOSFETs)
solid state circuit breaker (SSCB)
prototype
circuit design
GaN
HEMT
high gate
multi-recessed buffer
power density
power-added efficiency
4H-SiC
MESFET
IMRD structure
power added efficiency
1200 V SiC MOSFET
body diode
surge reliability
silvaco simulation
floating gate transistor
control gate
CMOS device
active noise control
vacuum channel
mean free path
vertical air-channel diode
vertical transistor
field emission
particle trajectory model
F-N plot
space-charge-limited currents
4H-SiC MESFET
simulation
power added efficiency (PAE)
new device
three-input transistor
T-channel
compact circuit style
CMOS compatible technology
avalanche photodiode
SPICE model
bandwidth
high responsivity
silicon photodiode
AlGaN/GaN HEMTs
thermal simulation
transient channel temperature
pulse width
gate structures
band-to-band tunnelling (BTBT)
tunnelling field-effect transistor (TFET)
germanium-around-source gate-all-around TFET (GAS GAA TFET)
average subthreshold swing
direct source-to-drain tunneling
transport effective mass
confinement effective mass
multi-subband ensemble Monte Carlo
non-equilibrium Green's function
DGSOI
FinFET
core-insulator
gate-all-around
field effect transistor
GAA
nanowire
one-transistor dynamic random-access memory (1T-DRAM)
polysilicon
grain boundary
electron trapping
flexible transistors
polymers
metal oxides
nanocomposites
dielectrics
active layers
nanotransistor
quantum transport
Landauer-Büttiker formalism
R-matrix method
nanoscale
mosfet
quantum current
surface transfer doping
2D hole gas (2DHG)
diamond
MoO3
V2O5
MOSFET
reliability
random telegraph noise
oxide defects
SiO2
split-gate trench power MOSFET
multiple epitaxial layers
specific on-resistance
device reliability
nanoscale transistor
bias temperature instabilities (BTI)
defects
single-defect spectroscopy
non-radiative multiphonon (NMP) model
time-dependent defect spectroscopy
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910580205803321
Filipovic Lado  
Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Nanostructured Light-Emitters
Nanostructured Light-Emitters
Autore Nguyen Hieu Pham Trung
Pubbl/distr/stampa Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2020
Descrizione fisica 1 electronic resource (208 p.)
Soggetto topico History of engineering & technology
Soggetto non controllato Liquid phase deposition method
InGaN/GaN light-emitting diode
silver nanoparticle
zinc oxide
localized surface plasmon
β-Ga2O3
III-Nitrides
monoclinic
hexagonal arrangement
high-power
current distribution
vertical structure LED
blue organic light emitting diodes
transport materials
host-dopant
nanoparticles
luminescence
non-stoichiometric ZnxAgyInS1.5+x+0.5y nanocrystals
photoluminescence properties
tunable fluorescence emission
one-pot approach
perovskite light-emitting diodes
three-step spin coating
hole transport layer
PEDOT:PSS/MoO3-ammonia composite
μLED displays
μLEDs
GaN nanowires
core-shell structure
ultraviolet (UV) emitter
surface plasmon
Pt nanoparticles
hole-pattern
photon emission efficiency
distributed Bragg reflectors
gratings
GaN-based lasers
linewidth
epsilon-near-zero
wideband absorber
plasmon mode
Brewster mode
visible light communication
photonic crystals
flip-chip LED
Purcell effect
light extraction efficiency
nanostructured materials
surface/interface properties
nanostructured light-emitting devices
physical mechanism
surface/interface modification
surface/interface control
micro-scale light emitting diode
sapphire substrate
encapsulation
compound semiconductor
nanostructure
ultraviolet
light-emitting diode (LED)
molecular beam epitaxy
GaN
AlN
photonic nanojet
photonic nanojet array
self-assembly
template-assisted self-assembly
patterning efficiency
III-nitride thin film
nanostructures
ultraviolet emitters
surface passivation
luminescence intensity
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910557105503321
Nguyen Hieu Pham Trung  
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2020
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Optoelectronic Nanodevices
Optoelectronic Nanodevices
Autore Stylianakis Minas M
Pubbl/distr/stampa MDPI - Multidisciplinary Digital Publishing Institute, 2020
Descrizione fisica 1 electronic resource (338 p.)
Soggetto non controllato graphene oxide
textured silicon solar cells
high-efficiency
CdTe microdots
piezo-phototronic effect
electromagnetically induced transparency effect
waveguide photons
light output power
hole injection
ternary organic solar cells
UV LEDs
cathodoluminescence
V-pits
quantum confinement effect
nano-grating
metamaterials
Ga2O3
tunneling
transmittance
graphene ink
perovskite solar cells
counter electrode
nucleation layer
Ag film
AlGaN-based ultraviolet light-emitting diode
color-conversion efficiency
PeLEDs
photoelectric performance
photocurrent
charge transfer
double-layer ITO
green LED
liquid crystals
photovoltaics
electrowetting
oxidation
Fowler-Nordheim
field emission
excitation wavelength
functionalization
quantum dots
gold split-ring
cascade effect
erbium
transparent conductive electrode
compact
plasmon resonance
air-processed
FDTD
prism-structured sidewall
sheet resistance
GaN
Ti porous film
stability
flip-chip mini-LED
flexible substrate
actively tunable nanodevices
green LEDs
metasurfaces
antireflective coating (ARC)
NiCo2S4 nanotubes
InN/p-GaN heterojunction
InGaN/GaN superlattice
OAB
graded indium composition
plasmonics
polymer composites
photomultiplication
cold cathode
solvent
solar cells
controllable synthesis
tunable absorbers
interface
graphene
silicon transistor
colorimetry
light extraction
reduced graphene oxide
pinhole pattern
indium nanoparticles (In NPs)
graphene split-ring
organic solar cell
light-emitting diode
organic
plasmonic forward scattering
smooth
subwavelength metal grating
perovskite
photoluminescence
mid infrared
polarization analyzer
transparent electrode
external quantum efficiency
LED
light-emitting diodes
photodetector
p-type InGaN
quantum efficiency
2D perovskite
quantum dot
orthogonal polarization
current spreading
localized surface plasmon
Schottky barrier
ISBN 3-03928-697-8
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910404090103321
Stylianakis Minas M  
MDPI - Multidisciplinary Digital Publishing Institute, 2020
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Reliability Analysis of Electrotechnical Devices
Reliability Analysis of Electrotechnical Devices
Autore Tan Cher Ming
Pubbl/distr/stampa Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Descrizione fisica 1 electronic resource (174 p.)
Soggetto topico Technology: general issues
History of engineering & technology
Soggetto non controllato 3D-IC (three-dimensional integrated circuit)
electromagnetic interference
near field measurement
SAC305
BGA
low temperature
fracture failure
factorial design of experiment
genetic algorithm optimization
return loss
multiple-input multiple-output (MIMO)
single event effects
linear energy transfer
Monte Carlo simulation
radiation hardness
pressureless sintered micron silver joints
deep space environment
extreme thermal shocks
reconstruction
simulation
elastic mechanical properties
state of health
remaining useful life
electrochemistry based electrical model
semi-empirical capacity fading model
useful life distribution
quality and reliability assurance
single event effect
microdosimetry
lineal energy
deconvolution
gamma process
lifetime
measurement system analysis
reliability estimation
GaN
operational amplifier
proton therapy
prompt gamma imaging
3D X-ray
bias temperature-humidity reliability test
conductive anodic filament (CAF)
de-penalization
finite element analysis
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910585945603321
Tan Cher Ming  
Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Wide Bandgap Based Devices : Design, Fabrication and Applications
Wide Bandgap Based Devices : Design, Fabrication and Applications
Autore Medjdoub Farid
Pubbl/distr/stampa Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Descrizione fisica 1 electronic resource (242 p.)
Soggetto topico Technology: general issues
Soggetto non controllato GaN
high-electron-mobility transistor (HEMT)
ultra-wide band gap
GaN-based vertical-cavity surface-emitting laser (VCSEL)
composition-graded AlxGa1−xN electron blocking layer (EBL)
electron leakage
GaN laser diode
distributed feedback (DFB)
surface gratings
sidewall gratings
AlGaN/GaN
proton irradiation
time-dependent dielectric breakdown (TDDB)
reliability
normally off
power cycle test
SiC micro-heater chip
direct bonded copper (DBC) substrate
Ag sinter paste
wide band-gap (WBG)
thermal resistance
amorphous InGaZnO
thin-film transistor
nitrogen-doping
buried-channel
stability
4H-SiC
turn-off loss
ON-state voltage
breakdown voltage (BV)
IGBT
wide-bandgap semiconductor
high electron mobility transistors
vertical gate structure
normally-off operation
gallium nitride
asymmetric multiple quantum wells
barrier thickness
InGaN laser diodes
optical absorption loss
electron leakage current
wide band gap semiconductors
numerical simulation
terahertz Gunn diode
grooved-anode diode
Gallium nitride (GaN) high-electron-mobility transistors (HEMTs)
vertical breakdown voltage
buffer trapping effect
gallium nitride (GaN)
power switching device
active power filter (APF)
power quality (PQ)
metal-insulator-semiconductor high-electron-mobility transistor (MIS-HEMT)
recessed gate
double barrier
high-electron-mobility transistors
copper metallization
millimeter wave
wide bandgap semiconductors
flexible devices
silver nanoring
silver nanowire
polyol method
cosolvent
tungsten trioxide film
spin coating
optical band gap
morphology
electrochromism
self-align
hierarchical nanostructures
ZnO nanorod/NiO nanosheet
photon extraction efficiency
photonic emitter
wideband
HEMT
power amplifier
jammer system
GaN 5G
high electron mobility transistors (HEMT)
new radio
RF front-end
AESA radars
transmittance
distortions
optimization
GaN-on-GaN
schottky barrier diodes
high-energy α-particle detection
low voltage
thick depletion width detectors
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti Wide Bandgap Based Devices
Record Nr. UNINA-9910557351703321
Medjdoub Farid  
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Wide Bandgap Based Devices: Design, Fabrication and Applications, Volume II
Wide Bandgap Based Devices: Design, Fabrication and Applications, Volume II
Autore Verzellesi Giovanni
Pubbl/distr/stampa Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Descrizione fisica 1 electronic resource (320 p.)
Soggetto topico Technology: general issues
History of engineering & technology
Energy industries & utilities
Soggetto non controllato energy storage system
power conditioning system
silicon carbide
vanadium redox flow batteries
AlGaN/GaN
SiC
high electron mobility transistor
Schottky barrier diode
breakdown field
noise
charge traps
radio frequency
wide-bandgap (WBG)
gallium nitride (GaN)
silicon carbide (SiC)
high electron mobility transistor (HEMT)
metal-oxide-semiconductor field effect transistor (MOSFET)
driving technology
nickel oxide
annealing temperature
crystallite size
optical band gap
electrochromic device
indium oxide thin film
solution method
plasma surface treatment
bias stability
aluminum nitride
Schottky barrier diodes
radio frequency sputtering
X-ray diffraction
X-ray photoelectron spectroscopy
piezoelectric micromachined ultrasonic transducers
ranging
time of flight (TOF)
time to digital converter circuit (TDC)
AlGaN/GaN heterojunction
p-GaN gate
unidirectional operation
rectifying electrode
first-principles
density functional theory
pure β-Ga2O3
Sr-doped β-Ga2O3
p-type doping
band structure
density of states
optical absorption
AlN buffer layer
NH3 growth interruption
strain relaxation
GaN-based LED
low defect density
gate bias modulation
palladium catalyst
gallium nitride
nitrogen dioxide gas sensor
laser micromachining
sapphire
AlGaN/GaN heterostructures
high-electron mobility devices
p-GaN gate HEMT
normally off
low-resistance SiC substrate
temperature
high electron-mobility transistor (HEMT)
equivalent-circuit modeling
microwave frequency
scattering-parameter measurements
GaN
MIS-HEMTs
fabrication
threshold voltage stability
supercritical technology
GaN power HEMTs
breakdown voltage
current collapse
compensation ratio
auto-compensation
carbon doping
HVPE
AlN
high-temperature
buffer layer
nitridation
high-electron mobility transistor
heterogeneous integration
SOI
QST
crystal growth
cubic and hexagonal structure
blue and yellow luminescence
electron lifetime
wafer dicing
stealth dicing
laser thermal separation
dry processing
laser processing
wide bandgap semiconductor
photovoltaic module
digital signal processor
synchronous buck converter
polar
semi-polar
non-polar
magnetron sputtering
HTA
GaN-HEMT mesa structures
2DEG
X-ray sensor
X-ray imaging
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti Wide Bandgap Based Devices
Record Nr. UNINA-9910576886103321
Verzellesi Giovanni  
Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Wide Bandgap Semiconductor Based Micro/Nano Devices
Wide Bandgap Semiconductor Based Micro/Nano Devices
Autore Seo Jung-Hun
Pubbl/distr/stampa MDPI - Multidisciplinary Digital Publishing Institute, 2019
Descrizione fisica 1 electronic resource (138 p.)
Soggetto non controllato ohmic contact
MESFET
optical band gap
wide-bandgap semiconductor
annealing temperature
junction termination extension (JTE)
channel length modulation
silicon carbide (SiC)
amorphous InGaZnO (a-IGZO)
light output power
GaN
electrochromism
large signal performance
passivation layer
4H-SiC
positive gate bias stress (PGBS)
asymmetric power combining
ultrahigh upper gate height
high electron mobility transistors
space application
gallium nitride (GaN)
phase balance
edge termination
distributed Bragg reflector
cathode field plate (CFP)
ammonothermal GaN
anode field plate (AFP)
W band
GaN high electron mobility transistor (HEMT)
1T DRAM
growth of GaN
tungsten trioxide film
thin-film transistor (TFT)
micron-sized patterned sapphire substrate
power added efficiency
T-anode
analytical model
AlGaN/GaN
harsh environment
high-temperature operation
amplitude balance
buffer layer
characteristic length
Ku-band
DIBL effect
I-V kink effect
flip-chip light-emitting diodes
high electron mobility transistors (HEMTs)
power amplifier
sidewall GaN
external quantum efficiency
breakdown voltage (BV)
threshold voltage (Vth) stability
regrown contact
AlGaN/GaN HEMT
TCAD
high electron mobility transistor (HEMT)
ISBN 3-03897-843-4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910346846903321
Seo Jung-Hun  
MDPI - Multidisciplinary Digital Publishing Institute, 2019
Materiale a stampa
Lo trovi qui: Univ. Federico II
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