2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 12-15, September, 2004, Portland, OR |
Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2004 |
Disciplina | 621.381/046 |
Soggetto topico |
Microelectronic packaging - Materials
Polymers - Reliability Integrated circuits - Materials Photonics Polymeric composites Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNISA-996204495903316 |
[Place of publication not identified], : IEEE, 2004 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. di Salerno | ||
|
2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 12-15, September, 2004, Portland, OR |
Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2004 |
Disciplina | 621.381/046 |
Soggetto topico |
Microelectronic packaging - Materials
Polymers - Reliability Integrated circuits - Materials Photonics Polymeric composites Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910872499003321 |
[Place of publication not identified], : IEEE, 2004 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
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Polytronic 2005 : 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics : October 23-24, 2005, Hotel Mercure Panorama, Wrocław, Poland : proceedings |
Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2006 |
Disciplina | 621.381046 |
Soggetto topico |
Microelectronic packaging - Materials
Polymers - Reliability Integrated circuits - Materials Photonics Polymeric composites Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
ISBN | 1-5090-9952-2 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNISA-996207502403316 |
[Place of publication not identified], : IEEE, 2006 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. di Salerno | ||
|
Polytronic 2005 : 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics : October 23-24, 2005, Hotel Mercure Panorama, Wrocław, Poland : proceedings |
Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2006 |
Disciplina | 621.381046 |
Soggetto topico |
Microelectronic packaging - Materials
Polymers - Reliability Integrated circuits - Materials Photonics Polymeric composites Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
ISBN | 1-5090-9952-2 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910145606003321 |
[Place of publication not identified], : IEEE, 2006 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
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