Reliability Analysis of Electrotechnical Devices |
Autore | Tan Cher Ming |
Pubbl/distr/stampa | Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022 |
Descrizione fisica | 1 electronic resource (174 p.) |
Soggetto topico |
Technology: general issues
History of engineering & technology |
Soggetto non controllato |
3D-IC (three-dimensional integrated circuit)
electromagnetic interference near field measurement SAC305 BGA low temperature fracture failure factorial design of experiment genetic algorithm optimization return loss multiple-input multiple-output (MIMO) single event effects linear energy transfer Monte Carlo simulation radiation hardness pressureless sintered micron silver joints deep space environment extreme thermal shocks reconstruction simulation elastic mechanical properties state of health remaining useful life electrochemistry based electrical model semi-empirical capacity fading model useful life distribution quality and reliability assurance single event effect microdosimetry lineal energy deconvolution gamma process lifetime measurement system analysis reliability estimation GaN operational amplifier proton therapy prompt gamma imaging 3D X-ray bias temperature-humidity reliability test conductive anodic filament (CAF) de-penalization finite element analysis |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910585945603321 |
Tan Cher Ming | ||
Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Thermal and Electro-thermal System Simulation 2020 |
Autore | Rencz Márta |
Pubbl/distr/stampa | Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021 |
Descrizione fisica | 1 electronic resource (310 p.) |
Soggetto topico | History of engineering & technology |
Soggetto non controllato |
lithium-ion battery
thermal modelling electro-thermal model heat generation experimental validation thermal transient testing non-destructive testing thermal testability accuracy repeatability and reproducibility of thermal measurements thermal testing standards 3D IC microchannels liquid cooling compact thermal model thermal simulation hotspot thermal-aware task scheduling DVFS statistical analysis electronic packages detailed thermal model Joint Electron Device Engineering Council (JEDEC) metrics thermal impedance AlGaN-GaN HEMT TDTR thermal conductivity thermal interface resistance size effect phonon transport mechanisms nonlinear thermal model SPICE pulse transformer thermal phenomena self-heating modelling measurements BCI-DCTM ROM modal approach BGA module temperature solar energy heat transfer mechanisms power LED measurement and simulation life testing reliability testing LM-80 TM-21 LED lifetime modelling LED multi-domain modelling Spice-like modelling of LEDs lifetime extrapolation and modelling of LEDs beyond CMOS VO2 thermal-electronic circuits electro-thermal simulation vertical structure power LEDs thermal pads thermal resistance optical efficiency electronics cooling Light-emitting diodes CoB LEDs multi-domain modeling finite volume method phosphor modeling magnetic nanoparticle microfluidics CFD OpenFOAM two-phase solver rheology LED Delphi4LED digital twin digital luminaire design computation time Industry 4.0 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910557118503321 |
Rencz Márta | ||
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|