Copper wire bonding / / Preeti S. Chauhan [and three others]
| Copper wire bonding / / Preeti S. Chauhan [and three others] |
| Autore | Chauhan Preeti S |
| Edizione | [1st ed. 2014.] |
| Pubbl/distr/stampa | New York : , : Springer, , 2014 |
| Descrizione fisica | 1 online resource (xxvi, 235 pages) : illustrations (some color) |
| Disciplina | 671.58 |
| Collana | Gale eBooks |
| Soggetto topico |
Wire bonding (Electronic packaging)
Copper wire |
| ISBN | 1-4614-5761-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Copper Wire Bonding -- Bonding Process -- Bonding Metallurgies -- Wire Bond Evaluation -- Thermal Reliability Tests -- Humidity and Electromigration Tests -- Wire Bond Pads -- Concerns and Solutions -- Recommendations -- Appendix A: Reliability Data -- Appendix B: Patents on Copper Wire Bonding. |
| Record Nr. | UNINA-9910299461003321 |
Chauhan Preeti S
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| New York : , : Springer, , 2014 | ||
| Lo trovi qui: Univ. Federico II | ||
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A new technique for wirebonding using indium spheres / / Kimberley A. Olver
| A new technique for wirebonding using indium spheres / / Kimberley A. Olver |
| Autore | Olver Kimberley A |
| Pubbl/distr/stampa | Adelphi, MD : , : Army Research Laboratory, , [2010] |
| Descrizione fisica | 1 online resource (vi, 6) : color illustrations |
| Collana | ARL-TR |
| Soggetto topico |
Mercury cadmium tellurides
Wire bonding (Electronic packaging) |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910701075903321 |
Olver Kimberley A
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| Adelphi, MD : , : Army Research Laboratory, , [2010] | ||
| Lo trovi qui: Univ. Federico II | ||
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Potentially defective external lead-wire connections in Barton pressure transmitters
| Potentially defective external lead-wire connections in Barton pressure transmitters |
| Pubbl/distr/stampa | Washington, DC : , : U.S. Nuclear Regulatory Commission, Office of Nuclear Reactor Regulation, , [2006] |
| Descrizione fisica | 1 online resource (2, 3 pages) |
| Collana | NRC information notice |
| Soggetto topico |
Wire bonding (Electronic packaging)
Nuclear pressure vessels - Defects |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910699502603321 |
| Washington, DC : , : U.S. Nuclear Regulatory Commission, Office of Nuclear Reactor Regulation, , [2006] | ||
| Lo trovi qui: Univ. Federico II | ||
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