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Atmospheric pressure plasma treatment of polymers : relevance to adhesion / / edited by Michael Thomas and K. L. Mittal
Atmospheric pressure plasma treatment of polymers : relevance to adhesion / / edited by Michael Thomas and K. L. Mittal
Pubbl/distr/stampa Salem, Massachusetts ; ; Hoboken, New Jersey : , : Scrivener Publishing : , : Wiley, , 2013
Descrizione fisica 1 online resource (641 p.)
Disciplina 668.4
Collana Adhesion and Adhesives: Fundamental and Applied Aspects
Soggetto topico Plastics - Finishing
Plastics - Surfaces
Surface preparation
Plasma polymerization
ISBN 1-118-74730-5
1-118-74728-3
1-118-74751-8
Classificazione TEC031030
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover; Half Title page; Title page; Copyright page; Preface; Acknowledgements; Part 1: Fundamental Aspects; Chapter 1: Combinatorial Plasma-based Surface Modification of Polymers by Means of Plasma Printing with Gas-Carrying Plasma Stamps at Ambient Pressure; 1.1 Introduction; 1.2 Experimental; 1.3 Results and Discussion; 1.4 Conclusions; Acknowledgements; References; Chapter 2: Treatment of Polymer Surfaces with Surface Dielectric Barrier Discharge Plasmas; 2.1 Introduction; 2.2 A General Overview of Surface Modification Results Obtained with Surface DBDs
2.3 An Overview of Selected Results Obtained at TNO by the SBD2.4 Conclusions; References; Chapter 3: Selective Surface Modification of Polymeric Materials by Atmospheric Pressure Plasmas: Selective Substitution Reactions on Polymer Surfaces by Different Plasmas; 3.1 Introduction; 3.2 Defluorination of Poly(tetrafluoroethylene) Surfaces; 3.3 Selective Modification of Polymeric Surfaces by Plasma; 3.4 Summary; References; Chapter 4: Permanence of Functional Groups at Polyolefin Surfaces Introduced by Dielectric Barrier Discharge Pretreatment in Presence of Aerosols; 4.1 Introduction
4.2 Experimental4.3 Results; 4.4 Discussion; 4.5 Summary; Acknowledgements; References; Chapter 5: Achieving Nano-scale Surface Structure on Wool Fabric by Atmospheric Pressure Plasma Treatment; 5.1 Introduction; 5.2 Experimental; 5.3 Results and Discussion; 5.4 Conclusions; Acknowledgements; References; Chapter 6: Deposition of Nanosilica Coatings on Plasma Activated Polyethylene Films; 6.1 Introduction; 6.2 Experimental; 6.3 Results and Discussion; 6.4 Conclusions; Acknowledgement; References; Chapter 7: Atmospheric Plasma Treatment of Polymers for Biomedical Applications; 7.1 Introduction
7.2 Plasma for Materials Processing7.3 Atmospheric Plasma Sources; 7.4 Effects of Plasma on Polymer Surface; 7.5 Atmospheric Plasma in Biomedical Applications; 7.6 Conclusion; References; Part 2: Adhesion Enhancement; Chapter 8: Atmospheric Pressure Plasma Polymerization Surface Treatments by Dielectric Barrier Discharge for Enhanced Polymer-Polymer and Metal-Polymer Adhesion; 8.1 Introduction; 8.2 Atmospheric Plasma Polymerization Processes; 8.3 Atmospheric Plasma Surface Modification for Enhanced Adhesion; 8.4 Applications of Adhesion Improvement Using Atmospheric Pressure Plasma Treatments
8.5 ConclusionReferences; Chapter 9: Adhesion Improvement by Nitrogen Functionalization of Polymers Using DBD-based Plasma Sources at Ambient Pressure; 9.1 Introduction; 9.2 Amino Functionalization with Nitrogen-Containing Gases; 9.3 Adhesion Promotion by Amino Functionalization with Nitrogen-Containing Gases; 9.4 Conclusion; Acknowledgements; References; Chapter 10: Adhesion Improvement of Polypropylene through Aerosol Assisted Plasma Deposition at Atmospheric Pressure; 10.1 Introduction; 10.2 Experimental; 10.3 Results and Discussion; 10.4 Conclusions; Acknowledgments; References
Chapter 11: The Effect of Helium-Air, Helium-Water Vapor, Helium-Oxygen, and Helium-Nitrogen Atmospheric Pressure Plasmas on the Adhesion Strength of Polyethylene
Record Nr. UNINA-9910141835903321
Salem, Massachusetts ; ; Hoboken, New Jersey : , : Scrivener Publishing : , : Wiley, , 2013
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Atmospheric pressure plasma treatment of polymers : relevance to adhesion / / edited by Michael Thomas and K. L. Mittal
Atmospheric pressure plasma treatment of polymers : relevance to adhesion / / edited by Michael Thomas and K. L. Mittal
Pubbl/distr/stampa Salem, Massachusetts ; ; Hoboken, New Jersey : , : Scrivener Publishing : , : Wiley, , 2013
Descrizione fisica 1 online resource (641 p.)
Disciplina 668.4
Collana Adhesion and Adhesives: Fundamental and Applied Aspects
Soggetto topico Plastics - Finishing
Plastics - Surfaces
Surface preparation
Plasma polymerization
ISBN 1-118-74730-5
1-118-74728-3
1-118-74751-8
Classificazione TEC031030
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover; Half Title page; Title page; Copyright page; Preface; Acknowledgements; Part 1: Fundamental Aspects; Chapter 1: Combinatorial Plasma-based Surface Modification of Polymers by Means of Plasma Printing with Gas-Carrying Plasma Stamps at Ambient Pressure; 1.1 Introduction; 1.2 Experimental; 1.3 Results and Discussion; 1.4 Conclusions; Acknowledgements; References; Chapter 2: Treatment of Polymer Surfaces with Surface Dielectric Barrier Discharge Plasmas; 2.1 Introduction; 2.2 A General Overview of Surface Modification Results Obtained with Surface DBDs
2.3 An Overview of Selected Results Obtained at TNO by the SBD2.4 Conclusions; References; Chapter 3: Selective Surface Modification of Polymeric Materials by Atmospheric Pressure Plasmas: Selective Substitution Reactions on Polymer Surfaces by Different Plasmas; 3.1 Introduction; 3.2 Defluorination of Poly(tetrafluoroethylene) Surfaces; 3.3 Selective Modification of Polymeric Surfaces by Plasma; 3.4 Summary; References; Chapter 4: Permanence of Functional Groups at Polyolefin Surfaces Introduced by Dielectric Barrier Discharge Pretreatment in Presence of Aerosols; 4.1 Introduction
4.2 Experimental4.3 Results; 4.4 Discussion; 4.5 Summary; Acknowledgements; References; Chapter 5: Achieving Nano-scale Surface Structure on Wool Fabric by Atmospheric Pressure Plasma Treatment; 5.1 Introduction; 5.2 Experimental; 5.3 Results and Discussion; 5.4 Conclusions; Acknowledgements; References; Chapter 6: Deposition of Nanosilica Coatings on Plasma Activated Polyethylene Films; 6.1 Introduction; 6.2 Experimental; 6.3 Results and Discussion; 6.4 Conclusions; Acknowledgement; References; Chapter 7: Atmospheric Plasma Treatment of Polymers for Biomedical Applications; 7.1 Introduction
7.2 Plasma for Materials Processing7.3 Atmospheric Plasma Sources; 7.4 Effects of Plasma on Polymer Surface; 7.5 Atmospheric Plasma in Biomedical Applications; 7.6 Conclusion; References; Part 2: Adhesion Enhancement; Chapter 8: Atmospheric Pressure Plasma Polymerization Surface Treatments by Dielectric Barrier Discharge for Enhanced Polymer-Polymer and Metal-Polymer Adhesion; 8.1 Introduction; 8.2 Atmospheric Plasma Polymerization Processes; 8.3 Atmospheric Plasma Surface Modification for Enhanced Adhesion; 8.4 Applications of Adhesion Improvement Using Atmospheric Pressure Plasma Treatments
8.5 ConclusionReferences; Chapter 9: Adhesion Improvement by Nitrogen Functionalization of Polymers Using DBD-based Plasma Sources at Ambient Pressure; 9.1 Introduction; 9.2 Amino Functionalization with Nitrogen-Containing Gases; 9.3 Adhesion Promotion by Amino Functionalization with Nitrogen-Containing Gases; 9.4 Conclusion; Acknowledgements; References; Chapter 10: Adhesion Improvement of Polypropylene through Aerosol Assisted Plasma Deposition at Atmospheric Pressure; 10.1 Introduction; 10.2 Experimental; 10.3 Results and Discussion; 10.4 Conclusions; Acknowledgments; References
Chapter 11: The Effect of Helium-Air, Helium-Water Vapor, Helium-Oxygen, and Helium-Nitrogen Atmospheric Pressure Plasmas on the Adhesion Strength of Polyethylene
Record Nr. UNINA-9910825712203321
Salem, Massachusetts ; ; Hoboken, New Jersey : , : Scrivener Publishing : , : Wiley, , 2013
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Handbook of adhesives and surface preparation [[electronic resource] ] : technology, applications and manufacturing / / edited by Sina Ebnesajjad
Handbook of adhesives and surface preparation [[electronic resource] ] : technology, applications and manufacturing / / edited by Sina Ebnesajjad
Pubbl/distr/stampa Amsterdam ; ; Boston, : Elsevier/WA, 2011
Descrizione fisica 1 online resource (449 p.)
Disciplina 620.199
Altri autori (Persone) EbnesajjadSina
Collana Plastics Design Library
Soggetto topico Adhesives
Surface preparation
Soggetto genere / forma Electronic books.
ISBN 1-282-95556-X
9786612955563
1-4377-4462-1
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Front Cover; Handbook of Adhesives and Surface Preparation; Copyright; Contents; Acknowledgments; Dedication; Preface; Part I:Introduction; Chapter 1 Introduction and Adhesion Theories; 1.1Definition of Adhesives and Adhesive Bonding; 1.2Functions of Adhesives; 1.3Classification of Adhesives; 1.4Advantages and Disadvantages of Joining Using Adhesives; 1.5 Requirements of a Good Bond; 1.6Introduction to Theories of Adhesion; 1.7Definition of Failure Modes; 1.8Mechanisms of Bond Failure; References; Chapter 2 Introduction to Surface Preparation and Adhesion
2.1Definition of Surface Preparation, Adhesives, and Adhesive Bonding2.2Introduction to Surface Treatment; 2.3 Requirements of a Good Adhesive Bon; References; Part II:Surface Preparation; Chapter 3 Surface Tension and Its Measurement; 3.1Introduction; 3.2What is an Interface?; 3.3Surface Tension; 3.4Surface Free Energy; 3.5Contact Angle (Young's Equation); 3.6Laplace's Equation; 3.7Effect of Temperature on Surface Tension; 3.8Surface Tension Measurement; References; Chapter 4 Surface and Material Characterization Techniques; 4.1Introduction; 4.2Infrared Spectroscopy; 4.3Raman Spectroscopy
4.4Scanning Electron Microscopy (SEM)4.5Rutherford Backscattering Theory; 4.6Energy Dispersive X-Ray Spectroscopy (EDS); 4.7Transmission Electron Microscopy (TEM); 4.8Electron Spectroscopy for Chemical Analysis (ESCA); 4.9Auger Electron Spectroscopy (AES); 4.10Ion Scattering Spectroscopy (ISS); 4.11Secondary Ion Mass Spectroscopy (SIMS); 4.12Mass Spectroscopy (MS) or spectrometry; 4.13Gas Chromatography (GC); 4.14Nuclear Magnetic Resonance (NMR); 4.15Differential Scanning Calorimetry (DSC); 4.16Differential Thermal Analysis (DTA); 4.17Dynamic Mechanical Analysis (DMA)
4.18Thermogravimetric Analysis (TGA)References; Chapter 5 Material Surface Preparation Techniques; 5.1Introduction; 5.2General Considerations; 5.3Surface Treatment of Metals; 5.4Cleaning (Degreasing) Metals; 5.5Priming; 5.6Surface Treatment of Plastics; 5.7Methods for Evaluating Effectiveness of Surface Preparation; 5.8Surface Exposure Time (SET); References; Chapter 6 Surface Preparation of Metals; 6.1Introduction; 6.2Aluminum; 6.3Beryllium; 6.4Brass; 6.5Bronze; 6.6Cadmium; 6.7Copper and Copper Alloys; 6.8Gold; 6.9Magnesium and Magnesium Alloys; 6.10Nickel and Nickel Alloys; 6.11Platinum
6.12Silver6.13Steel; 6.14Stainless Steel; 6.15Tin; 6.16Titanium; 6.17Tungsten and Alloys; 6.18Uranium; 6.19Zinc and Alloys; 6.20Weldbonding Metals; 6.21Conclusions; References; Chapter 7 Surface Preparation of Thermoplastics, Thermosets, and Elastomers; 7.1Introduction; 7.2Thermoplastics; 7.3Thermosets; 7.4Reinforced Plastics/Thermosets; 7.5Reinforced Thermoplastics (Glass-Reinforced); 7.6Plastic Foams; 7.7Surface Preparation of Rubbers; 7.8Thermoplastic Elastomer; 7.9Painted Surfaces; 7.10Conclusions; References; Part III:Adhesive Characteristics
Chapter 8 Characteristics of Adhesive Materials
Record Nr. UNINA-9910459552803321
Amsterdam ; ; Boston, : Elsevier/WA, 2011
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Handbook of adhesives and surface preparation [[electronic resource] ] : technology, applications and manufacturing / / edited by Sina Ebnesajjad
Handbook of adhesives and surface preparation [[electronic resource] ] : technology, applications and manufacturing / / edited by Sina Ebnesajjad
Pubbl/distr/stampa Amsterdam ; ; Boston, : Elsevier/WA, 2011
Descrizione fisica 1 online resource (449 p.)
Disciplina 620.199
Altri autori (Persone) EbnesajjadSina
Collana Plastics Design Library
Soggetto topico Adhesives
Surface preparation
ISBN 1-282-95556-X
9786612955563
1-4377-4462-1
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Front Cover; Handbook of Adhesives and Surface Preparation; Copyright; Contents; Acknowledgments; Dedication; Preface; Part I:Introduction; Chapter 1 Introduction and Adhesion Theories; 1.1Definition of Adhesives and Adhesive Bonding; 1.2Functions of Adhesives; 1.3Classification of Adhesives; 1.4Advantages and Disadvantages of Joining Using Adhesives; 1.5 Requirements of a Good Bond; 1.6Introduction to Theories of Adhesion; 1.7Definition of Failure Modes; 1.8Mechanisms of Bond Failure; References; Chapter 2 Introduction to Surface Preparation and Adhesion
2.1Definition of Surface Preparation, Adhesives, and Adhesive Bonding2.2Introduction to Surface Treatment; 2.3 Requirements of a Good Adhesive Bon; References; Part II:Surface Preparation; Chapter 3 Surface Tension and Its Measurement; 3.1Introduction; 3.2What is an Interface?; 3.3Surface Tension; 3.4Surface Free Energy; 3.5Contact Angle (Young's Equation); 3.6Laplace's Equation; 3.7Effect of Temperature on Surface Tension; 3.8Surface Tension Measurement; References; Chapter 4 Surface and Material Characterization Techniques; 4.1Introduction; 4.2Infrared Spectroscopy; 4.3Raman Spectroscopy
4.4Scanning Electron Microscopy (SEM)4.5Rutherford Backscattering Theory; 4.6Energy Dispersive X-Ray Spectroscopy (EDS); 4.7Transmission Electron Microscopy (TEM); 4.8Electron Spectroscopy for Chemical Analysis (ESCA); 4.9Auger Electron Spectroscopy (AES); 4.10Ion Scattering Spectroscopy (ISS); 4.11Secondary Ion Mass Spectroscopy (SIMS); 4.12Mass Spectroscopy (MS) or spectrometry; 4.13Gas Chromatography (GC); 4.14Nuclear Magnetic Resonance (NMR); 4.15Differential Scanning Calorimetry (DSC); 4.16Differential Thermal Analysis (DTA); 4.17Dynamic Mechanical Analysis (DMA)
4.18Thermogravimetric Analysis (TGA)References; Chapter 5 Material Surface Preparation Techniques; 5.1Introduction; 5.2General Considerations; 5.3Surface Treatment of Metals; 5.4Cleaning (Degreasing) Metals; 5.5Priming; 5.6Surface Treatment of Plastics; 5.7Methods for Evaluating Effectiveness of Surface Preparation; 5.8Surface Exposure Time (SET); References; Chapter 6 Surface Preparation of Metals; 6.1Introduction; 6.2Aluminum; 6.3Beryllium; 6.4Brass; 6.5Bronze; 6.6Cadmium; 6.7Copper and Copper Alloys; 6.8Gold; 6.9Magnesium and Magnesium Alloys; 6.10Nickel and Nickel Alloys; 6.11Platinum
6.12Silver6.13Steel; 6.14Stainless Steel; 6.15Tin; 6.16Titanium; 6.17Tungsten and Alloys; 6.18Uranium; 6.19Zinc and Alloys; 6.20Weldbonding Metals; 6.21Conclusions; References; Chapter 7 Surface Preparation of Thermoplastics, Thermosets, and Elastomers; 7.1Introduction; 7.2Thermoplastics; 7.3Thermosets; 7.4Reinforced Plastics/Thermosets; 7.5Reinforced Thermoplastics (Glass-Reinforced); 7.6Plastic Foams; 7.7Surface Preparation of Rubbers; 7.8Thermoplastic Elastomer; 7.9Painted Surfaces; 7.10Conclusions; References; Part III:Adhesive Characteristics
Chapter 8 Characteristics of Adhesive Materials
Record Nr. UNINA-9910785305803321
Amsterdam ; ; Boston, : Elsevier/WA, 2011
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Handbook of adhesives and surface preparation [[electronic resource] ] : technology, applications and manufacturing / / edited by Sina Ebnesajjad
Handbook of adhesives and surface preparation [[electronic resource] ] : technology, applications and manufacturing / / edited by Sina Ebnesajjad
Pubbl/distr/stampa Amsterdam ; ; Boston, : Elsevier/WA, 2011
Descrizione fisica 1 online resource (449 p.)
Disciplina 620.199
Altri autori (Persone) EbnesajjadSina
Collana Plastics Design Library
Soggetto topico Adhesives
Surface preparation
ISBN 1-282-95556-X
9786612955563
1-4377-4462-1
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Front Cover; Handbook of Adhesives and Surface Preparation; Copyright; Contents; Acknowledgments; Dedication; Preface; Part I:Introduction; Chapter 1 Introduction and Adhesion Theories; 1.1Definition of Adhesives and Adhesive Bonding; 1.2Functions of Adhesives; 1.3Classification of Adhesives; 1.4Advantages and Disadvantages of Joining Using Adhesives; 1.5 Requirements of a Good Bond; 1.6Introduction to Theories of Adhesion; 1.7Definition of Failure Modes; 1.8Mechanisms of Bond Failure; References; Chapter 2 Introduction to Surface Preparation and Adhesion
2.1Definition of Surface Preparation, Adhesives, and Adhesive Bonding2.2Introduction to Surface Treatment; 2.3 Requirements of a Good Adhesive Bon; References; Part II:Surface Preparation; Chapter 3 Surface Tension and Its Measurement; 3.1Introduction; 3.2What is an Interface?; 3.3Surface Tension; 3.4Surface Free Energy; 3.5Contact Angle (Young's Equation); 3.6Laplace's Equation; 3.7Effect of Temperature on Surface Tension; 3.8Surface Tension Measurement; References; Chapter 4 Surface and Material Characterization Techniques; 4.1Introduction; 4.2Infrared Spectroscopy; 4.3Raman Spectroscopy
4.4Scanning Electron Microscopy (SEM)4.5Rutherford Backscattering Theory; 4.6Energy Dispersive X-Ray Spectroscopy (EDS); 4.7Transmission Electron Microscopy (TEM); 4.8Electron Spectroscopy for Chemical Analysis (ESCA); 4.9Auger Electron Spectroscopy (AES); 4.10Ion Scattering Spectroscopy (ISS); 4.11Secondary Ion Mass Spectroscopy (SIMS); 4.12Mass Spectroscopy (MS) or spectrometry; 4.13Gas Chromatography (GC); 4.14Nuclear Magnetic Resonance (NMR); 4.15Differential Scanning Calorimetry (DSC); 4.16Differential Thermal Analysis (DTA); 4.17Dynamic Mechanical Analysis (DMA)
4.18Thermogravimetric Analysis (TGA)References; Chapter 5 Material Surface Preparation Techniques; 5.1Introduction; 5.2General Considerations; 5.3Surface Treatment of Metals; 5.4Cleaning (Degreasing) Metals; 5.5Priming; 5.6Surface Treatment of Plastics; 5.7Methods for Evaluating Effectiveness of Surface Preparation; 5.8Surface Exposure Time (SET); References; Chapter 6 Surface Preparation of Metals; 6.1Introduction; 6.2Aluminum; 6.3Beryllium; 6.4Brass; 6.5Bronze; 6.6Cadmium; 6.7Copper and Copper Alloys; 6.8Gold; 6.9Magnesium and Magnesium Alloys; 6.10Nickel and Nickel Alloys; 6.11Platinum
6.12Silver6.13Steel; 6.14Stainless Steel; 6.15Tin; 6.16Titanium; 6.17Tungsten and Alloys; 6.18Uranium; 6.19Zinc and Alloys; 6.20Weldbonding Metals; 6.21Conclusions; References; Chapter 7 Surface Preparation of Thermoplastics, Thermosets, and Elastomers; 7.1Introduction; 7.2Thermoplastics; 7.3Thermosets; 7.4Reinforced Plastics/Thermosets; 7.5Reinforced Thermoplastics (Glass-Reinforced); 7.6Plastic Foams; 7.7Surface Preparation of Rubbers; 7.8Thermoplastic Elastomer; 7.9Painted Surfaces; 7.10Conclusions; References; Part III:Adhesive Characteristics
Chapter 8 Characteristics of Adhesive Materials
Record Nr. UNINA-9910822981203321
Amsterdam ; ; Boston, : Elsevier/WA, 2011
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Handbook of cleaning for semiconductor manufacturing [[electronic resource] ] : fundamentals and applications / / Karen A. Reinhardt, Richard F. Reidy
Handbook of cleaning for semiconductor manufacturing [[electronic resource] ] : fundamentals and applications / / Karen A. Reinhardt, Richard F. Reidy
Autore Reinhardt Karen A
Edizione [1st edition]
Pubbl/distr/stampa Salem, Mass. ; ; Scrivener ; ; Hoboken, N.J., : John Wiley & Sons, Inc., c2011
Descrizione fisica 1 online resource (616 p.)
Disciplina 621.38152
Altri autori (Persone) ReidyRichard F. <1960->
Collana Wiley-Scrivener
Soggetto topico Semiconductors - Surfaces - Cleaning
Surface preparation
ISBN 1-118-09951-6
1-283-37459-5
9786613374592
1-118-07173-5
1-61344-177-0
1-118-07174-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications; Contents; Foreword; Introduction; Part 1: Fundamentals; 1. Surface and Colloidal Chemical Aspects of Wet Cleaning; 1.1 Introduction to Surface Chemical Aspects of Cleaning; 1.2 Chemistry of Solid-Water Interface; 1.2.1 Surface Charging of Oxide Films in Aqueous Solutions; 1.2.2 Surface Charging of Silicon Nitride Films in Aqueous Solutions; 1.2.3 Electrified Interfaces: The Double Layer and Zeta Potential; 1.2.3.1 Oxide Films and Particles; 1.2.3.2 Nitride Films and Particles
1.3 Particulate Contamination: Theory and Measurements1.3.1 Effect of the Electric Double Layer Formation on Particulate Contamination; 1.3.2 Direct Measurement of Interaction Forces between Particles and Surfaces; 1.4 Influence of Surface Electrical Charges on Metal Ion Adsorption; 1.5 Wettability of Surfaces; 1.5.1 Surface Tension and Surface Energy; 1.5.2 Adsorption Characteristics and Wettability Modification; 1.6 High Aspect Ratio Cleaning: Narrow Structures; 1.6.1 Rate of Liquid Penetration into Narrow Structures; 1.6.2 Enhancement of Liquid Penetration into Narrow Structures
1.7 Surface Tension Gradient: Application to Drying1.7.1 Isopropyl Alcohol Surface Tension Gradient Drying; 1.7.2 Water Layer After Drying; 1.7.3 Alternate Chemicals for Drying; 1.8 Summary; References; 2. The Chemistry of Wet Cleaning; 2.1 Introduction to Aqueous Cleaning; 2.1.1 Background of Aqueous Cleaning Chemistry; 2.2 Overview of Aqueous Cleaning Processes; 2.2.1 RCA Cleaning; 2.2.2 Modified RCA Processes; 2.2.3 Other Cleaning Processes; 2.3 The SC-1 Clean or APM; 2.3.1 Electrochemistry of SC-1; 2.3.2 Molecular Mechanism; 2.3.3 Etching Rate in APM; 2.3.4 Concentration Variations
2.3.5 Concentration Monitoring and Control2.3.6 APM-related Surface Roughening; 2.3.6.1 Vapor Etching; 2.3.6.2 Galvanic Etching and Masking; 2.3.6.3 Catalyzed H2O2 Depletion; 2.3.7 Metal-ion Contamination and Complexing Agents; 2.3.8 Diluted APM; 2.4 The SC-2 clean or HPM; 2.4.1 Particle Deposition; 2.4.2 Hydrogen Peroxide Decomposition in SC-2; 2.4.3 Hydrochloric Acid Fumes; 2.4.4 Diluted HC1; 2.5 Sulfuric Acid-Hydrogen Peroxide Mixture; 2.5.1 Stripping and Cleaning Mechanism; 2.5.1.1 Dissolution Reaction; 2.5.1.2 Discoloration Reaction; 2.5.2 Particulate and Sulfate Contamination
2.5.3 Alternatives2.5.3.1 Modification of SPM; 2.5.3.2 Sulfur Trioxide; 2.6 Hydrofluoric Acid; 2.6.1 Hydrogen Passivation; 2.6.2 Etching Rate Control; 2.6.3 Bath Monitoring; 2.6.3.1 Conductivity; 2.6.3.2 Near Infrared; 2.6.4 Contamination; Acknowledgments; References; 3. The Chemistry of Wet Etching; 3.1 Introduction and Overview; 3.1.1 Definition of Etching; 3.1.2 The Physics of Wet Etching; 3.1.2.1 Difference in Bond Strength; 3.1.2.2 Absence of the Proper Reactant; 3.1.2.3 Formation of Inhibiting Coatings; 3.2 Silicon Dioxide Etching; 3.2.1 Hydrofluoric Acid Etching
3.2.2 Water-based Etching
Record Nr. UNINA-9910133450903321
Reinhardt Karen A  
Salem, Mass. ; ; Scrivener ; ; Hoboken, N.J., : John Wiley & Sons, Inc., c2011
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Handbook of cleaning for semiconductor manufacturing [[electronic resource] ] : fundamentals and applications / / Karen A. Reinhardt, Richard F. Reidy
Handbook of cleaning for semiconductor manufacturing [[electronic resource] ] : fundamentals and applications / / Karen A. Reinhardt, Richard F. Reidy
Autore Reinhardt Karen A
Edizione [1st edition]
Pubbl/distr/stampa Salem, Mass. ; ; Scrivener ; ; Hoboken, N.J., : John Wiley & Sons, Inc., c2011
Descrizione fisica 1 online resource (616 p.)
Disciplina 621.38152
Altri autori (Persone) ReidyRichard F. <1960->
Collana Wiley-Scrivener
Soggetto topico Semiconductors - Surfaces - Cleaning
Surface preparation
ISBN 1-118-09951-6
1-283-37459-5
9786613374592
1-118-07173-5
1-61344-177-0
1-118-07174-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications; Contents; Foreword; Introduction; Part 1: Fundamentals; 1. Surface and Colloidal Chemical Aspects of Wet Cleaning; 1.1 Introduction to Surface Chemical Aspects of Cleaning; 1.2 Chemistry of Solid-Water Interface; 1.2.1 Surface Charging of Oxide Films in Aqueous Solutions; 1.2.2 Surface Charging of Silicon Nitride Films in Aqueous Solutions; 1.2.3 Electrified Interfaces: The Double Layer and Zeta Potential; 1.2.3.1 Oxide Films and Particles; 1.2.3.2 Nitride Films and Particles
1.3 Particulate Contamination: Theory and Measurements1.3.1 Effect of the Electric Double Layer Formation on Particulate Contamination; 1.3.2 Direct Measurement of Interaction Forces between Particles and Surfaces; 1.4 Influence of Surface Electrical Charges on Metal Ion Adsorption; 1.5 Wettability of Surfaces; 1.5.1 Surface Tension and Surface Energy; 1.5.2 Adsorption Characteristics and Wettability Modification; 1.6 High Aspect Ratio Cleaning: Narrow Structures; 1.6.1 Rate of Liquid Penetration into Narrow Structures; 1.6.2 Enhancement of Liquid Penetration into Narrow Structures
1.7 Surface Tension Gradient: Application to Drying1.7.1 Isopropyl Alcohol Surface Tension Gradient Drying; 1.7.2 Water Layer After Drying; 1.7.3 Alternate Chemicals for Drying; 1.8 Summary; References; 2. The Chemistry of Wet Cleaning; 2.1 Introduction to Aqueous Cleaning; 2.1.1 Background of Aqueous Cleaning Chemistry; 2.2 Overview of Aqueous Cleaning Processes; 2.2.1 RCA Cleaning; 2.2.2 Modified RCA Processes; 2.2.3 Other Cleaning Processes; 2.3 The SC-1 Clean or APM; 2.3.1 Electrochemistry of SC-1; 2.3.2 Molecular Mechanism; 2.3.3 Etching Rate in APM; 2.3.4 Concentration Variations
2.3.5 Concentration Monitoring and Control2.3.6 APM-related Surface Roughening; 2.3.6.1 Vapor Etching; 2.3.6.2 Galvanic Etching and Masking; 2.3.6.3 Catalyzed H2O2 Depletion; 2.3.7 Metal-ion Contamination and Complexing Agents; 2.3.8 Diluted APM; 2.4 The SC-2 clean or HPM; 2.4.1 Particle Deposition; 2.4.2 Hydrogen Peroxide Decomposition in SC-2; 2.4.3 Hydrochloric Acid Fumes; 2.4.4 Diluted HC1; 2.5 Sulfuric Acid-Hydrogen Peroxide Mixture; 2.5.1 Stripping and Cleaning Mechanism; 2.5.1.1 Dissolution Reaction; 2.5.1.2 Discoloration Reaction; 2.5.2 Particulate and Sulfate Contamination
2.5.3 Alternatives2.5.3.1 Modification of SPM; 2.5.3.2 Sulfur Trioxide; 2.6 Hydrofluoric Acid; 2.6.1 Hydrogen Passivation; 2.6.2 Etching Rate Control; 2.6.3 Bath Monitoring; 2.6.3.1 Conductivity; 2.6.3.2 Near Infrared; 2.6.4 Contamination; Acknowledgments; References; 3. The Chemistry of Wet Etching; 3.1 Introduction and Overview; 3.1.1 Definition of Etching; 3.1.2 The Physics of Wet Etching; 3.1.2.1 Difference in Bond Strength; 3.1.2.2 Absence of the Proper Reactant; 3.1.2.3 Formation of Inhibiting Coatings; 3.2 Silicon Dioxide Etching; 3.2.1 Hydrofluoric Acid Etching
3.2.2 Water-based Etching
Record Nr. UNINA-9910812396103321
Reinhardt Karen A  
Salem, Mass. ; ; Scrivener ; ; Hoboken, N.J., : John Wiley & Sons, Inc., c2011
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Laser surface modification and adhesion / / edited by K. L. Mittal, Thomas Bahners
Laser surface modification and adhesion / / edited by K. L. Mittal, Thomas Bahners
Pubbl/distr/stampa Hoboken, New Jersey : , : Scrivener Publishing : , : Wiley, , 2015
Descrizione fisica 1 online resource (441 p.)
Disciplina 620.1/10284
Collana Adhesion and Adhesives: Fundamental and Applied Aspects
Soggetto topico Surface preparation
Laser ablation
Lasers - Industrial applications
Adhesion
ISBN 1-118-83164-0
1-118-83167-5
1-118-83165-9
Classificazione TEC021000
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover; Title Page; Copyright Page; Contents; Preface; Part 1: Laser Surface Treatment/Modification to Enhance Adhesion; 1 Nd:YAG Laser Surface Treatment of Various Materials to Enhance Adhesion; 1.1 Introduction; 1.1.1 Surface Pretreatment for Adhesive Bonding; 1.1.2 Pretreatment Processes - State of the Art; 1.1.3 Solid State Nd:YAG Laser; 1.1.4 The Aim of the Current Research; 1.2 Methodology; 1.3 Experimental; 1.3.1 Materials; 1.3.2 Laser Parameters; 1.3.3 Visual Observation; 1.3.4 SEM Observation of Treated Surfaces; 1.3.5 XPS; 1.3.6 Contact Angle; 1.3.7 FTIR; 1.3.8 Joint Strength
1.3.8.1 Shear Strength of Joints1.3.8.2 Tensile Strength of Joints; 1.4 Results; 1.4.1 Polypropylene (PP); 1.4.1.1 Contact Angle; 1.4.1.2 FTIR Results; 1.4.1.3 Joint Strength Measurements; 1.4.2 Aluminum (2024 T3); 1.4.2.1 Contact Angle; 1.4.2.2 FTIR Results; 1.4.2.3 Joint Strength Measurements; 1.4.3 Polyimide (Kapton); 1.4.3.1 Contact Angle; 1.4.3.2 FTIR Results; 1.4.3.3 Joint Strength Measurements; 1.4.4 Open Time; 1.4.5 Silicone Rubber; 1.4.5.1 Contact Angle; 1.4.5.2 FTIR Results; 1.4.5.3 Joint Strengths Measurements; 1.5 Conclusions; References
2 Effects of Excimer Laser Treatment on Self-Adhesion Strength of Some Commodity (PS, PP) and Engineering (ABS) Plastics2.1 Introduction; 2.2 Background and Literature Survey; 2.2.1 Excimer Laser Surface Treatment; 2.2.1.1 Overview of Excimer Laser Processing; 2.2.1.2 Mechanism of Thermal-oxidation by Laser Irradiation; 2.2.1.3 Mechanism of Photo-oxidation by Laser Irradiation; 2.2.1.4 The Mathematical Models of Excimer Laser Surface Modification; 2.3 Ultrasonic Welding of Thermoplastics; 2.3.1 Overview of Ultrasonic Welding; 2.3.2 The Components of Ultrasonic Welder
2.3.3 Mechanism of Ultrasonic Welding and Structure Development at Semicrystalline Interface2.3.4 Modeling of Ultrasonic Welding; 2.3.5 Minimum Flow Velocity; 2.3.6 Energy Directors; 2.3.7 The Effect of Pressure Control; 2.3.8 The Effect of Ultrasonic Amplitude; 2.3.9 The Effect of Trigger Pressure; 2.3.10 The Effect of Weld Time; 2.3.11 The Effect of Horn Down Speed; 2.3.12 Ultrasonic Weldability of Thermoplastics; 2.4 Experimental Procedures; 2.4.1 Sample Preparation; 2.4.1.1 Materials; 2.4.1.2 Injection Molding; 2.4.1.3 Preparation of Samples for Laser treatment and Welding Experiments
2.4.2 Processing2.4.2.1 Excimer Laser Treatment; 2.4.2.2 Ultrasonic Welding; 2.4.3 Tensile Testing; 2.5 Results and Discussion; 2.5.1 The Effect of Ultrasonic Weld Parameters on the Weld Strength of PP; 2.5.2 The Effect of Laser Treatment on the Ultrasonic Weld Strength; 2.5.2.1 The Effect of Laser Treatment on Weld Strength of PP; 2.5.2.2 The Effect of Laser Treatment on Weld Strengths of PS and ABS; 2.5.2.3 The Effect of Pulse Number on the Weld Strength of PS and ABS; 2.5.2.4 The Effect of Laser Pulse Energy on Weld Strength of PS and ABS
2.5.2.5 The Effect of Laser Pulse Frequency on Weld Strength of PS and ABS
Record Nr. UNINA-9910140500703321
Hoboken, New Jersey : , : Scrivener Publishing : , : Wiley, , 2015
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Laser surface modification and adhesion / / edited by K. L. Mittal, Thomas Bahners
Laser surface modification and adhesion / / edited by K. L. Mittal, Thomas Bahners
Pubbl/distr/stampa Hoboken, New Jersey : , : Scrivener Publishing : , : Wiley, , 2015
Descrizione fisica 1 online resource (441 p.)
Disciplina 620.1/10284
Collana Adhesion and Adhesives: Fundamental and Applied Aspects
Soggetto topico Surface preparation
Laser ablation
Lasers - Industrial applications
Adhesion
ISBN 1-118-83164-0
1-118-83167-5
1-118-83165-9
Classificazione TEC021000
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover; Title Page; Copyright Page; Contents; Preface; Part 1: Laser Surface Treatment/Modification to Enhance Adhesion; 1 Nd:YAG Laser Surface Treatment of Various Materials to Enhance Adhesion; 1.1 Introduction; 1.1.1 Surface Pretreatment for Adhesive Bonding; 1.1.2 Pretreatment Processes - State of the Art; 1.1.3 Solid State Nd:YAG Laser; 1.1.4 The Aim of the Current Research; 1.2 Methodology; 1.3 Experimental; 1.3.1 Materials; 1.3.2 Laser Parameters; 1.3.3 Visual Observation; 1.3.4 SEM Observation of Treated Surfaces; 1.3.5 XPS; 1.3.6 Contact Angle; 1.3.7 FTIR; 1.3.8 Joint Strength
1.3.8.1 Shear Strength of Joints1.3.8.2 Tensile Strength of Joints; 1.4 Results; 1.4.1 Polypropylene (PP); 1.4.1.1 Contact Angle; 1.4.1.2 FTIR Results; 1.4.1.3 Joint Strength Measurements; 1.4.2 Aluminum (2024 T3); 1.4.2.1 Contact Angle; 1.4.2.2 FTIR Results; 1.4.2.3 Joint Strength Measurements; 1.4.3 Polyimide (Kapton); 1.4.3.1 Contact Angle; 1.4.3.2 FTIR Results; 1.4.3.3 Joint Strength Measurements; 1.4.4 Open Time; 1.4.5 Silicone Rubber; 1.4.5.1 Contact Angle; 1.4.5.2 FTIR Results; 1.4.5.3 Joint Strengths Measurements; 1.5 Conclusions; References
2 Effects of Excimer Laser Treatment on Self-Adhesion Strength of Some Commodity (PS, PP) and Engineering (ABS) Plastics2.1 Introduction; 2.2 Background and Literature Survey; 2.2.1 Excimer Laser Surface Treatment; 2.2.1.1 Overview of Excimer Laser Processing; 2.2.1.2 Mechanism of Thermal-oxidation by Laser Irradiation; 2.2.1.3 Mechanism of Photo-oxidation by Laser Irradiation; 2.2.1.4 The Mathematical Models of Excimer Laser Surface Modification; 2.3 Ultrasonic Welding of Thermoplastics; 2.3.1 Overview of Ultrasonic Welding; 2.3.2 The Components of Ultrasonic Welder
2.3.3 Mechanism of Ultrasonic Welding and Structure Development at Semicrystalline Interface2.3.4 Modeling of Ultrasonic Welding; 2.3.5 Minimum Flow Velocity; 2.3.6 Energy Directors; 2.3.7 The Effect of Pressure Control; 2.3.8 The Effect of Ultrasonic Amplitude; 2.3.9 The Effect of Trigger Pressure; 2.3.10 The Effect of Weld Time; 2.3.11 The Effect of Horn Down Speed; 2.3.12 Ultrasonic Weldability of Thermoplastics; 2.4 Experimental Procedures; 2.4.1 Sample Preparation; 2.4.1.1 Materials; 2.4.1.2 Injection Molding; 2.4.1.3 Preparation of Samples for Laser treatment and Welding Experiments
2.4.2 Processing2.4.2.1 Excimer Laser Treatment; 2.4.2.2 Ultrasonic Welding; 2.4.3 Tensile Testing; 2.5 Results and Discussion; 2.5.1 The Effect of Ultrasonic Weld Parameters on the Weld Strength of PP; 2.5.2 The Effect of Laser Treatment on the Ultrasonic Weld Strength; 2.5.2.1 The Effect of Laser Treatment on Weld Strength of PP; 2.5.2.2 The Effect of Laser Treatment on Weld Strengths of PS and ABS; 2.5.2.3 The Effect of Pulse Number on the Weld Strength of PS and ABS; 2.5.2.4 The Effect of Laser Pulse Energy on Weld Strength of PS and ABS
2.5.2.5 The Effect of Laser Pulse Frequency on Weld Strength of PS and ABS
Record Nr. UNINA-9910809114003321
Hoboken, New Jersey : , : Scrivener Publishing : , : Wiley, , 2015
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Laser technology : applications in adhesion and related areas / / edited by K. L. Mittal and Wei-Sheng Lei
Laser technology : applications in adhesion and related areas / / edited by K. L. Mittal and Wei-Sheng Lei
Pubbl/distr/stampa Hoboken, New Jersey : , : Scrivener Publishing, , 2018
Descrizione fisica 1 online resource (426 pages)
Disciplina 620.110284
Collana Adhesion and Adhesives. Fundamental and Applied Aspects
Soggetto topico Surface preparation
Laser ablation
Adhesion
Soggetto genere / forma Electronic books.
ISBN 1-119-18504-1
1-119-18508-4
1-119-18503-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Topographical modification of polymers and metals by laser ablation to create superhydrophobic surfaces / Frank L. Palmieri and Christopher J. Wohl -- Nonablative laser surface modification / Andy Hooper -- Wettability characteristics of laser surface engineered polymers / D.G. Waugh and J. Lawrence -- Laser surface modification for adhesion enhancement / Wei-Sheng Lei and Kash Mittal -- Laser surface modification in dentistry : effect on the adhesion of restorative materials / Regina Guenka Palma-Dibb, Juliana Jendiroba Faraoni, Walter Raucci-Neto and Alessandro Dibb -- Laser polymer welding / Rolf Klein -- Laser based adhesion testing technique to measure thin film-substrate interface toughness / Soma Sekhar V. Kandula -- Laser induced thin film debonding for micro-device fabrication applications / Wei-Sheng Lei and Zhishui Yu -- Laser surface cleaning : removal of hard thin ceramic coatings / S. Marimuthu, A.M. Kamara, M F Rajemi, D. Whitehead, P. Mativenga and L. Li -- Laser removal of particles from surfaces / Changho Seo, Hyesung Shin and Dongsik Kim.
Record Nr. UNINA-9910270904703321
Hoboken, New Jersey : , : Scrivener Publishing, , 2018
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui