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1481-2019 - IEEE Standard for Integrated Circuit (IC) Open Library Architecture (OLA) / / Institute of Electrical and Electronics Engineers
| 1481-2019 - IEEE Standard for Integrated Circuit (IC) Open Library Architecture (OLA) / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | New York, New York : , : IEEE, , 2020 |
| Descrizione fisica | 1 online resource (641 pages) |
| Disciplina | 621.381531 |
| Soggetto topico | Printed circuits - Design and construction |
| ISBN | 1-5044-6355-2 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | 1481-2019 - IEEE Standard for Integrated Circuit |
| Record Nr. | UNINA-9910389549503321 |
| New York, New York : , : IEEE, , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
1481-2019 - IEEE Standard for Integrated Circuit (IC) Open Library Architecture (OLA) / / Institute of Electrical and Electronics Engineers
| 1481-2019 - IEEE Standard for Integrated Circuit (IC) Open Library Architecture (OLA) / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | New York, New York : , : IEEE, , 2020 |
| Descrizione fisica | 1 online resource (641 pages) |
| Disciplina | 621.381531 |
| Soggetto topico | Printed circuits - Design and construction |
| ISBN | 1-5044-6355-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | 1481-2019 - IEEE Standard for Integrated Circuit |
| Record Nr. | UNISA-996574841503316 |
| New York, New York : , : IEEE, , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
2401-2019 IEEE Standard Format for LSI-Package-Board Interoperable Design / / IEEE
| 2401-2019 IEEE Standard Format for LSI-Package-Board Interoperable Design / / IEEE |
| Pubbl/distr/stampa | New York : , : IEEE, , 2020 |
| Descrizione fisica | 1 online resource (293 pages) |
| Disciplina | 003 |
| Soggetto topico |
Large scale systems
Printed circuits - Design and construction Computer networks |
| ISBN | 1-5044-6325-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910389745903321 |
| New York : , : IEEE, , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2401-2019 IEEE Standard Format for LSI-Package-Board Interoperable Design / / IEEE
| 2401-2019 IEEE Standard Format for LSI-Package-Board Interoperable Design / / IEEE |
| Pubbl/distr/stampa | New York : , : IEEE, , 2020 |
| Descrizione fisica | 1 online resource (293 pages) |
| Disciplina | 003 |
| Soggetto topico |
Large scale systems
Printed circuits - Design and construction Computer networks |
| ISBN | 1-5044-6325-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996574742303316 |
| New York : , : IEEE, , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
2401-2019 IEEE Standard Format for LSI-Package-Board Interoperable Design - Redline / / IEEE
| 2401-2019 IEEE Standard Format for LSI-Package-Board Interoperable Design - Redline / / IEEE |
| Pubbl/distr/stampa | New York : , : IEEE, , 2020 |
| Descrizione fisica | 1 online resource (436 pages) |
| Disciplina | 003 |
| Soggetto topico |
Large scale systems
Integrated circuits Printed circuits - Design and construction Computer networks |
| ISBN | 1-5044-6508-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910389745803321 |
| New York : , : IEEE, , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2401-2019 IEEE Standard Format for LSI-Package-Board Interoperable Design - Redline / / IEEE
| 2401-2019 IEEE Standard Format for LSI-Package-Board Interoperable Design - Redline / / IEEE |
| Pubbl/distr/stampa | New York : , : IEEE, , 2020 |
| Descrizione fisica | 1 online resource (436 pages) |
| Disciplina | 003 |
| Soggetto topico |
Large scale systems
Integrated circuits Printed circuits - Design and construction Computer networks |
| ISBN | 1-5044-6508-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996574746803316 |
| New York : , : IEEE, , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
63055-2023 - IEEE/IEC International Standard--Format for LSI-Package-Board Interoperable design / / IEEE
| 63055-2023 - IEEE/IEC International Standard--Format for LSI-Package-Board Interoperable design / / IEEE |
| Pubbl/distr/stampa | New York, USA : , : IEEE, , 2023 |
| Descrizione fisica | 1 online resource (298 pages) |
| Disciplina | 621.3 |
| Soggetto topico | Printed circuits - Design and construction |
| ISBN | 979-88-557-0216-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996559972603316 |
| New York, USA : , : IEEE, , 2023 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
Complete PCB design using OrCad capture and layout [[electronic resource] /] / by Kraig Mitzner
| Complete PCB design using OrCad capture and layout [[electronic resource] /] / by Kraig Mitzner |
| Autore | Mitzner Kraig |
| Pubbl/distr/stampa | Amsterdam ; ; Boston, : Elsevier/Newnes, c2007 |
| Descrizione fisica | 1 online resource (529 p.) |
| Disciplina | 621.3815/31 |
| Soggetto topico | Printed circuits - Design and construction |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-281-01934-8
9786611019341 0-08-054920-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
FRONT COVER; COMPLETE PCB DESIGN USING ORCAD CAPTURE AND LAYOUT; COPYRIGHT PAGE; TABLE OF CONTENTS; INTRODUCTION; ACKNOWLEDGMENTS; CHAPTER 1: INTRODUCTION TO PCB DESIGN AND CAD; Computer-Aided Design and the OrCAD Design Suite; Printed Circuit Board Fabrication; PCB cores and layer stack-up; PCB fabrication process; Photolithography and chemical etching; Mechanical milling; Layer registration; Function of OrCAD Layout in the PCB Design Process; Design Files Created by Layout; Layout format files (.MAX); Postprocess (Gerber) files; PCB assembly layers and files
CHAPTER 2: INTRODUCTION TO THE PCB DESIGN FLOW BY EXAMPLEOverview of the Design Flow; Creating a Circuit Design with Capture; Starting a new project; Placing parts; Wiring (connecting) the parts; Creating the Layout netlist in Capture; Designing the PCB with Layout; Starting Layout and importing the netlist; Making a board outline; Placing the parts; Autorouting the board; Manual routing; Cleanup; Locking traces; Performing a design rule check; Postprocessing the board design for manufacturing; CHAPTER 3: PROJECT STRUCTURES AND THE LAYOUT TOOL SET; Project Setup and Schematic Entry Details Capture projects explainedCapture part libraries explained; Understanding the Layout Environment and Tool Set; Board technology files; The AutoECO utility; The session frame and Design window; The toolbar; Controlling the autorouter; Postprocessing and layer details; CHAPTER 4: INTRODUCTION TO INDUSTRY STANDARDS; Introduction to the Standards Organizations; Institute for Printed Circuits (IPC-Association Connecting Electronics Industries); Electronic Industries Alliance (EIA); Joint Electron Device Engineering Council (JEDEC); International Engineering Consortium (IEC); Military Standards American National Standards Institute (ANSI)Institute of Electrical and Electronics Engineers (IEEE); Classes and Types of PCBs; Performance classes; Producibility levels; Fabrication types and assembly subclasses; OrCAD Layout design complexity levels-IPC performance classes; IPC land pattern density levels; Introduction to Standard Fabrication Allowances; Registration tolerances; Breakout and annular ring control; PCB Dimensions and Tolerances; Standard panel sizes; Tooling area allowances and effective panel usage; Standard finished PCB thickness; Core thickness; Prepreg thickness Copper thickness for PTHs and viasCopper cladding/foil thickness; Copper Trace and Etching Tolerances; Standard Hole Dimensions; Soldermask Tolerance; End Note; Suggested reading; Other items of interest; CHAPTER 5: INTRODUCTION TO DESIGN FOR MANUFACTURING; Introduction to PCB Assembly and Soldering Processes; Assembly Processes; Manual assembly processes; Automated assembly processes (pick and place); Soldering Processes; Manual soldering; Wave soldering; Reflow soldering; Component Placement and Orientation Guide; Component Spacing for Through-hole Devices; Discrete THDs Integrated circuit through-hole devices |
| Record Nr. | UNINA-9910458571503321 |
Mitzner Kraig
|
||
| Amsterdam ; ; Boston, : Elsevier/Newnes, c2007 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Complete PCB design using OrCad capture and layout [[electronic resource] /] / by Kraig Mitzner
| Complete PCB design using OrCad capture and layout [[electronic resource] /] / by Kraig Mitzner |
| Autore | Mitzner Kraig |
| Pubbl/distr/stampa | Amsterdam ; ; Boston, : Elsevier/Newnes, c2007 |
| Descrizione fisica | 1 online resource (529 p.) |
| Disciplina | 621.3815/31 |
| Soggetto topico | Printed circuits - Design and construction |
| ISBN |
1-281-01934-8
9786611019341 0-08-054920-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
FRONT COVER; COMPLETE PCB DESIGN USING ORCAD CAPTURE AND LAYOUT; COPYRIGHT PAGE; TABLE OF CONTENTS; INTRODUCTION; ACKNOWLEDGMENTS; CHAPTER 1: INTRODUCTION TO PCB DESIGN AND CAD; Computer-Aided Design and the OrCAD Design Suite; Printed Circuit Board Fabrication; PCB cores and layer stack-up; PCB fabrication process; Photolithography and chemical etching; Mechanical milling; Layer registration; Function of OrCAD Layout in the PCB Design Process; Design Files Created by Layout; Layout format files (.MAX); Postprocess (Gerber) files; PCB assembly layers and files
CHAPTER 2: INTRODUCTION TO THE PCB DESIGN FLOW BY EXAMPLEOverview of the Design Flow; Creating a Circuit Design with Capture; Starting a new project; Placing parts; Wiring (connecting) the parts; Creating the Layout netlist in Capture; Designing the PCB with Layout; Starting Layout and importing the netlist; Making a board outline; Placing the parts; Autorouting the board; Manual routing; Cleanup; Locking traces; Performing a design rule check; Postprocessing the board design for manufacturing; CHAPTER 3: PROJECT STRUCTURES AND THE LAYOUT TOOL SET; Project Setup and Schematic Entry Details Capture projects explainedCapture part libraries explained; Understanding the Layout Environment and Tool Set; Board technology files; The AutoECO utility; The session frame and Design window; The toolbar; Controlling the autorouter; Postprocessing and layer details; CHAPTER 4: INTRODUCTION TO INDUSTRY STANDARDS; Introduction to the Standards Organizations; Institute for Printed Circuits (IPC-Association Connecting Electronics Industries); Electronic Industries Alliance (EIA); Joint Electron Device Engineering Council (JEDEC); International Engineering Consortium (IEC); Military Standards American National Standards Institute (ANSI)Institute of Electrical and Electronics Engineers (IEEE); Classes and Types of PCBs; Performance classes; Producibility levels; Fabrication types and assembly subclasses; OrCAD Layout design complexity levels-IPC performance classes; IPC land pattern density levels; Introduction to Standard Fabrication Allowances; Registration tolerances; Breakout and annular ring control; PCB Dimensions and Tolerances; Standard panel sizes; Tooling area allowances and effective panel usage; Standard finished PCB thickness; Core thickness; Prepreg thickness Copper thickness for PTHs and viasCopper cladding/foil thickness; Copper Trace and Etching Tolerances; Standard Hole Dimensions; Soldermask Tolerance; End Note; Suggested reading; Other items of interest; CHAPTER 5: INTRODUCTION TO DESIGN FOR MANUFACTURING; Introduction to PCB Assembly and Soldering Processes; Assembly Processes; Manual assembly processes; Automated assembly processes (pick and place); Soldering Processes; Manual soldering; Wave soldering; Reflow soldering; Component Placement and Orientation Guide; Component Spacing for Through-hole Devices; Discrete THDs Integrated circuit through-hole devices |
| Record Nr. | UNINA-9910784614803321 |
|
Mitzner Kraig
|
||
| Amsterdam ; ; Boston, : Elsevier/Newnes, c2007 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
EMC and the printed circuit board : design, theory, and layout made simple / / Mark I. Montrose
| EMC and the printed circuit board : design, theory, and layout made simple / / Mark I. Montrose |
| Autore | Montrose Mark I. |
| Pubbl/distr/stampa | New York : , : IEEE Press, , c1999 |
| Descrizione fisica | 1 online resource (344 p.) |
| Disciplina |
621.3815
621.3815/31 621.381531 |
| Collana | IEEE Press series on electronics technology |
| Soggetto topico |
Printed circuits - Design and construction
Electromagnetic compatibility |
| Soggetto non controllato | Electrical and Electronics Engineering |
| ISBN |
1-280-54203-9
9786610542031 0-471-66090-6 0-471-72310-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Preface. Acknowledgements. EMC Fundamentals. EMC Inside the PCB. Components and EMC. Image Planes. Bypassing and Decoupling. Transmission Lines. Signal Integrity and Crosstalk. Trace Termination. Grounding. Glossary. Bibliography. Appendix A: The Decibel. Appendix B: Fourier Analysis. Appendix C: Conversion Tables. Appendix D: International EMC Requirements. Index. About the Author. |
| Record Nr. | UNINA-9910143504903321 |
|
Montrose Mark I.
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| New York : , : IEEE Press, , c1999 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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