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Electrical Engineering Experiments
| Electrical Engineering Experiments |
| Autore | Chhalotra |
| Edizione | [1st ed.] |
| Pubbl/distr/stampa | Mercury Learning and Information, 2018 |
| Descrizione fisica | 1 online resource (274 p.) |
| Soggetto topico |
TECHNOLOGY & ENGINEERING / Electronics / Circuits / General
SCIENCE / Experiments & Projects |
| ISBN |
9781683922797
1683922794 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910953499403321 |
Chhalotra
|
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| Mercury Learning and Information, 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Modeling and Simulation for Microelectronic Packaging Assembly [[electronic resource] ] : Manufacturing, Reliability and Testing
| Modeling and Simulation for Microelectronic Packaging Assembly [[electronic resource] ] : Manufacturing, Reliability and Testing |
| Autore | Liu Sheng |
| Pubbl/distr/stampa | Chicester, : Wiley, 2011 |
| Descrizione fisica | 1 online resource (588 p.) |
| Disciplina | 621.381046 |
| Altri autori (Persone) | LiuYong |
| Soggetto topico |
Microelectronic packaging - Simulation methods
Microelectronic packaging -- Simulation methods TECHNOLOGY & ENGINEERING / Electronics / Circuits / General Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| ISBN |
1-299-31442-2
0-470-82782-3 0-470-82781-5 |
| Classificazione | TEC008010 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing; Contents; Foreword by C. P. Wong; Foreword by Zhigang Suo; Preface; Acknowledgments; About the Authors; Part I: Mechanics and Modeling; 1 Constitutive Models and Finite Element Method; 1.1 Constitutive Models for Typical Materials; 1.1.1 Linear Elasticity; 1.1.2 Elastic-Visco-Plasticity; 1.2 Finite Element Method; 1.2.1 Basic Finite Element Equations; 1.2.2 Nonlinear Solution Methods; 1.2.3 Advanced Modeling Techniques in Finite Element Analysis
1.2.4 Finite Element Applications in Semiconductor Packaging Modeling1.3 Chapter Summary; References; 2 Material and Structural Testing for Small Samples; 2.1 Material Testing for Solder Joints; 2.1.1 Specimens; 2.1.2 A Thermo-Mechanical Fatigue Tester; 2.1.3 Tensile Test; 2.1.4 Creep Test; 2.1.5 Fatigue Test; 2.2 Scale Effect of Packaging Materials; 2.2.1 Specimens; 2.2.2 Experimental Results and Discussions; 2.2.3 Thin Film Scale Dependence for Polymer Thin Films; 2.3 Two-Ball Joint Specimen Fatigue Testing; 2.4 Chapter Summary; References 3 Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution3.1 Constitutive Model for Tin-Lead Solder Joint; 3.1.1 Model Formulation; 3.1.2 Determination of Material Constants; 3.1.3 Model Prediction; 3.2 Visco-Elastic-Plastic Properties and Constitutive Modeling of Underfills; 3.2.1 Constitutive Modeling of Underfills; 3.2.2 Identification of Material Constants; 3.2.3 Model Verification and Prediction; 3.3 A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys; 3.3.1 Damage Coupling Thermodynamic Framework 3.3.2 Large Deformation Formulation3.3.3 Identification of the Material Parameters; 3.3.4 Creep Damage; 3.4 User-Supplied Subroutines for Solders Considering Damage Evolution; 3.4.1 Return-Mapping Algorithm and FEA Implementation; 3.4.2 Advanced Features of the Implementation; 3.4.3 Applications of the Methodology; 3.5 Chapter Summary; References; 4 Accelerated Fatigue Life Assessment Approaches for Solders in Packages; 4.1 Life Prediction Methodology; 4.1.1 Strain-Based Approach; 4.1.2 Energy-Based Approach; 4.1.3 Fracture Mechanics-Based Approach; 4.2 Accelerated Testing Methodology 4.2.1 Failure Modes via Accelerated Testing Bounds4.2.2 Isothermal Fatigue via Thermal Fatigue; 4.3 Constitutive Modeling Methodology; 4.3.1 Separated Modeling via Unified Modeling; 4.3.2 Viscoplasticity with Damage Evolution; 4.4 Solder Joint Reliability via FEA; 4.4.1 Life Prediction of Ford Joint Specimen; 4.4.2 Accelerated Testing: Insights from Life Prediction; 4.4.3 Fatigue Life Prediction of a PQFP Package; 4.5 Life Prediction of Flip-Chip Packages; 4.5.1 Fatigue Life Prediction with and without Underfill 4.5.2 Life Prediction of Flip-Chips without Underfill via Unified and Separated Constitutive Modeling |
| Record Nr. | UNINA-9910137852403321 |
|
Liu Sheng
|
||
| Chicester, : Wiley, 2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Modeling and Simulation for Microelectronic Packaging Assembly [[electronic resource] ] : Manufacturing, Reliability and Testing
| Modeling and Simulation for Microelectronic Packaging Assembly [[electronic resource] ] : Manufacturing, Reliability and Testing |
| Autore | Liu Sheng |
| Edizione | [1st ed.] |
| Pubbl/distr/stampa | Chicester, : Wiley, 2011 |
| Descrizione fisica | 1 online resource (588 p.) |
| Disciplina | 621.381046 |
| Altri autori (Persone) | LiuYong |
| Soggetto topico |
Microelectronic packaging - Simulation methods
Microelectronic packaging -- Simulation methods TECHNOLOGY & ENGINEERING / Electronics / Circuits / General Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| ISBN |
1-299-31442-2
0-470-82782-3 0-470-82781-5 |
| Classificazione | TEC008010 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing; Contents; Foreword by C. P. Wong; Foreword by Zhigang Suo; Preface; Acknowledgments; About the Authors; Part I: Mechanics and Modeling; 1 Constitutive Models and Finite Element Method; 1.1 Constitutive Models for Typical Materials; 1.1.1 Linear Elasticity; 1.1.2 Elastic-Visco-Plasticity; 1.2 Finite Element Method; 1.2.1 Basic Finite Element Equations; 1.2.2 Nonlinear Solution Methods; 1.2.3 Advanced Modeling Techniques in Finite Element Analysis
1.2.4 Finite Element Applications in Semiconductor Packaging Modeling1.3 Chapter Summary; References; 2 Material and Structural Testing for Small Samples; 2.1 Material Testing for Solder Joints; 2.1.1 Specimens; 2.1.2 A Thermo-Mechanical Fatigue Tester; 2.1.3 Tensile Test; 2.1.4 Creep Test; 2.1.5 Fatigue Test; 2.2 Scale Effect of Packaging Materials; 2.2.1 Specimens; 2.2.2 Experimental Results and Discussions; 2.2.3 Thin Film Scale Dependence for Polymer Thin Films; 2.3 Two-Ball Joint Specimen Fatigue Testing; 2.4 Chapter Summary; References 3 Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution3.1 Constitutive Model for Tin-Lead Solder Joint; 3.1.1 Model Formulation; 3.1.2 Determination of Material Constants; 3.1.3 Model Prediction; 3.2 Visco-Elastic-Plastic Properties and Constitutive Modeling of Underfills; 3.2.1 Constitutive Modeling of Underfills; 3.2.2 Identification of Material Constants; 3.2.3 Model Verification and Prediction; 3.3 A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys; 3.3.1 Damage Coupling Thermodynamic Framework 3.3.2 Large Deformation Formulation3.3.3 Identification of the Material Parameters; 3.3.4 Creep Damage; 3.4 User-Supplied Subroutines for Solders Considering Damage Evolution; 3.4.1 Return-Mapping Algorithm and FEA Implementation; 3.4.2 Advanced Features of the Implementation; 3.4.3 Applications of the Methodology; 3.5 Chapter Summary; References; 4 Accelerated Fatigue Life Assessment Approaches for Solders in Packages; 4.1 Life Prediction Methodology; 4.1.1 Strain-Based Approach; 4.1.2 Energy-Based Approach; 4.1.3 Fracture Mechanics-Based Approach; 4.2 Accelerated Testing Methodology 4.2.1 Failure Modes via Accelerated Testing Bounds4.2.2 Isothermal Fatigue via Thermal Fatigue; 4.3 Constitutive Modeling Methodology; 4.3.1 Separated Modeling via Unified Modeling; 4.3.2 Viscoplasticity with Damage Evolution; 4.4 Solder Joint Reliability via FEA; 4.4.1 Life Prediction of Ford Joint Specimen; 4.4.2 Accelerated Testing: Insights from Life Prediction; 4.4.3 Fatigue Life Prediction of a PQFP Package; 4.5 Life Prediction of Flip-Chip Packages; 4.5.1 Fatigue Life Prediction with and without Underfill 4.5.2 Life Prediction of Flip-Chips without Underfill via Unified and Separated Constitutive Modeling |
| Record Nr. | UNINA-9910817218403321 |
|
Liu Sheng
|
||
| Chicester, : Wiley, 2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Modern Assembly Language Programming With the ARM Processor
| Modern Assembly Language Programming With the ARM Processor |
| Autore | Pyeatt Ph.D Larry D |
| Pubbl/distr/stampa | Cambridge, MA, USA, : Newnes, 2024 |
| Descrizione fisica | 1 online resource (792 p.) |
| Soggetto topico |
COMPUTERS / Programming Languages / General
COMPUTERS / Microprocessors TECHNOLOGY & ENGINEERING / Engineering (General) TECHNOLOGY & ENGINEERING / Electronics / Circuits / General |
| ISBN | 9780443141157 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9911006559903321 |
|
Pyeatt Ph.D Larry D
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| Cambridge, MA, USA, : Newnes, 2024 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
