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Laser optoelectronic oscillators / / Alexander A. Bortsov, Sergey M. Smolskiy, Yuri B. Il'in
| Laser optoelectronic oscillators / / Alexander A. Bortsov, Sergey M. Smolskiy, Yuri B. Il'in |
| Autore | Bortsov Alexander A. |
| Edizione | [1st ed. 2020.] |
| Pubbl/distr/stampa | Cham, Switzerland : , : Springer, , [2020] |
| Descrizione fisica | 1 online resource (XXXV, 522 p. 203 illus., 5 illus. in color.) |
| Disciplina | 621.381045 |
| Collana | Springer Series in Optical Sciences |
| Soggetto topico |
Optoelectronic devices - Reliability
Lasers |
| ISBN | 3-030-45700-1 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Chapter 1. Introduction -- Chapter 2. Nanostructural Optoelectronic Oscillators with the Fiber-Optical Delay Line -- Chapter 3. Modulation Methods of Laser Emission in Optoelectronic oscillator (OEO) and OEO Differential Equations -- Chapter 4. Semiclassical Theory and Laser Differential Equations for Optoelectronic oscillator (OEO) Analysis. -- Chapter 5. Optoelectronic oscillator (OEO) Differential Equations as the Laser System with Modulation and Positive Feedback -- Chapter 6. Operation Analysis of Optoelectronic oscillator (OEO) with External Mach–Zehnder Modulator. -- Chapter 7. Optoelectronic oscillator (OEO) as the Time and Spatial Correlator of Random Variables with Differential Delay Line -- Chapter 8. Experimental Investigations and Practical Circuits of Optoelectronic oscillator (OEO) with RF FODL. |
| Record Nr. | UNINA-9910427687303321 |
Bortsov Alexander A.
|
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| Cham, Switzerland : , : Springer, , [2020] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Laser optoelectronic oscillators / / Alexander A. Bortsov, Sergey M. Smolskiy, Yuri B. Il'in
| Laser optoelectronic oscillators / / Alexander A. Bortsov, Sergey M. Smolskiy, Yuri B. Il'in |
| Autore | Bortsov Alexander A. |
| Edizione | [1st ed. 2020.] |
| Pubbl/distr/stampa | Cham, Switzerland : , : Springer, , [2020] |
| Descrizione fisica | 1 online resource (XXXV, 522 p. 203 illus., 5 illus. in color.) |
| Disciplina | 621.381045 |
| Collana | Springer Series in Optical Sciences |
| Soggetto topico |
Optoelectronic devices - Reliability
Lasers |
| ISBN | 3-030-45700-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Chapter 1. Introduction -- Chapter 2. Nanostructural Optoelectronic Oscillators with the Fiber-Optical Delay Line -- Chapter 3. Modulation Methods of Laser Emission in Optoelectronic oscillator (OEO) and OEO Differential Equations -- Chapter 4. Semiclassical Theory and Laser Differential Equations for Optoelectronic oscillator (OEO) Analysis. -- Chapter 5. Optoelectronic oscillator (OEO) Differential Equations as the Laser System with Modulation and Positive Feedback -- Chapter 6. Operation Analysis of Optoelectronic oscillator (OEO) with External Mach–Zehnder Modulator. -- Chapter 7. Optoelectronic oscillator (OEO) as the Time and Spatial Correlator of Random Variables with Differential Delay Line -- Chapter 8. Experimental Investigations and Practical Circuits of Optoelectronic oscillator (OEO) with RF FODL. |
| Record Nr. | UNISA-996418444803316 |
|
Bortsov Alexander A.
|
||
| Cham, Switzerland : , : Springer, , [2020] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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Structural dynamics of electronic and photonic systems [[electronic resource] /] / edited by Ephraim Suhir, David S. Steinberg, T.X. Yu
| Structural dynamics of electronic and photonic systems [[electronic resource] /] / edited by Ephraim Suhir, David S. Steinberg, T.X. Yu |
| Pubbl/distr/stampa | Hoboken, N.J., : Wiley, 2010 |
| Descrizione fisica | 1 online resource (610 p.) |
| Disciplina | 621.382 |
| Altri autori (Persone) |
SuhirEphraim
YuT. X <1941-> (Tongxi) SteinbergDavid S |
| Soggetto topico |
Electronic apparatus and appliances - Reliability
Optoelectronic devices - Reliability Fault tolerance (Engineering) Microstructure Structural dynamics |
| ISBN |
1-283-07236-X
9786613072368 0-470-88665-X 0-470-88679-X 0-470-95001-3 0-470-88678-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Structural Dynamics of Electronic and Photonic Systems; Contents; Preface; Contributors; 1 Some Major Structural Dynamics-Related Failure Modes and Mechanisms in Micro- and Opto-Electronic Systems and Dynamic Stability of These Systems; 2 Linear Response to Shocks and Vibrations; 3 Linear and Nonlinear Vibrations Caused by Periodic Impulses; 4 Random Vibrations of Structural Elements in Electronic and Photonic Systems; 5 Natural Frequencies and Failure Mechanisms of Electronic and Photonic Structures Subjected to Sinusoidal or Random Vibrations
6 Drop/Impact of Typical Portable Electronic Devices: Experimentation and Modeling7 Shock Test Methods and Test Standards for Portable Electronic Devices; 8 Dynamic Response of Solder Joint Interconnections to Vibration and Shock; 9 Test Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating Electronic Equipment; 10 Correlation between Package-Level High-Speed Solder Ball Shear/Pull and Board-Level Mechanical Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy 11 Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging12 Fatigue Damage Evaluation for Microelectronic Components Subjected to Vibration; 13 Vibration Considerations for Sensitive Research and Production Facilities; 14 Applications of Finite Element Analysis: Attributes and Challenges; 15 Shock Simulation of Drop Test of Hard Disk Drives; 16 Shock Protection of Portable Electronic Devices Using a "Cushion" of an Array of Wires (AOW); 17 Board-Level Reliability of Lead-Free Solder under Mechanical Shock and Vibration Loads 18 Dynamic Response of PCB Structures to Shock Loading in Reliability Tests19 Linear Response of Single-Degree-of-Freedom System to Impact Load: Could Shock Tests Adequately Mimic Drop Test Conditions?; 20 Shock Isolation of Micromachined Device for High-g Applications; 21 Reliability Assessment of Microelectronics Packages Using Dynamic Testing Methods; 22 Thermal Cycle and Vibration/Drop Reliability of Area Array Package Assemblies; 23 Could an Impact Load of Finite Duration Be Substituted with an Instantaneous Impulse?; Index |
| Record Nr. | UNINA-9910139456003321 |
| Hoboken, N.J., : Wiley, 2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Structural dynamics of electronic and photonic systems [[electronic resource] /] / edited by Ephraim Suhir, David S. Steinberg, T.X. Yu
| Structural dynamics of electronic and photonic systems [[electronic resource] /] / edited by Ephraim Suhir, David S. Steinberg, T.X. Yu |
| Pubbl/distr/stampa | Hoboken, N.J., : Wiley, 2010 |
| Descrizione fisica | 1 online resource (610 p.) |
| Disciplina | 621.382 |
| Altri autori (Persone) |
SuhirEphraim
YuT. X <1941-> (Tongxi) SteinbergDavid S |
| Soggetto topico |
Electronic apparatus and appliances - Reliability
Optoelectronic devices - Reliability Fault tolerance (Engineering) Microstructure Structural dynamics |
| ISBN |
1-283-07236-X
9786613072368 0-470-88665-X 0-470-88679-X 0-470-95001-3 0-470-88678-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Structural Dynamics of Electronic and Photonic Systems; Contents; Preface; Contributors; 1 Some Major Structural Dynamics-Related Failure Modes and Mechanisms in Micro- and Opto-Electronic Systems and Dynamic Stability of These Systems; 2 Linear Response to Shocks and Vibrations; 3 Linear and Nonlinear Vibrations Caused by Periodic Impulses; 4 Random Vibrations of Structural Elements in Electronic and Photonic Systems; 5 Natural Frequencies and Failure Mechanisms of Electronic and Photonic Structures Subjected to Sinusoidal or Random Vibrations
6 Drop/Impact of Typical Portable Electronic Devices: Experimentation and Modeling7 Shock Test Methods and Test Standards for Portable Electronic Devices; 8 Dynamic Response of Solder Joint Interconnections to Vibration and Shock; 9 Test Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating Electronic Equipment; 10 Correlation between Package-Level High-Speed Solder Ball Shear/Pull and Board-Level Mechanical Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy 11 Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging12 Fatigue Damage Evaluation for Microelectronic Components Subjected to Vibration; 13 Vibration Considerations for Sensitive Research and Production Facilities; 14 Applications of Finite Element Analysis: Attributes and Challenges; 15 Shock Simulation of Drop Test of Hard Disk Drives; 16 Shock Protection of Portable Electronic Devices Using a "Cushion" of an Array of Wires (AOW); 17 Board-Level Reliability of Lead-Free Solder under Mechanical Shock and Vibration Loads 18 Dynamic Response of PCB Structures to Shock Loading in Reliability Tests19 Linear Response of Single-Degree-of-Freedom System to Impact Load: Could Shock Tests Adequately Mimic Drop Test Conditions?; 20 Shock Isolation of Micromachined Device for High-g Applications; 21 Reliability Assessment of Microelectronics Packages Using Dynamic Testing Methods; 22 Thermal Cycle and Vibration/Drop Reliability of Area Array Package Assemblies; 23 Could an Impact Load of Finite Duration Be Substituted with an Instantaneous Impulse?; Index |
| Record Nr. | UNINA-9910830683803321 |
| Hoboken, N.J., : Wiley, 2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Structural dynamics of electronic and photonic systems / / edited by Ephraim Suhir, David S. Steinberg, T.X. Yu
| Structural dynamics of electronic and photonic systems / / edited by Ephraim Suhir, David S. Steinberg, T.X. Yu |
| Pubbl/distr/stampa | Hoboken, N.J., : Wiley, 2010 |
| Descrizione fisica | 1 online resource (610 p.) |
| Disciplina | 621.382 |
| Altri autori (Persone) |
SuhirEphraim
YuT. X <1941-> (Tongxi) SteinbergDavid S |
| Soggetto topico |
Electronic apparatus and appliances - Reliability
Optoelectronic devices - Reliability Fault tolerance (Engineering) Microstructure Structural dynamics |
| ISBN |
1-283-07236-X
9786613072368 0-470-88665-X 0-470-88679-X 0-470-95001-3 0-470-88678-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Structural Dynamics of Electronic and Photonic Systems; Contents; Preface; Contributors; 1 Some Major Structural Dynamics-Related Failure Modes and Mechanisms in Micro- and Opto-Electronic Systems and Dynamic Stability of These Systems; 2 Linear Response to Shocks and Vibrations; 3 Linear and Nonlinear Vibrations Caused by Periodic Impulses; 4 Random Vibrations of Structural Elements in Electronic and Photonic Systems; 5 Natural Frequencies and Failure Mechanisms of Electronic and Photonic Structures Subjected to Sinusoidal or Random Vibrations
6 Drop/Impact of Typical Portable Electronic Devices: Experimentation and Modeling7 Shock Test Methods and Test Standards for Portable Electronic Devices; 8 Dynamic Response of Solder Joint Interconnections to Vibration and Shock; 9 Test Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating Electronic Equipment; 10 Correlation between Package-Level High-Speed Solder Ball Shear/Pull and Board-Level Mechanical Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy 11 Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging12 Fatigue Damage Evaluation for Microelectronic Components Subjected to Vibration; 13 Vibration Considerations for Sensitive Research and Production Facilities; 14 Applications of Finite Element Analysis: Attributes and Challenges; 15 Shock Simulation of Drop Test of Hard Disk Drives; 16 Shock Protection of Portable Electronic Devices Using a "Cushion" of an Array of Wires (AOW); 17 Board-Level Reliability of Lead-Free Solder under Mechanical Shock and Vibration Loads 18 Dynamic Response of PCB Structures to Shock Loading in Reliability Tests19 Linear Response of Single-Degree-of-Freedom System to Impact Load: Could Shock Tests Adequately Mimic Drop Test Conditions?; 20 Shock Isolation of Micromachined Device for High-g Applications; 21 Reliability Assessment of Microelectronics Packages Using Dynamic Testing Methods; 22 Thermal Cycle and Vibration/Drop Reliability of Area Array Package Assemblies; 23 Could an Impact Load of Finite Duration Be Substituted with an Instantaneous Impulse?; Index |
| Record Nr. | UNINA-9910841067603321 |
| Hoboken, N.J., : Wiley, 2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
