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Reliability Analysis of Electrotechnical Devices
| Reliability Analysis of Electrotechnical Devices |
| Autore | Tan Cher Ming |
| Pubbl/distr/stampa | Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022 |
| Descrizione fisica | 1 online resource (174 p.) |
| Soggetto topico |
History of engineering & technology
Technology: general issues |
| Soggetto non controllato |
3D X-ray
3D-IC (three-dimensional integrated circuit) BGA bias temperature-humidity reliability test conductive anodic filament (CAF) de-penalization deconvolution deep space environment elastic mechanical properties electrochemistry based electrical model electromagnetic interference extreme thermal shocks factorial design of experiment finite element analysis fracture failure gamma process GaN genetic algorithm optimization lifetime lineal energy linear energy transfer low temperature measurement system analysis microdosimetry Monte Carlo simulation multiple-input multiple-output (MIMO) n/a near field measurement operational amplifier pressureless sintered micron silver joints prompt gamma imaging proton therapy quality and reliability assurance radiation hardness reconstruction reliability estimation remaining useful life return loss SAC305 semi-empirical capacity fading model simulation single event effect single event effects state of health useful life distribution |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910585945603321 |
Tan Cher Ming
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| Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Thermal and Electro-thermal System Simulation 2020
| Thermal and Electro-thermal System Simulation 2020 |
| Autore | Rencz Márta |
| Pubbl/distr/stampa | Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021 |
| Descrizione fisica | 1 online resource (310 p.) |
| Soggetto topico | History of engineering and technology |
| Soggetto non controllato |
3D IC
accuracy repeatability and reproducibility of thermal measurements AlGaN-GaN HEMT BCI-DCTM beyond CMOS BGA CFD CoB LEDs compact thermal model computation time Delphi4LED detailed thermal model digital luminaire design digital twin DVFS electro-thermal model electro-thermal simulation electronic packages electronics cooling experimental validation finite volume method heat generation heat transfer mechanisms hotspot Industry 4.0 Joint Electron Device Engineering Council (JEDEC) metrics LED LED lifetime modelling LED multi-domain modelling life testing lifetime extrapolation and modelling of LEDs Light-emitting diodes liquid cooling lithium-ion battery LM-80 magnetic nanoparticle measurements microchannels microfluidics modal approach modelling module temperature multi-domain modeling non-destructive testing nonlinear thermal model OpenFOAM optical efficiency phonon transport mechanisms phosphor modeling power LED measurement and simulation power LEDs pulse transformer reliability testing rheology ROM self-heating size effect solar energy SPICE Spice-like modelling of LEDs statistical analysis TDTR thermal conductivity thermal impedance thermal interface resistance thermal modelling thermal pads thermal phenomena thermal resistance thermal simulation thermal testability thermal testing standards thermal transient testing thermal-aware task scheduling thermal-electronic circuits TM-21 two-phase solver vertical structure VO2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910557118503321 |
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Rencz Márta
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| Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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