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2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
| 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2012 |
| Descrizione fisica | 1 online resource (262 pages) : illustrations |
| Disciplina | 621.36 |
| Soggetto topico |
Photonics - Materials
Three-dimensional integrated circuits Sealing (Technology) |
| ISBN | 1-4673-0742-4 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996213594903316 |
| [Place of publication not identified], : IEEE, 2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
| 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2012 |
| Descrizione fisica | 1 online resource (262 pages) : illustrations |
| Disciplina | 621.36 |
| Soggetto topico |
Photonics - Materials
Three-dimensional integrated circuits Sealing (Technology) |
| ISBN | 1-4673-0742-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910130707303321 |
| [Place of publication not identified], : IEEE, 2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2015 International 3D Systems Integration Conference (3DIC 2015) : Sendai, Japan, 31 August - 2 September 2015 / / Institute of Electrical and Electronics Engineers
| 2015 International 3D Systems Integration Conference (3DIC 2015) : Sendai, Japan, 31 August - 2 September 2015 / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, NJ : , : IEEE, , [2015] |
| Descrizione fisica | 1 online resource (353 pages) : illustrations |
| Disciplina | 621 |
| Soggetto topico | Three-dimensional integrated circuits |
| ISBN |
1-4673-9385-1
1-4673-9386-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti |
2015 International 3D Systems Integration Conference
3D Systems Integration Conference |
| Record Nr. | UNISA-996279447203316 |
| Piscataway, NJ : , : IEEE, , [2015] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
2015 International 3D Systems Integration Conference (3DIC 2015) : Sendai, Japan, 31 August - 2 September 2015 / / Institute of Electrical and Electronics Engineers
| 2015 International 3D Systems Integration Conference (3DIC 2015) : Sendai, Japan, 31 August - 2 September 2015 / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, NJ : , : IEEE, , [2015] |
| Descrizione fisica | 1 online resource (353 pages) : illustrations |
| Disciplina | 621 |
| Soggetto topico | Three-dimensional integrated circuits |
| ISBN |
1-4673-9385-1
1-4673-9386-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti |
2015 International 3D Systems Integration Conference
3D Systems Integration Conference |
| Record Nr. | UNINA-9910135064303321 |
| Piscataway, NJ : , : IEEE, , [2015] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2018 19th International Symposium on Quality Electronic Design : March 13-14, 2018, Santa Clara, California USA. / / IEEE Electron Devices Society [and four others]
| 2018 19th International Symposium on Quality Electronic Design : March 13-14, 2018, Santa Clara, California USA. / / IEEE Electron Devices Society [and four others] |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (81 pages) |
| Disciplina | 621.395 |
| Soggetto topico |
Integrated circuits industry - Quality control
Three-dimensional integrated circuits Integrated circuits - Very large scale integration - Computer-aided design |
| ISBN | 1-5386-1214-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996280720903316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
2018 19th International Symposium on Quality Electronic Design : March 13-14, 2018, Santa Clara, California USA. / / IEEE Electron Devices Society [and four others]
| 2018 19th International Symposium on Quality Electronic Design : March 13-14, 2018, Santa Clara, California USA. / / IEEE Electron Devices Society [and four others] |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (81 pages) |
| Disciplina | 621.395 |
| Soggetto topico |
Integrated circuits industry - Quality control
Three-dimensional integrated circuits Integrated circuits - Very large scale integration - Computer-aided design |
| ISBN | 1-5386-1214-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910280929303321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2019 International 3D Systems Integration Conference (3DIC 2019) : October 8-10, 2019, Sendai, Japan / / Institute of Electrical and Electronics Engineers
| 2019 International 3D Systems Integration Conference (3DIC 2019) : October 8-10, 2019, Sendai, Japan / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | [Piscataway, New Jersey] : , : Institute of Electrical and Electronics Engineers, , 2019 |
| Descrizione fisica | 1 online resource (various pagings) : illustrations |
| Disciplina | 515.43 |
| Soggetto topico |
Integrated circuits - Design and construction
Three-dimensional imaging Three-dimensional integrated circuits |
| ISBN | 1-7281-4870-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910389460803321 |
| [Piscataway, New Jersey] : , : Institute of Electrical and Electronics Engineers, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2019 International 3D Systems Integration Conference (3DIC 2019) : October 8-10, 2019, Sendai, Japan / / Institute of Electrical and Electronics Engineers
| 2019 International 3D Systems Integration Conference (3DIC 2019) : October 8-10, 2019, Sendai, Japan / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | [Piscataway, New Jersey] : , : Institute of Electrical and Electronics Engineers, , 2019 |
| Descrizione fisica | 1 online resource (various pagings) : illustrations |
| Disciplina | 515.43 |
| Soggetto topico |
Integrated circuits - Design and construction
Three-dimensional imaging Three-dimensional integrated circuits |
| ISBN | 1-7281-4870-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996574613303316 |
| [Piscataway, New Jersey] : , : Institute of Electrical and Electronics Engineers, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
20th International Symposium on Quality Electronic Design : March 6-7, 2019, Santa Clara, California USA / / Institute of Electrical and Electronics Engineers
| 20th International Symposium on Quality Electronic Design : March 6-7, 2019, Santa Clara, California USA / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 |
| Descrizione fisica | 1 online resource (75 pages) |
| Disciplina | 621.395 |
| Soggetto topico |
Integrated circuits - Very large scale integration - Computer-aided design
Three-dimensional integrated circuits Integrated circuits industry - Quality control |
| ISBN | 1-7281-0392-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910320655603321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
20th International Symposium on Quality Electronic Design : March 6-7, 2019, Santa Clara, California USA / / Institute of Electrical and Electronics Engineers
| 20th International Symposium on Quality Electronic Design : March 6-7, 2019, Santa Clara, California USA / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 |
| Descrizione fisica | 1 online resource (75 pages) |
| Disciplina | 621.395 |
| Soggetto topico |
Integrated circuits - Very large scale integration - Computer-aided design
Three-dimensional integrated circuits Integrated circuits industry - Quality control |
| ISBN | 1-7281-0392-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996575389303316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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