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Biblioteca

MARC Lista (tabellare)
The art of welding / / William L. Galvery, Jr., formerly Professor of Welding Technology, Orange Coast College, California ; featuring Ryan Friedlinghaus, founder and CEO, West Coast Customs
The art of welding / / William L. Galvery, Jr., formerly Professor of Welding Technology, Orange Coast College, California ; featuring Ryan Friedlinghaus, founder and CEO, West Coast Customs
Autore Galvery William L., Jr.
Pubbl/distr/stampa South Norwalk, Connecticut : , : Industrial Press, , [2014]
Descrizione fisica 1 online resource (xiii, 256 pages) : illustrations
Disciplina 671.52
Soggetto topico Welding
Solder and soldering
ISBN 0-8311-9164-3
0-8311-9163-5
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910136666203321
Galvery William L., Jr.  
South Norwalk, Connecticut : , : Industrial Press, , [2014]
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Assembly and reliability of lead-free solder joints / / John H. Lau, Ning-Cheng Lee
Assembly and reliability of lead-free solder joints / / John H. Lau, Ning-Cheng Lee
Autore Lau John H
Edizione [1st ed. 2020.]
Pubbl/distr/stampa Singapore : , : Springer Singapore : , : Imprint : Springer, , 2020
Descrizione fisica 1 online resource (545 pages)
Disciplina 671.56
Soggetto topico Joints (Engineering)
Solder and soldering
ISBN 981-15-3920-0
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Solder Joints in Printed Circuit Board Assembly -- Solder Joints in Advanced Packaging -- Prevailing Lead-Free Materials -- Soldering Processes -- Advanced Specialty Flux Design -- Solder Joint Characterization -- Reliability Tests and Data Analyses of Solder Joints -- Design for Reliability and Failure Analysis of Solder Joints.
Record Nr. UNINA-9910403764003321
Lau John H  
Singapore : , : Springer Singapore : , : Imprint : Springer, , 2020
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Diseno para la fabricacion y ensamble de productos soldados : un enfoque metodologico y tecnologico / / Heriberto E. Maury Ramirez, Enrique Esteban Niebles Nunez, Jaime Torres Salcedo
Diseno para la fabricacion y ensamble de productos soldados : un enfoque metodologico y tecnologico / / Heriberto E. Maury Ramirez, Enrique Esteban Niebles Nunez, Jaime Torres Salcedo
Autore Maury Ramirez Heriberto Enrique
Edizione [1st ed.]
Pubbl/distr/stampa Barranquilla [Colombia], : Ediciones Uninorte, 2009
Descrizione fisica 1 online resource (310 p.)
Disciplina 745.2
Altri autori (Persone) Niebles NunezEnrique Esteban
Torres SalcedoJaime
Soggetto topico Diseno industrial
Ingenieria
Planificacion de la produccion
Soldadura - Control de la calidad
Industrial design
Production management
Solder and soldering
Soggetto genere / forma Libros electrónicos.
ISBN 958-741-911-1
958-741-042-4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione spa
Record Nr. UNINA-9910157695103321
Maury Ramirez Heriberto Enrique  
Barranquilla [Colombia], : Ediciones Uninorte, 2009
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Electroplating of lead free solder for electronics / / Shany Joseph and Girish Phatak
Electroplating of lead free solder for electronics / / Shany Joseph and Girish Phatak
Autore Joseph Shany
Pubbl/distr/stampa Hauppauge, New York : , : Nova Science Publishers, , [2011]
Descrizione fisica 1 online resource (69 pages) : illustrations
Disciplina 621.381
Collana Electrical engineering developments
Soggetto topico Lead-free electronics manufacturing processes
Electroplating
Solder and soldering
ISBN 1-61728-260-X
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto The changing face of soldering in electronics -- Options in solder materials -- Electroplating baths for promising lead-free system.
Record Nr. UNINA-9910148727703321
Joseph Shany  
Hauppauge, New York : , : Nova Science Publishers, , [2011]
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Lead free solders / / edited by Abhijit Kar
Lead free solders / / edited by Abhijit Kar
Pubbl/distr/stampa London, England : , : IntechOpen, , [2019]
Descrizione fisica 1 online resource 94 pages : illustrations
Disciplina 671.56
Soggetto topico Solder and soldering
ISBN 1-78985-460-1
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910353352203321
London, England : , : IntechOpen, , [2019]
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Lead Free Solders / / edited by Abhijit Kar
Lead Free Solders / / edited by Abhijit Kar
Pubbl/distr/stampa London : , : IntechOpen, , 2019
Descrizione fisica 1 online resource (94 pages) : illustrations
Disciplina 671.56
Soggetto topico Solder and soldering
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910688380503321
London : , : IntechOpen, , 2019
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Lead-free electronics : iNEMI projects lead to successful manufacturing / / edited by Edwin Bradley ... [et al.]
Lead-free electronics : iNEMI projects lead to successful manufacturing / / edited by Edwin Bradley ... [et al.]
Pubbl/distr/stampa Hoboken, N. J. : , : Wiley, , c2007
Descrizione fisica 1 online resource (468 p.)
Disciplina 621.381531
Altri autori (Persone) BradleyEdwin
Soggetto topico Lead-free electronics manufacturing processes
Solder and soldering
ISBN 1-281-03248-4
9786611032487
0-470-17147-2
0-470-17146-4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Preface (Ronald W. Gedney) -- Contributors -- Introduction (Jasbir Bath and Carol A. Handwerker) -- Lead-Free Assembly Project -- Alloy Group -- Process Group -- Component Group -- Reliability Group -- Follow-On Projects/Work -- 1. Alloy Selection (Carol A. Handwerker, Ursula Kattner, Kilwon Moon, Jasbir Bath, Edwin Bradley, and Polina Snugovsky) -- 1.1. Introduction -- 1.2. Lead-Free Alloys Considered by iNEMI in 1999 as Replacements for Tin-Lead Eutectic Solder -- 1.3. Fundamental Properties of Lead-Free Solder Alloys Affecting Manufacturing and Reliability -- 1.4. R&D Issues Remaining in Lead-Free Solder Implementation -- 1.5. Summary -- References -- 2. Review and Analysis of Lead-Free Solder Material Properties (Jean-Paul Clech) -- 2.1. Introduction -- 2.2. Tin-Lead Properties and Models -- 2.3. Tin-Silver Properties and Creep Data -- 2.4. Tin-Silver-Copper Properties and Creep Data -- 2.5. Alloy Comparisons -- 2.6. General Conclusions/Recommendations -- Appendix A: Tin-Silver Creep Data -- Appendix B: Tin-Silver-Copper Creep Data -- Acknowledgments -- References -- 3. Lead-Free Solder Paste Technology (Ning-Cheng Lee) -- 3.1. Introduction -- 3.2. Materials -- 3.3. Rheology -- 3.4. Applications -- 3.5. Reflow Soldering -- 3.6. Microstructures of Reflowed Joints -- 3.7. Challenges of Lead-Free Reflow Soldering -- 3.8. Summary -- References -- 4. Impact of Elevated Reflow Temperatures on Component Performance (Richard D. Parker, Jack MCCullen, Nick Lycoudes, and R. J. Arvikar) -- 4.1. Introduction to Component "Lead-Freé Issues -- 4.2. Moisture/Reflow Impact on Packaged Integrated Circuits -- 4.3. Impact of Increased Solder Peak Reflow Temperatures on Moisture Sensitivity Level Ratings -- 4.4. Impact of Increased Solder Peak Reflow Temperatures -- 4.5. Observations on Profiling for the Lead-Free Reflow Processes -- 4.6. IC Package Improvement Options for Better Package MSL at Higher Lead-Free Solder Reflow Temperatures.
4.7. Frequency Control Products -- 4.8. "Lead-Freé Cost Impact on Components -- 4.9. Packaging Identification of Lead-free Packaged ICs -- 4.10. Conclusions -- Acknowledgments -- References -- 5. Lead-Free Assembly Reliability--General (Edwin Bradley) -- 5.1. Introduction -- 5.2. Basic Physical Properties of Solder -- 5.3. Creep Deformation -- 5.4. Thermal Fatigue -- 5.5. Creep Rupture -- 5.6. Isothermal (Mechanical) Fatigue -- 5.7. Out-of-Plane Bending -- 5.8. Impact/Shock Loading -- 5.9. Effect of Rework on Reliability -- 5.10. High-Temperature Operating Life (HTOL) -- 5.11. Electrochemical Migration -- 5.12. Tin Whiskering -- 5.13. Tin Pest -- 5.14. Summary -- Acknowledgments -- References -- 6. Lead-Free Assembly Reliability: iNEMI Evaluation and Results (Elizabeth Benedetto and John Sohn) -- 6.1. Reliability Team Goals -- 6.2. Reliability Test Matrix -- 6.3. Component-Paste-Board Finish Combinations -- 6.4. Components -- 6.5. Test Vehicles -- 6.6. Pre-Test/Post-Assembly Information -- 6.7. CTE Determination: Component and Boards -- 6.8. Thermal Cycling Conditions -- 6.9. Failure Criteria -- 6.10. Thermal Cycle Relative Performance -- 6.11. Failure Data, Analysis Packages -- 6.12. Weibull Analyses -- 6.13. Post-Cycling Failure Analysis -- 6.14. Bend Testing -- 6.15. Electrochemical Migration Testing [36, 37] -- 6.16. iNEMI Team Conclusions -- 6.17. Overall Summary, Conclusions -- 6.18. ASTM Test Methods -- References -- 7. Tin Whiskers: Mitigation Strategies and Testing (Heidi L. Reynolds, C. J. Lee, and Joe Smetana) -- 7.1. Introduction -- 7.2. Mitigation Strategies -- 7.3. Tin Whisker Test Development -- 7.4. Summary -- Acknowledgments -- References -- 8. Lead-Free Reflow and Rework (Jasbir Bath) -- 8.1. Introduction -- 8.2. Printability of Lead-Free Solder Pastes -- 8.3. Soak Versus Ramp Temperature Profiles -- 8.4. Effect of Peak Temperature Versus Reflow Performance -- 8.5. Effect of Reflow Atmosphere on Solderability of Lead-Free Solder.
8.6. Convection Versus IR Reflow Ovens -- 8.7. Reflow Temperature Delta on Boards and Components -- 8.8. Visual Inspection of Lead-Free Soldered Joints -- 8.9. Automated Optical Inspection (AOI) -- 8.10. X-ray Inspection of Lead-Free Soldered Joints -- 8.11. Acoustic Microscopy Inspection of Components Before and After Lead-Free Reflow -- 8.12. Lead-Free Rework of BGA/CSP Soldered Joints -- 8.13. Lead-Free Hand-Soldering Rework -- 8.14. In-Circuit Testing and Functional Testing (ICT/FT) of Soldered Joints -- 8.15. Yield Data -- 8.16. Surface-Mount Fillet Lifting and Reliability of Reflowed Soldered Joints -- 8.17. Conclusions -- 8.18. Future Work -- Acknowledgments -- References -- 9. Case Study: Pb-Free Assembly, Rework, and Reliability Analysis of IPC Class 2 Assemblies (Jerry Gleason, Charlie Reynolds, Matt Kelly, Jasbir Bath, Quyen Chu, Ken Lyjak, and Patrick Roubaud) -- 9.1. Introduction -- 9.2. Approach and Strategy -- 9.3. Observations and Results -- 9.4. Conclusions -- 9.5. Summary -- Acknowledgments -- References -- 10. Implementing RoHS and WEEE-Compliant Products (Jim MCElroy and Cynthia Williams) -- 10.1. Introduction -- 10.2. Are Your Products within the Scope of the EU ROHS? -- 10.3. Ten Steps to ROHS Compliance -- 10.4. Part Numbering Important for Differentiating Lead-Free from Tin-Lead Components and Boards -- 10.5. A Standards-Based Approach to Materials Declaration -- 10.6. Standards -- 10.7. High-Reliability Requirements -- 10.8. Business Impact of Supply Chain Conversion -- 10.9. Summary -- References -- Index.
Record Nr. UNINA-9910144575603321
Hoboken, N. J. : , : Wiley, , c2007
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Lead-free electronics : iNEMI projects lead to successful manufacturing / / edited by Edwin Bradley ... [et al.]
Lead-free electronics : iNEMI projects lead to successful manufacturing / / edited by Edwin Bradley ... [et al.]
Pubbl/distr/stampa Hoboken, N. J. : , : Wiley, , c2007
Descrizione fisica 1 online resource (468 p.)
Disciplina 621.381531
Altri autori (Persone) BradleyEdwin
Soggetto topico Lead-free electronics manufacturing processes
Solder and soldering
ISBN 1-281-03248-4
9786611032487
0-470-17147-2
0-470-17146-4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Preface (Ronald W. Gedney) -- Contributors -- Introduction (Jasbir Bath and Carol A. Handwerker) -- Lead-Free Assembly Project -- Alloy Group -- Process Group -- Component Group -- Reliability Group -- Follow-On Projects/Work -- 1. Alloy Selection (Carol A. Handwerker, Ursula Kattner, Kilwon Moon, Jasbir Bath, Edwin Bradley, and Polina Snugovsky) -- 1.1. Introduction -- 1.2. Lead-Free Alloys Considered by iNEMI in 1999 as Replacements for Tin-Lead Eutectic Solder -- 1.3. Fundamental Properties of Lead-Free Solder Alloys Affecting Manufacturing and Reliability -- 1.4. R&D Issues Remaining in Lead-Free Solder Implementation -- 1.5. Summary -- References -- 2. Review and Analysis of Lead-Free Solder Material Properties (Jean-Paul Clech) -- 2.1. Introduction -- 2.2. Tin-Lead Properties and Models -- 2.3. Tin-Silver Properties and Creep Data -- 2.4. Tin-Silver-Copper Properties and Creep Data -- 2.5. Alloy Comparisons -- 2.6. General Conclusions/Recommendations -- Appendix A: Tin-Silver Creep Data -- Appendix B: Tin-Silver-Copper Creep Data -- Acknowledgments -- References -- 3. Lead-Free Solder Paste Technology (Ning-Cheng Lee) -- 3.1. Introduction -- 3.2. Materials -- 3.3. Rheology -- 3.4. Applications -- 3.5. Reflow Soldering -- 3.6. Microstructures of Reflowed Joints -- 3.7. Challenges of Lead-Free Reflow Soldering -- 3.8. Summary -- References -- 4. Impact of Elevated Reflow Temperatures on Component Performance (Richard D. Parker, Jack MCCullen, Nick Lycoudes, and R. J. Arvikar) -- 4.1. Introduction to Component "Lead-Freé Issues -- 4.2. Moisture/Reflow Impact on Packaged Integrated Circuits -- 4.3. Impact of Increased Solder Peak Reflow Temperatures on Moisture Sensitivity Level Ratings -- 4.4. Impact of Increased Solder Peak Reflow Temperatures -- 4.5. Observations on Profiling for the Lead-Free Reflow Processes -- 4.6. IC Package Improvement Options for Better Package MSL at Higher Lead-Free Solder Reflow Temperatures.
4.7. Frequency Control Products -- 4.8. "Lead-Freé Cost Impact on Components -- 4.9. Packaging Identification of Lead-free Packaged ICs -- 4.10. Conclusions -- Acknowledgments -- References -- 5. Lead-Free Assembly Reliability--General (Edwin Bradley) -- 5.1. Introduction -- 5.2. Basic Physical Properties of Solder -- 5.3. Creep Deformation -- 5.4. Thermal Fatigue -- 5.5. Creep Rupture -- 5.6. Isothermal (Mechanical) Fatigue -- 5.7. Out-of-Plane Bending -- 5.8. Impact/Shock Loading -- 5.9. Effect of Rework on Reliability -- 5.10. High-Temperature Operating Life (HTOL) -- 5.11. Electrochemical Migration -- 5.12. Tin Whiskering -- 5.13. Tin Pest -- 5.14. Summary -- Acknowledgments -- References -- 6. Lead-Free Assembly Reliability: iNEMI Evaluation and Results (Elizabeth Benedetto and John Sohn) -- 6.1. Reliability Team Goals -- 6.2. Reliability Test Matrix -- 6.3. Component-Paste-Board Finish Combinations -- 6.4. Components -- 6.5. Test Vehicles -- 6.6. Pre-Test/Post-Assembly Information -- 6.7. CTE Determination: Component and Boards -- 6.8. Thermal Cycling Conditions -- 6.9. Failure Criteria -- 6.10. Thermal Cycle Relative Performance -- 6.11. Failure Data, Analysis Packages -- 6.12. Weibull Analyses -- 6.13. Post-Cycling Failure Analysis -- 6.14. Bend Testing -- 6.15. Electrochemical Migration Testing [36, 37] -- 6.16. iNEMI Team Conclusions -- 6.17. Overall Summary, Conclusions -- 6.18. ASTM Test Methods -- References -- 7. Tin Whiskers: Mitigation Strategies and Testing (Heidi L. Reynolds, C. J. Lee, and Joe Smetana) -- 7.1. Introduction -- 7.2. Mitigation Strategies -- 7.3. Tin Whisker Test Development -- 7.4. Summary -- Acknowledgments -- References -- 8. Lead-Free Reflow and Rework (Jasbir Bath) -- 8.1. Introduction -- 8.2. Printability of Lead-Free Solder Pastes -- 8.3. Soak Versus Ramp Temperature Profiles -- 8.4. Effect of Peak Temperature Versus Reflow Performance -- 8.5. Effect of Reflow Atmosphere on Solderability of Lead-Free Solder.
8.6. Convection Versus IR Reflow Ovens -- 8.7. Reflow Temperature Delta on Boards and Components -- 8.8. Visual Inspection of Lead-Free Soldered Joints -- 8.9. Automated Optical Inspection (AOI) -- 8.10. X-ray Inspection of Lead-Free Soldered Joints -- 8.11. Acoustic Microscopy Inspection of Components Before and After Lead-Free Reflow -- 8.12. Lead-Free Rework of BGA/CSP Soldered Joints -- 8.13. Lead-Free Hand-Soldering Rework -- 8.14. In-Circuit Testing and Functional Testing (ICT/FT) of Soldered Joints -- 8.15. Yield Data -- 8.16. Surface-Mount Fillet Lifting and Reliability of Reflowed Soldered Joints -- 8.17. Conclusions -- 8.18. Future Work -- Acknowledgments -- References -- 9. Case Study: Pb-Free Assembly, Rework, and Reliability Analysis of IPC Class 2 Assemblies (Jerry Gleason, Charlie Reynolds, Matt Kelly, Jasbir Bath, Quyen Chu, Ken Lyjak, and Patrick Roubaud) -- 9.1. Introduction -- 9.2. Approach and Strategy -- 9.3. Observations and Results -- 9.4. Conclusions -- 9.5. Summary -- Acknowledgments -- References -- 10. Implementing RoHS and WEEE-Compliant Products (Jim MCElroy and Cynthia Williams) -- 10.1. Introduction -- 10.2. Are Your Products within the Scope of the EU ROHS? -- 10.3. Ten Steps to ROHS Compliance -- 10.4. Part Numbering Important for Differentiating Lead-Free from Tin-Lead Components and Boards -- 10.5. A Standards-Based Approach to Materials Declaration -- 10.6. Standards -- 10.7. High-Reliability Requirements -- 10.8. Business Impact of Supply Chain Conversion -- 10.9. Summary -- References -- Index.
Record Nr. UNINA-9910830113103321
Hoboken, N. J. : , : Wiley, , c2007
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Lead-free electronics : iNEMI projects lead to successful manufacturing / / edited by Edwin Bradley ... [et al.]
Lead-free electronics : iNEMI projects lead to successful manufacturing / / edited by Edwin Bradley ... [et al.]
Pubbl/distr/stampa Hoboken, N. J., : Wiley
Descrizione fisica 1 online resource (468 p.)
Disciplina 621.381531
Altri autori (Persone) BradleyEdwin
Soggetto topico Lead-free electronics manufacturing processes
Solder and soldering
ISBN 9786611032487
9781281032485
1281032484
9780470171479
0470171472
9780470171462
0470171464
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Preface (Ronald W. Gedney) -- Contributors -- Introduction (Jasbir Bath and Carol A. Handwerker) -- Lead-Free Assembly Project -- Alloy Group -- Process Group -- Component Group -- Reliability Group -- Follow-On Projects/Work -- 1. Alloy Selection (Carol A. Handwerker, Ursula Kattner, Kilwon Moon, Jasbir Bath, Edwin Bradley, and Polina Snugovsky) -- 1.1. Introduction -- 1.2. Lead-Free Alloys Considered by iNEMI in 1999 as Replacements for Tin-Lead Eutectic Solder -- 1.3. Fundamental Properties of Lead-Free Solder Alloys Affecting Manufacturing and Reliability -- 1.4. R&D Issues Remaining in Lead-Free Solder Implementation -- 1.5. Summary -- References -- 2. Review and Analysis of Lead-Free Solder Material Properties (Jean-Paul Clech) -- 2.1. Introduction -- 2.2. Tin-Lead Properties and Models -- 2.3. Tin-Silver Properties and Creep Data -- 2.4. Tin-Silver-Copper Properties and Creep Data -- 2.5. Alloy Comparisons -- 2.6. General Conclusions/Recommendations -- Appendix A: Tin-Silver Creep Data -- Appendix B: Tin-Silver-Copper Creep Data -- Acknowledgments -- References -- 3. Lead-Free Solder Paste Technology (Ning-Cheng Lee) -- 3.1. Introduction -- 3.2. Materials -- 3.3. Rheology -- 3.4. Applications -- 3.5. Reflow Soldering -- 3.6. Microstructures of Reflowed Joints -- 3.7. Challenges of Lead-Free Reflow Soldering -- 3.8. Summary -- References -- 4. Impact of Elevated Reflow Temperatures on Component Performance (Richard D. Parker, Jack MCCullen, Nick Lycoudes, and R. J. Arvikar) -- 4.1. Introduction to Component "Lead-Freé Issues -- 4.2. Moisture/Reflow Impact on Packaged Integrated Circuits -- 4.3. Impact of Increased Solder Peak Reflow Temperatures on Moisture Sensitivity Level Ratings -- 4.4. Impact of Increased Solder Peak Reflow Temperatures -- 4.5. Observations on Profiling for the Lead-Free Reflow Processes -- 4.6. IC Package Improvement Options for Better Package MSL at Higher Lead-Free Solder Reflow Temperatures.
4.7. Frequency Control Products -- 4.8. "Lead-Freé Cost Impact on Components -- 4.9. Packaging Identification of Lead-free Packaged ICs -- 4.10. Conclusions -- Acknowledgments -- References -- 5. Lead-Free Assembly Reliability--General (Edwin Bradley) -- 5.1. Introduction -- 5.2. Basic Physical Properties of Solder -- 5.3. Creep Deformation -- 5.4. Thermal Fatigue -- 5.5. Creep Rupture -- 5.6. Isothermal (Mechanical) Fatigue -- 5.7. Out-of-Plane Bending -- 5.8. Impact/Shock Loading -- 5.9. Effect of Rework on Reliability -- 5.10. High-Temperature Operating Life (HTOL) -- 5.11. Electrochemical Migration -- 5.12. Tin Whiskering -- 5.13. Tin Pest -- 5.14. Summary -- Acknowledgments -- References -- 6. Lead-Free Assembly Reliability: iNEMI Evaluation and Results (Elizabeth Benedetto and John Sohn) -- 6.1. Reliability Team Goals -- 6.2. Reliability Test Matrix -- 6.3. Component-Paste-Board Finish Combinations -- 6.4. Components -- 6.5. Test Vehicles -- 6.6. Pre-Test/Post-Assembly Information -- 6.7. CTE Determination: Component and Boards -- 6.8. Thermal Cycling Conditions -- 6.9. Failure Criteria -- 6.10. Thermal Cycle Relative Performance -- 6.11. Failure Data, Analysis Packages -- 6.12. Weibull Analyses -- 6.13. Post-Cycling Failure Analysis -- 6.14. Bend Testing -- 6.15. Electrochemical Migration Testing [36, 37] -- 6.16. iNEMI Team Conclusions -- 6.17. Overall Summary, Conclusions -- 6.18. ASTM Test Methods -- References -- 7. Tin Whiskers: Mitigation Strategies and Testing (Heidi L. Reynolds, C. J. Lee, and Joe Smetana) -- 7.1. Introduction -- 7.2. Mitigation Strategies -- 7.3. Tin Whisker Test Development -- 7.4. Summary -- Acknowledgments -- References -- 8. Lead-Free Reflow and Rework (Jasbir Bath) -- 8.1. Introduction -- 8.2. Printability of Lead-Free Solder Pastes -- 8.3. Soak Versus Ramp Temperature Profiles -- 8.4. Effect of Peak Temperature Versus Reflow Performance -- 8.5. Effect of Reflow Atmosphere on Solderability of Lead-Free Solder.
8.6. Convection Versus IR Reflow Ovens -- 8.7. Reflow Temperature Delta on Boards and Components -- 8.8. Visual Inspection of Lead-Free Soldered Joints -- 8.9. Automated Optical Inspection (AOI) -- 8.10. X-ray Inspection of Lead-Free Soldered Joints -- 8.11. Acoustic Microscopy Inspection of Components Before and After Lead-Free Reflow -- 8.12. Lead-Free Rework of BGA/CSP Soldered Joints -- 8.13. Lead-Free Hand-Soldering Rework -- 8.14. In-Circuit Testing and Functional Testing (ICT/FT) of Soldered Joints -- 8.15. Yield Data -- 8.16. Surface-Mount Fillet Lifting and Reliability of Reflowed Soldered Joints -- 8.17. Conclusions -- 8.18. Future Work -- Acknowledgments -- References -- 9. Case Study: Pb-Free Assembly, Rework, and Reliability Analysis of IPC Class 2 Assemblies (Jerry Gleason, Charlie Reynolds, Matt Kelly, Jasbir Bath, Quyen Chu, Ken Lyjak, and Patrick Roubaud) -- 9.1. Introduction -- 9.2. Approach and Strategy -- 9.3. Observations and Results -- 9.4. Conclusions -- 9.5. Summary -- Acknowledgments -- References -- 10. Implementing RoHS and WEEE-Compliant Products (Jim MCElroy and Cynthia Williams) -- 10.1. Introduction -- 10.2. Are Your Products within the Scope of the EU ROHS? -- 10.3. Ten Steps to ROHS Compliance -- 10.4. Part Numbering Important for Differentiating Lead-Free from Tin-Lead Components and Boards -- 10.5. A Standards-Based Approach to Materials Declaration -- 10.6. Standards -- 10.7. High-Reliability Requirements -- 10.8. Business Impact of Supply Chain Conversion -- 10.9. Summary -- References -- Index.
Record Nr. UNINA-9911019340303321
Hoboken, N. J., : Wiley
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Lead-free solder interconnect reliability [[electronic resource] /] / edited by Dongkai Shangguan
Lead-free solder interconnect reliability [[electronic resource] /] / edited by Dongkai Shangguan
Pubbl/distr/stampa Materials Park, OH, : ASM International, 2005
Descrizione fisica 1 online resource (302 p.)
Disciplina 621.381/046
Altri autori (Persone) ShangguanDongkai <1963->
Soggetto topico Microelectronic packaging - Reliability
Solder and soldering
Lead-free electronics manufacturing processes
Soggetto genere / forma Electronic books.
ISBN 1-61503-093-X
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto ""Contents""; ""Foreword""; ""Preface""; ""Lead-Free Soldering and Environmental Compliance: An Overview""; ""Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects""; ""Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties""; ""Lead-Free Solder Joint Reliability Trends""; ""Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects""; ""Tin Whisker Growth on Lead-Free Solder Finishes""; ""Accelerated Testing Methodology for Lead-Free Solder Interconnects""
""Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects""""Design for Reliability Finite Element Modeling of Lead-Free Solder Interconnects""; ""Characterization and Failure Analyses of Lead-Free Solder Defects""; ""Reliability of Interconnects with Conductive Adhesives""; ""Lead-Free Solder Interconnect Reliability Outlook""; ""Index""
Record Nr. UNINA-9910458703703321
Materials Park, OH, : ASM International, 2005
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui