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Reliability Analysis of Electrotechnical Devices
Reliability Analysis of Electrotechnical Devices
Autore Tan Cher Ming
Pubbl/distr/stampa Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Descrizione fisica 1 electronic resource (174 p.)
Soggetto topico Technology: general issues
History of engineering & technology
Soggetto non controllato 3D-IC (three-dimensional integrated circuit)
electromagnetic interference
near field measurement
SAC305
BGA
low temperature
fracture failure
factorial design of experiment
genetic algorithm optimization
return loss
multiple-input multiple-output (MIMO)
single event effects
linear energy transfer
Monte Carlo simulation
radiation hardness
pressureless sintered micron silver joints
deep space environment
extreme thermal shocks
reconstruction
simulation
elastic mechanical properties
state of health
remaining useful life
electrochemistry based electrical model
semi-empirical capacity fading model
useful life distribution
quality and reliability assurance
single event effect
microdosimetry
lineal energy
deconvolution
gamma process
lifetime
measurement system analysis
reliability estimation
GaN
operational amplifier
proton therapy
prompt gamma imaging
3D X-ray
bias temperature-humidity reliability test
conductive anodic filament (CAF)
de-penalization
finite element analysis
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910585945603321
Tan Cher Ming  
Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Thermal and Electro-thermal System Simulation 2020
Thermal and Electro-thermal System Simulation 2020
Autore Rencz Márta
Pubbl/distr/stampa Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Descrizione fisica 1 electronic resource (310 p.)
Soggetto topico History of engineering & technology
Soggetto non controllato lithium-ion battery
thermal modelling
electro-thermal model
heat generation
experimental validation
thermal transient testing
non-destructive testing
thermal testability
accuracy repeatability and reproducibility of thermal measurements
thermal testing standards
3D IC
microchannels
liquid cooling
compact thermal model
thermal simulation
hotspot
thermal-aware task scheduling
DVFS
statistical analysis
electronic packages
detailed thermal model
Joint Electron Device Engineering Council (JEDEC) metrics
thermal impedance
AlGaN-GaN HEMT
TDTR
thermal conductivity
thermal interface resistance
size effect
phonon transport mechanisms
nonlinear thermal model
SPICE
pulse transformer
thermal phenomena
self-heating
modelling
measurements
BCI-DCTM
ROM
modal approach
BGA
module temperature
solar energy
heat transfer mechanisms
power LED measurement and simulation
life testing
reliability testing
LM-80
TM-21
LED lifetime modelling
LED multi-domain modelling
Spice-like modelling of LEDs
lifetime extrapolation and modelling of LEDs
beyond CMOS
VO2
thermal-electronic circuits
electro-thermal simulation
vertical structure
power LEDs
thermal pads
thermal resistance
optical efficiency
electronics cooling
Light-emitting diodes
CoB LEDs
multi-domain modeling
finite volume method
phosphor modeling
magnetic nanoparticle
microfluidics
CFD
OpenFOAM
two-phase solver
rheology
LED
Delphi4LED
digital twin
digital luminaire design
computation time
Industry 4.0
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910557118503321
Rencz Márta  
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui