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Future trends in microelectronics : Journey into the unknown / / edited by Serge Luryi, Jimmy Xu, Alexander Zaslavsky
| Future trends in microelectronics : Journey into the unknown / / edited by Serge Luryi, Jimmy Xu, Alexander Zaslavsky |
| Pubbl/distr/stampa | Hoboken, New Jersey : , : IEEE Press : , : Wiley, , 2016 |
| Descrizione fisica | 1 online resource (383 p.) |
| Disciplina | 621.381 |
| Soggetto topico |
Microelectronics - Technological innovations
Nanotechnology - Technological innovations Semiconductors - Technological innovations |
| ISBN |
1-119-06918-1
1-119-06917-3 1-119-06922-X |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Cover ; Title Page ; Copyright ; Contents ; List of Contributors ; Preface ; Acknowledgments ; Part I Future of Digital Silicon; 1.1 Prospects of Future Si Technologies in the Data-Driven World; 1. Introduction ; 2. Memory - DRAM ; 3. Memory - NAND ; 4. Logic technology ; 5. CMOS image sensors ; 6. Packaging technology
7. Silicon photonics technology 8. Concluding remarks ; Acknowledgments ; References ; 1.2 How Lithography Enables Moore's Law; 1. Introduction ; 2. Moore's Law and the contribution of lithography ; 3. Lithography technology: past and present ; 4. Lithography technology: future ; 5. Summary 6. Conclusion Acknowledgments ; References ; 1.3 What Happened to Post-CMOS?; 1. Introduction ; 2. General constraints on speed and energy ; 3. Guidelines for success ; 4. Benchmarking and examples ; 5. Discussion ; 6. Conclusion ; Acknowledgments ; References 1.4 Three-Dimensional Integration of Ge and Two-Dimensional Materials for One-Dimensional Devices1. Introduction ; 2. FEOL technology and materials for 3D integration ; 3. Integration of ""more than Moore"" functionality ; 4. Implications of 3D integration at the system level ; 5. Conclusion ; Acknowledgments ; References 1.5 Challenges to Ultralow-Power Semiconductor Device Operation1. Introduction ; 2. Ultimate MOS transistors ; 3. Small slope switches ; 4. Conclusion ; Acknowledgments ; References ; 1.6 A Universal Nonvolatile Processing Environment; 1. Introduction ; 2. Universal nonvolatile processing environment 3. Bias-field-free spin-torque oscillator |
| Record Nr. | UNINA-9910135026603321 |
| Hoboken, New Jersey : , : IEEE Press : , : Wiley, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Future trends in microelectronics : Journey into the unknown / / edited by Serge Luryi, Jimmy Xu, Alexander Zaslavsky
| Future trends in microelectronics : Journey into the unknown / / edited by Serge Luryi, Jimmy Xu, Alexander Zaslavsky |
| Pubbl/distr/stampa | Hoboken, New Jersey : , : IEEE Press : , : Wiley, , 2016 |
| Descrizione fisica | 1 online resource (383 p.) |
| Disciplina | 621.381 |
| Soggetto topico |
Microelectronics - Technological innovations
Nanotechnology - Technological innovations Semiconductors - Technological innovations |
| ISBN |
1-119-06918-1
1-119-06917-3 1-119-06922-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Cover ; Title Page ; Copyright ; Contents ; List of Contributors ; Preface ; Acknowledgments ; Part I Future of Digital Silicon; 1.1 Prospects of Future Si Technologies in the Data-Driven World; 1. Introduction ; 2. Memory - DRAM ; 3. Memory - NAND ; 4. Logic technology ; 5. CMOS image sensors ; 6. Packaging technology
7. Silicon photonics technology 8. Concluding remarks ; Acknowledgments ; References ; 1.2 How Lithography Enables Moore's Law; 1. Introduction ; 2. Moore's Law and the contribution of lithography ; 3. Lithography technology: past and present ; 4. Lithography technology: future ; 5. Summary 6. Conclusion Acknowledgments ; References ; 1.3 What Happened to Post-CMOS?; 1. Introduction ; 2. General constraints on speed and energy ; 3. Guidelines for success ; 4. Benchmarking and examples ; 5. Discussion ; 6. Conclusion ; Acknowledgments ; References 1.4 Three-Dimensional Integration of Ge and Two-Dimensional Materials for One-Dimensional Devices1. Introduction ; 2. FEOL technology and materials for 3D integration ; 3. Integration of ""more than Moore"" functionality ; 4. Implications of 3D integration at the system level ; 5. Conclusion ; Acknowledgments ; References 1.5 Challenges to Ultralow-Power Semiconductor Device Operation1. Introduction ; 2. Ultimate MOS transistors ; 3. Small slope switches ; 4. Conclusion ; Acknowledgments ; References ; 1.6 A Universal Nonvolatile Processing Environment; 1. Introduction ; 2. Universal nonvolatile processing environment 3. Bias-field-free spin-torque oscillator |
| Record Nr. | UNINA-9910819526203321 |
| Hoboken, New Jersey : , : IEEE Press : , : Wiley, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
