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Failure analysis : a practical guide for manufacturers of electronic components and systems / / Marius I. Bazu, Titu-Marius I. Bajenescu
| Failure analysis : a practical guide for manufacturers of electronic components and systems / / Marius I. Bazu, Titu-Marius I. Bajenescu |
| Autore | Bazu M. I (Marius I.), <1948-> |
| Pubbl/distr/stampa | Chichester, West Sussex, U.K., : Wiley, c2011 |
| Descrizione fisica | 1 online resource (341 pages) |
| Disciplina | 621.381 |
| Altri autori (Persone) | BajenescuTitu I. <1938-> |
| Collana | Wiley series in quality & reliability engineering |
| Soggetto topico |
Electronic apparatus and appliances - Reliability
Electronic systems - Testing System failures (Engineering) - Prevention |
| ISBN |
9781119990093
1-119-99000-9 1-283-40520-2 9786613405203 1-119-99010-6 1-119-99009-2 |
| Classificazione | TEC032000 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
FAILURE ANALYSIS; Contents; Series Editor's Foreword; Foreword by Dr Craig Hillman; Series Editor's Preface; Preface; About the Authors; 1 Introduction; 1.1 The Three Goals of the Book; 1.2 Historical Perspective; 1.2.1 Reliability Prehistory; 1.2.2 The Birth of Reliability as a Discipline; 1.2.3 Historical Development of Reliability; 1.2.4 Tools for Failure Analysis; 1.3 Terminology; 1.4 State of the Art and Future Trends; 1.4.1 Techniques of Failure Analysis; 1.4.2 Failure Mechanisms; 1.4.3 Models for the Physics-of-Failure; 1.4.4 Future Trends; 1.5 General Plan of the Book; References
2 Failure Analysis - Why?2.1 Eight Possible Applications; 2.2 Forensic Engineering; 2.2.1 FA at System Level; 2.2.2 FA at Component Level; 2.3 Reliability Modelling; 2.3.1 Economic Benefits of Using Reliability Models; 2.3.2 Reliability of Humans; 2.4 Reverse Engineering; 2.5 Controlling Critical Input Variables; 2.6 Design for Reliability; 2.7 Process Improvement; 2.7.1 Reliability Assurance; 2.8 Saving Money through Early Control; 2.9 A Synergetic Approach; 2.9.1 Synergies of Technological Factors; 2.9.2 Test Structures; 2.9.3 Packaging Reliability 2.9.4 Synergies of Operational Stress Factors2.9.5 Synergetic Team; References; 3 Failure Analysis - When?; 3.1 Failure Analysis during the Development Cycle; 3.1.1 Concurrent Engineering; 3.1.2 Failure Analysis during the Design Stage; 3.1.3 Virtual Prototyping; 3.1.4 Reliability Testing during the Development Cycle; 3.2 Failure Analysis during Fabrication Preparation; 3.2.1 Reliability Analysis of Materials; 3.2.2 Degradation Phenomena in Polymers used in Electron Components; 3.3 FA during Fabrication; 3.3.1 Manufacturing History; 3.3.2 Reliability Monitoring; 3.3.3 Wafer-Level Reliability 3.3.4 Yield and Reliability3.3.5 Packaging Reliability; 3.3.6 Improving Batch Reliability: Screening and Burn-In; 3.4 FA after Fabrication; 3.4.1 Standard-Based Testing; 3.4.2 Knowledge-Based Testing; 3.5 FA during Operation; 3.5.1 Failure Types during Operation; 3.5.2 Preventive Maintenance of Electronic Systems; References; 4 Failure Analysis - How?; 4.1 Procedures for Failure Analysis; 4.2 Techniques for Decapsulating the Device and for Sample Preparation; 4.2.1 Decapping Techniques; 4.2.2 Decapsulation Techniques; 4.2.3 Cross-Sectioning; 4.2.4 Focused Ion Beam; 4.2.5 Other Techniques 4.3 Techniques for Failure Analysis4.3.1 Electrical Techniques; 4.3.2 Optical Microscopy; 4.3.3 Scanning Probe Microscopy (SPM); 4.3.4 Microthermographical Techniques; 4.3.5 Electron Microscopy; 4.3.6 X-Ray Techniques; 4.3.7 Spectroscopic Techniques; 4.3.8 Acoustic Techniques; 4.3.9 Laser Techniques; 4.3.10 Holographic Interferometry; 4.3.11 Emission Microscopy; 4.3.12 Atom Probe; 4.3.13 Neutron Radiography; 4.3.14 Electromagnetic Field Measurements; 4.3.15 Other Techniques; References; 5 Failure Analysis - What?; 5.1 Failure Modes and Mechanisms at Various Process Steps; 5.1.1 Wafer Level 5.1.2 Packaging |
| Record Nr. | UNINA-9910814322803321 |
Bazu M. I (Marius I.), <1948->
|
||
| Chichester, West Sussex, U.K., : Wiley, c2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Failure analysis [[electronic resource] ] : a practical guide for manufacturers of electronic components and systems / / Marius I. Bâzu, Titu-Marius I. Bâjenescu
| Failure analysis [[electronic resource] ] : a practical guide for manufacturers of electronic components and systems / / Marius I. Bâzu, Titu-Marius I. Bâjenescu |
| Autore | Bâzu M. I (Marius I.), <1948-> |
| Pubbl/distr/stampa | Chichester, West Sussex, U.K., : Wiley, c2011 |
| Descrizione fisica | 1 online resource (341 p.) |
| Disciplina | 621.381 |
| Altri autori (Persone) | BăjenescuTitu I. <1938-> |
| Collana | Wiley series in quality & reliability engineering |
| Soggetto topico |
Electronic apparatus and appliances - Reliability
Electronic systems - Testing System failures (Engineering) - Prevention |
| ISBN |
1-119-99000-9
1-283-40520-2 9786613405203 1-119-99010-6 1-119-99009-2 |
| Classificazione | TEC032000 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
FAILURE ANALYSIS; Contents; Series Editor's Foreword; Foreword by Dr Craig Hillman; Series Editor's Preface; Preface; About the Authors; 1 Introduction; 1.1 The Three Goals of the Book; 1.2 Historical Perspective; 1.2.1 Reliability Prehistory; 1.2.2 The Birth of Reliability as a Discipline; 1.2.3 Historical Development of Reliability; 1.2.4 Tools for Failure Analysis; 1.3 Terminology; 1.4 State of the Art and Future Trends; 1.4.1 Techniques of Failure Analysis; 1.4.2 Failure Mechanisms; 1.4.3 Models for the Physics-of-Failure; 1.4.4 Future Trends; 1.5 General Plan of the Book; References
2 Failure Analysis - Why?2.1 Eight Possible Applications; 2.2 Forensic Engineering; 2.2.1 FA at System Level; 2.2.2 FA at Component Level; 2.3 Reliability Modelling; 2.3.1 Economic Benefits of Using Reliability Models; 2.3.2 Reliability of Humans; 2.4 Reverse Engineering; 2.5 Controlling Critical Input Variables; 2.6 Design for Reliability; 2.7 Process Improvement; 2.7.1 Reliability Assurance; 2.8 Saving Money through Early Control; 2.9 A Synergetic Approach; 2.9.1 Synergies of Technological Factors; 2.9.2 Test Structures; 2.9.3 Packaging Reliability 2.9.4 Synergies of Operational Stress Factors2.9.5 Synergetic Team; References; 3 Failure Analysis - When?; 3.1 Failure Analysis during the Development Cycle; 3.1.1 Concurrent Engineering; 3.1.2 Failure Analysis during the Design Stage; 3.1.3 Virtual Prototyping; 3.1.4 Reliability Testing during the Development Cycle; 3.2 Failure Analysis during Fabrication Preparation; 3.2.1 Reliability Analysis of Materials; 3.2.2 Degradation Phenomena in Polymers used in Electron Components; 3.3 FA during Fabrication; 3.3.1 Manufacturing History; 3.3.2 Reliability Monitoring; 3.3.3 Wafer-Level Reliability 3.3.4 Yield and Reliability3.3.5 Packaging Reliability; 3.3.6 Improving Batch Reliability: Screening and Burn-In; 3.4 FA after Fabrication; 3.4.1 Standard-Based Testing; 3.4.2 Knowledge-Based Testing; 3.5 FA during Operation; 3.5.1 Failure Types during Operation; 3.5.2 Preventive Maintenance of Electronic Systems; References; 4 Failure Analysis - How?; 4.1 Procedures for Failure Analysis; 4.2 Techniques for Decapsulating the Device and for Sample Preparation; 4.2.1 Decapping Techniques; 4.2.2 Decapsulation Techniques; 4.2.3 Cross-Sectioning; 4.2.4 Focused Ion Beam; 4.2.5 Other Techniques 4.3 Techniques for Failure Analysis4.3.1 Electrical Techniques; 4.3.2 Optical Microscopy; 4.3.3 Scanning Probe Microscopy (SPM); 4.3.4 Microthermographical Techniques; 4.3.5 Electron Microscopy; 4.3.6 X-Ray Techniques; 4.3.7 Spectroscopic Techniques; 4.3.8 Acoustic Techniques; 4.3.9 Laser Techniques; 4.3.10 Holographic Interferometry; 4.3.11 Emission Microscopy; 4.3.12 Atom Probe; 4.3.13 Neutron Radiography; 4.3.14 Electromagnetic Field Measurements; 4.3.15 Other Techniques; References; 5 Failure Analysis - What?; 5.1 Failure Modes and Mechanisms at Various Process Steps; 5.1.1 Wafer Level 5.1.2 Packaging |
| Record Nr. | UNINA-9910130867603321 |
|
Bâzu M. I (Marius I.), <1948->
|
||
| Chichester, West Sussex, U.K., : Wiley, c2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Flow boiling in microgap channels : experiment, visualization and analysis / / Tamanna Alam, Poh Seng Lee, Li-Wen Jin
| Flow boiling in microgap channels : experiment, visualization and analysis / / Tamanna Alam, Poh Seng Lee, Li-Wen Jin |
| Autore | Alam Tamanna |
| Edizione | [1st ed. 2014.] |
| Pubbl/distr/stampa | New York, : Springer, 2014 |
| Descrizione fisica | 1 online resource (xi, 84 pages) : illustrations (some color) |
| Disciplina | 621.4021 |
| Altri autori (Persone) |
LeePoh Seng
JinLi-Wen |
| Collana | SpringerBriefs in applied sciences and technology : thermal engineering and applied science |
| Soggetto topico |
Electronic apparatus and appliances - Thermal properties
Electronic apparatus and appliances - Protection Heat sinks (Electronics) Electronic packaging System failures (Engineering) - Prevention |
| ISBN | 1-4614-7190-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction -- Design and Operating Parameters -- Characteristics of Two-Phase Flow Boiling in Microgap Channel -- Comparison of Flow Boiling Characteristics between Microgap and Microchannel -- Optimization of Microgap Channel Dimension and Operating Condition -- Surface Roughness Effect on Microgap Channel -- Two-Phase Microgap Channel in Mitigating Flow Instabilities and Flow Reversal -- Two-Phase Microgap Channel Cooling Technology for Hotspots Mitigation -- Conclusions and Recommendations -- Appendix A: Uncertainty Analysis for Experimental Data -- Appendix B: Nomenclature -- Appendix C: Data Reduction. |
| Record Nr. | UNINA-9910299751903321 |
|
Alam Tamanna
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| New York, : Springer, 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
International journal of prognostics and health management
| International journal of prognostics and health management |
| Pubbl/distr/stampa | [Rochester, NY], : Prognostics and Health Management Society |
| Descrizione fisica | 1 online resource |
| Disciplina | 621.381 |
| Soggetto topico |
Electronic systems - Maintenance and repair
Electronic systems - Testing System failures (Engineering) - Prevention |
| Soggetto genere / forma | Periodicals. |
| Soggetto non controllato | Electrical Engineering |
| Formato | Materiale a stampa |
| Livello bibliografico | Periodico |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | IJPHM |
| Record Nr. | UNINA-9910141443603321 |
| [Rochester, NY], : Prognostics and Health Management Society | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
International journal of prognostics and health management
| International journal of prognostics and health management |
| Pubbl/distr/stampa | [Rochester, NY], : Prognostics and Health Management Society |
| Descrizione fisica | 1 online resource |
| Disciplina | 621.381 |
| Soggetto topico |
Electronic systems - Maintenance and repair
Electronic systems - Testing System failures (Engineering) - Prevention |
| Soggetto genere / forma | Periodicals. |
| Soggetto non controllato | Electrical Engineering |
| Formato | Materiale a stampa |
| Livello bibliografico | Periodico |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | IJPHM |
| Record Nr. | UNISA-996321619003316 |
| [Rochester, NY], : Prognostics and Health Management Society | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
Recognizing and responding to normalization of deviance / / Center for Chemical Process Safety of the American Institute of Chemical Engineers
| Recognizing and responding to normalization of deviance / / Center for Chemical Process Safety of the American Institute of Chemical Engineers |
| Pubbl/distr/stampa | Hoboken, NJ, USA : , : John Wiley & Sons, Inc. : , : American Institute of Chemical Engineers, , [2018] |
| Descrizione fisica | 1 online resource (168 pages) |
| Disciplina | 658.5/77 |
| Collana | Process safety guideline and concept books |
| Soggetto topico |
System failures (Engineering) - Prevention
Fault location (Engineering) Manufacturing processes - Safety measures Chemical plants - Safety measures Normalization of deviance (Industrial sociology) |
| ISBN |
1-119-50668-9
1-5231-1974-8 1-119-50670-0 1-119-50663-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910555077703321 |
| Hoboken, NJ, USA : , : John Wiley & Sons, Inc. : , : American Institute of Chemical Engineers, , [2018] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Recognizing and responding to normalization of deviance / / Center for Chemical Process Safety of the American Institute of Chemical Engineers
| Recognizing and responding to normalization of deviance / / Center for Chemical Process Safety of the American Institute of Chemical Engineers |
| Pubbl/distr/stampa | Hoboken, NJ, USA : , : John Wiley & Sons, Inc. : , : American Institute of Chemical Engineers, , [2018] |
| Descrizione fisica | 1 online resource (168 pages) |
| Disciplina | 658.5/77 |
| Collana | Process safety guideline and concept books |
| Soggetto topico |
System failures (Engineering) - Prevention
Fault location (Engineering) Manufacturing processes - Safety measures Chemical plants - Safety measures Normalization of deviance (Industrial sociology) |
| ISBN |
1-119-50668-9
1-5231-1974-8 1-119-50670-0 1-119-50663-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910814198003321 |
| Hoboken, NJ, USA : , : John Wiley & Sons, Inc. : , : American Institute of Chemical Engineers, , [2018] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Reliability Technology [[electronic resource] ] : Principles and Practice of Failure Prevention in Electronic Systems
| Reliability Technology [[electronic resource] ] : Principles and Practice of Failure Prevention in Electronic Systems |
| Autore | Pascoe Norman |
| Pubbl/distr/stampa | Chicester, : Wiley, 2011 |
| Descrizione fisica | 1 online resource (414 p.) |
| Disciplina | 621.381 |
| Collana | Quality and Reliability Engineering Series |
| Soggetto topico |
Electronic apparatus and appliances - Reliability
Electronic apparatus and appliances --Reliability System failures (Engineering) - Prevention System failures (Engineering) --Prevention Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| ISBN |
1-283-37410-2
9786613374103 0-470-98011-7 0-470-98010-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
RELIABILITY TECHNOLOGY: PRINCIPLES AND PRACTICE OF FAILURE PREVENTION IN ELECTRONIC SYSTEMS; Contents; Foreword by Michael Pecht; Series Editor's Preface; Preface; About the Author; Acknowledgements; 1 The Origins and Evolution of Quality and Reliability; 1.1 Sixty Years of Evolving Electronic Equipment Technology; 1.2 Manufacturing Processes - From Manual Skills to Automation; 1.3 Soldering Systems; 1.4 Component Placement Machines; 1.5 Automatic Test Equipment; 1.6 Lean Manufacturing; 1.7 Outsourcing; 1.8 Electronic System Reliability - Folklore versus Reality; 1.9 The 'Bathtub' Curve
1.10 The Truth about Arrhenius1.11 The Demise of MIL-HDBK-217; 1.12 The Benefits of Commercial Off-The-Shelf (COTS) Products; 1.13 The MoD SMART Procurement Initiative; 1.14 Why do Items Fail?; 1.15 The Importance of Understanding Physics of Failure (PoF); Summary and Questions; References; 2 Product Lifecycle Management; 2.1 Overview; 2.2 Project Management; 2.3 Project Initiation; 2.4 Project Planning; 2.5 Project Execution; 2.6 Project Closure; 2.7 A Process Capability Maturity Model; 2.8 When and How to Define The Distribution Strategy 2.9 Transfer of Design to Manufacturing - The High-Risk Phase2.10 Outsourcing - Understanding and Minimising the Risks; 2.11 How Product Reliability is Increasingly Threatened in the Twenty-First Century; Summary and Questions; References; 3 The Physics of Failure; 3.1 Overview; 3.2 Background; 3.3 Potential Failure Mechanisms in Materials and Components; 3.4 Techniques for Failure Analysis of Components and Assemblies; 3.5 Transition from Tin-Lead to Lead-Free Soldering; 3.6 High-Temperature Electronics and Extreme-Temperature Electronics; 3.7 Some Illustrations of Failure Mechanisms Summary and QuestionsReferences; 4 Heat Transfer - Theory and Practice; 4.1 Overview; 4.2 Conduction; 4.3 Convection; 4.4 Radiation; 4.5 Thermal Management; 4.6 Principles of Temperature Measurement; 4.7 Temperature Cycling and Thermal Shock; Summary and Questions; References; 5 Shock and Vibration - Theory and Practice; 5.1 Overview; 5.2 Sources of Shock Pulses in the Real Environment; 5.3 Response of Electronic Equipment to Shock Pulses; 5.4 Shock Testing; 5.5 Product Shock Fragility; 5.6 Shock and Vibration Isolation Techniques; 5.7 Sources of Vibration in the Real Environment 5.8 Response of Electronic Equipment to Vibration5.9 Vibration Testing; 5.10 Vibration-Test Fixtures; Summary and Questions; References; 6 Achieving Environmental-Test Realism; 6.1 Overview; 6.2 Environmental-Testing Objectives; 6.3 Environmental-Test Specifications and Standards; 6.4 Quality Standards; 6.5 The Role of the Test Technician; 6.6 Mechanical Testing; 6.7 Climatic Testing; 6.8 Chemical and Biological Testing; 6.9 Combined Environment Testing; 6.10 Electromagnetic Compatibility; 6.11 Avoiding Misinterpretation of Test Standards and Specifications; Summary and Questions; References 7 Essential Reliability Technology Disciplines in Design |
| Record Nr. | UNINA-9910130866103321 |
|
Pascoe Norman
|
||
| Chicester, : Wiley, 2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Reliability technology : principles and practice of failure prevention in electronic systems / / Norman Pascoe
| Reliability technology : principles and practice of failure prevention in electronic systems / / Norman Pascoe |
| Autore | Pascoe Norman |
| Edizione | [1st ed.] |
| Pubbl/distr/stampa | Chichester, West Sussex, U.K., : Wiley, 2011 |
| Descrizione fisica | 1 online resource (414 p.) |
| Disciplina | 621.381 |
| Collana | Wiley series in quality & reliability engineering |
| Soggetto topico |
Electronic apparatus and appliances - Reliability
System failures (Engineering) - Prevention |
| ISBN |
1-283-37410-2
9786613374103 0-470-98011-7 0-470-98010-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
RELIABILITY TECHNOLOGY: PRINCIPLES AND PRACTICE OF FAILURE PREVENTION IN ELECTRONIC SYSTEMS; Contents; Foreword by Michael Pecht; Series Editor's Preface; Preface; About the Author; Acknowledgements; 1 The Origins and Evolution of Quality and Reliability; 1.1 Sixty Years of Evolving Electronic Equipment Technology; 1.2 Manufacturing Processes - From Manual Skills to Automation; 1.3 Soldering Systems; 1.4 Component Placement Machines; 1.5 Automatic Test Equipment; 1.6 Lean Manufacturing; 1.7 Outsourcing; 1.8 Electronic System Reliability - Folklore versus Reality; 1.9 The 'Bathtub' Curve
1.10 The Truth about Arrhenius1.11 The Demise of MIL-HDBK-217; 1.12 The Benefits of Commercial Off-The-Shelf (COTS) Products; 1.13 The MoD SMART Procurement Initiative; 1.14 Why do Items Fail?; 1.15 The Importance of Understanding Physics of Failure (PoF); Summary and Questions; References; 2 Product Lifecycle Management; 2.1 Overview; 2.2 Project Management; 2.3 Project Initiation; 2.4 Project Planning; 2.5 Project Execution; 2.6 Project Closure; 2.7 A Process Capability Maturity Model; 2.8 When and How to Define The Distribution Strategy 2.9 Transfer of Design to Manufacturing - The High-Risk Phase2.10 Outsourcing - Understanding and Minimising the Risks; 2.11 How Product Reliability is Increasingly Threatened in the Twenty-First Century; Summary and Questions; References; 3 The Physics of Failure; 3.1 Overview; 3.2 Background; 3.3 Potential Failure Mechanisms in Materials and Components; 3.4 Techniques for Failure Analysis of Components and Assemblies; 3.5 Transition from Tin-Lead to Lead-Free Soldering; 3.6 High-Temperature Electronics and Extreme-Temperature Electronics; 3.7 Some Illustrations of Failure Mechanisms Summary and QuestionsReferences; 4 Heat Transfer - Theory and Practice; 4.1 Overview; 4.2 Conduction; 4.3 Convection; 4.4 Radiation; 4.5 Thermal Management; 4.6 Principles of Temperature Measurement; 4.7 Temperature Cycling and Thermal Shock; Summary and Questions; References; 5 Shock and Vibration - Theory and Practice; 5.1 Overview; 5.2 Sources of Shock Pulses in the Real Environment; 5.3 Response of Electronic Equipment to Shock Pulses; 5.4 Shock Testing; 5.5 Product Shock Fragility; 5.6 Shock and Vibration Isolation Techniques; 5.7 Sources of Vibration in the Real Environment 5.8 Response of Electronic Equipment to Vibration5.9 Vibration Testing; 5.10 Vibration-Test Fixtures; Summary and Questions; References; 6 Achieving Environmental-Test Realism; 6.1 Overview; 6.2 Environmental-Testing Objectives; 6.3 Environmental-Test Specifications and Standards; 6.4 Quality Standards; 6.5 The Role of the Test Technician; 6.6 Mechanical Testing; 6.7 Climatic Testing; 6.8 Chemical and Biological Testing; 6.9 Combined Environment Testing; 6.10 Electromagnetic Compatibility; 6.11 Avoiding Misinterpretation of Test Standards and Specifications; Summary and Questions; References 7 Essential Reliability Technology Disciplines in Design |
| Record Nr. | UNINA-9910814320203321 |
|
Pascoe Norman
|
||
| Chichester, West Sussex, U.K., : Wiley, 2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Risk assessment : tools, techniques, and their applications / / Lee T. Ostrom, Cheryl A. Wilhelmsen
| Risk assessment : tools, techniques, and their applications / / Lee T. Ostrom, Cheryl A. Wilhelmsen |
| Autore | Ostrom Lee T. |
| Edizione | [Second edition.] |
| Pubbl/distr/stampa | Hoboken, New Jersey : , : Wiley, , [2019] |
| Descrizione fisica | 1 online resource (586 pages) |
| Disciplina | 363.102 |
| Soggetto topico |
Risk assessment - Statistical methods
System failures (Engineering) - Prevention System safety Probabilities |
| ISBN |
1-119-48341-7
1-5231-2848-8 1-119-48337-9 1-119-48334-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910555167003321 |
|
Ostrom Lee T.
|
||
| Hoboken, New Jersey : , : Wiley, , [2019] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
