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2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 12-15, September, 2004, Portland, OR
2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 12-15, September, 2004, Portland, OR
Pubbl/distr/stampa [Place of publication not identified], : IEEE, 2004
Disciplina 621.381/046
Soggetto topico Microelectronic packaging - Materials
Polymers - Reliability
Integrated circuits - Materials
Photonics
Polymeric composites
Electrical & Computer Engineering
Engineering & Applied Sciences
Electrical Engineering
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996204495903316
[Place of publication not identified], : IEEE, 2004
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 12-15, September, 2004, Portland, OR
2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 12-15, September, 2004, Portland, OR
Pubbl/distr/stampa [Place of publication not identified], : IEEE, 2004
Disciplina 621.381/046
Soggetto topico Microelectronic packaging - Materials
Polymers - Reliability
Integrated circuits - Materials
Photonics
Polymeric composites
Electrical & Computer Engineering
Engineering & Applied Sciences
Electrical Engineering
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910872499003321
[Place of publication not identified], : IEEE, 2004
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Polytronic 2005 : 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics : October 23-24, 2005, Hotel Mercure Panorama, Wrocław, Poland : proceedings
Polytronic 2005 : 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics : October 23-24, 2005, Hotel Mercure Panorama, Wrocław, Poland : proceedings
Pubbl/distr/stampa [Place of publication not identified], : IEEE, 2006
Disciplina 621.381046
Soggetto topico Microelectronic packaging - Materials
Polymers - Reliability
Integrated circuits - Materials
Photonics
Polymeric composites
Electrical & Computer Engineering
Engineering & Applied Sciences
Electrical Engineering
ISBN 1-5090-9952-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996207502403316
[Place of publication not identified], : IEEE, 2006
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
Polytronic 2005 : 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics : October 23-24, 2005, Hotel Mercure Panorama, Wrocław, Poland : proceedings
Polytronic 2005 : 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics : October 23-24, 2005, Hotel Mercure Panorama, Wrocław, Poland : proceedings
Pubbl/distr/stampa [Place of publication not identified], : IEEE, 2006
Disciplina 621.381046
Soggetto topico Microelectronic packaging - Materials
Polymers - Reliability
Integrated circuits - Materials
Photonics
Polymeric composites
Electrical & Computer Engineering
Engineering & Applied Sciences
Electrical Engineering
ISBN 1-5090-9952-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910145606003321
[Place of publication not identified], : IEEE, 2006
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui