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The (Non-)Local Density of States of Electronic Excitations in Organic Semiconductors [[electronic resource] /] / by Carl. R Poelking
| The (Non-)Local Density of States of Electronic Excitations in Organic Semiconductors [[electronic resource] /] / by Carl. R Poelking |
| Autore | Poelking Carl. R |
| Edizione | [1st ed. 2018.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2018 |
| Descrizione fisica | 1 online resource (XIV, 133 p. 42 illus. in color.) |
| Disciplina | 530.416 |
| Collana | Springer Theses, Recognizing Outstanding Ph.D. Research |
| Soggetto topico |
Semiconductors
Optical materials Electronic materials Polymers Physics Optical and Electronic Materials Polymer Sciences Applied and Technical Physics |
| ISBN | 3-319-69599-1 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Organic Electronics in a Nutshell -- Particle-Based Models -- Long-Range Polarized Embedding of Electronic Excitations -- Charge Carriers at Organic–Organic Interfaces -- Charge Carriers in Disordered Bulk Mesophases -- Charge Transfer States at Donor–Acceptor Heterojunctions -- Conclusions & Outlook. |
| Record Nr. | UNINA-9910300534803321 |
Poelking Carl. R
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| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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1D Oxide Nanostructures Obtained by Sol-Gel and Hydrothermal Methods [[electronic resource] /] / by Crina Anastasescu, Susana Mihaiu, Silviu Preda, Maria Zaharescu
| 1D Oxide Nanostructures Obtained by Sol-Gel and Hydrothermal Methods [[electronic resource] /] / by Crina Anastasescu, Susana Mihaiu, Silviu Preda, Maria Zaharescu |
| Autore | Anastasescu Crina |
| Edizione | [1st ed. 2016.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016 |
| Descrizione fisica | 1 online resource (89 p.) |
| Disciplina | 620.11 |
| Collana | SpringerBriefs in Materials |
| Soggetto topico |
Ceramics
Glass Composites (Materials) Composite materials Nanochemistry Nanoscale science Nanoscience Nanostructures Optical materials Electronic materials Lasers Photonics Catalysis Ceramics, Glass, Composites, Natural Materials Nanoscale Science and Technology Optical and Electronic Materials Optics, Lasers, Photonics, Optical Devices |
| ISBN | 3-319-32988-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction (general considerations on the 1 D oxide nanostructures) -- Synthesis of oxide nanotubes by sol-gel method -- Synthesis of oxide nanotubes/nanorods by hydrothermal method. |
| Record Nr. | UNINA-9910254059103321 |
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Anastasescu Crina
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| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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2018 IEEE Research and Applications of Photonics In Defense Conference : 22-24 August 2018, Miramar Beach, FL, USA / / IEEE Photonics Society
| 2018 IEEE Research and Applications of Photonics In Defense Conference : 22-24 August 2018, Miramar Beach, FL, USA / / IEEE Photonics Society |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (124 pages) |
| Disciplina | 621.36 |
| Soggetto topico |
Photonics
Optoelectronic devices Optical materials |
| ISBN | 1-5386-5349-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996280102503316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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2018 IEEE Research and Applications of Photonics In Defense Conference : 22-24 August 2018, Miramar Beach, FL, USA / / IEEE Photonics Society
| 2018 IEEE Research and Applications of Photonics In Defense Conference : 22-24 August 2018, Miramar Beach, FL, USA / / IEEE Photonics Society |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (124 pages) |
| Disciplina | 621.36 |
| Soggetto topico |
Photonics
Optoelectronic devices Optical materials |
| ISBN | 1-5386-5349-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910291754403321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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2D boron : boraphene, borophene, boronene / / Iwao Matsuda; Kehui Wu
| 2D boron : boraphene, borophene, boronene / / Iwao Matsuda; Kehui Wu |
| Edizione | [1st ed. 2021.] |
| Pubbl/distr/stampa | Cham, Switzerland : , : Springer, , [2021] |
| Descrizione fisica | 1 online resource (XI, 160 p. 103 illus., 57 illus. in color.) |
| Disciplina | 553.61 |
| Soggetto topico |
Boron
Optical materials Two-dimensional materials |
| ISBN | 3-030-49999-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Chapter 1. A Historical Review of Theoretical Boron Allotropes in Various Dimensions -- Chapter 2. Borophenes: insights and predictions from computational analyses -- Chapter 3. Synthesis of Borophene -- Chapter 4. Electronic Structure of Borophene -- Chapter 5. Chemically Modified Borophene -- Chapter 6. Physical and Chemical Properties of Boron Solids. |
| Record Nr. | UNINA-9910483922603321 |
| Cham, Switzerland : , : Springer, , [2021] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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2D Nanoelectronics [[electronic resource] ] : Physics and Devices of Atomically Thin Materials / / by Mircea Dragoman, Daniela Dragoman
| 2D Nanoelectronics [[electronic resource] ] : Physics and Devices of Atomically Thin Materials / / by Mircea Dragoman, Daniela Dragoman |
| Autore | Dragoman Mircea |
| Edizione | [1st ed. 2017.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 |
| Descrizione fisica | 1 online resource (XII, 199 p. 220 illus., 131 illus. in color.) |
| Disciplina | 620.5 |
| Collana | NanoScience and Technology |
| Soggetto topico |
Optical materials
Electronic materials Semiconductors Nanotechnology Lasers Photonics Solid state physics Optical and Electronic Materials Nanotechnology and Microengineering Optics, Lasers, Photonics, Optical Devices Solid State Physics |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Carbon-based nanoelectronics -- Metallic chalcogenides nanoelectronics -- Silicene and germanium nanoelectronics -- 2D electron gas nanoelctronics -- Other 2D materials. |
| Record Nr. | UNINA-9910155299003321 |
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Dragoman Mircea
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| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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3D microelectronic packaging : from architectures to applications / / editors, Yan Li, Deepak Goyal
| 3D microelectronic packaging : from architectures to applications / / editors, Yan Li, Deepak Goyal |
| Edizione | [2nd edition 2021.] |
| Pubbl/distr/stampa | Singapore : , : Springer, , [2021] |
| Descrizione fisica | 1 online resource (XVII, 622 p. 299 illus., 205 illus. in color.) |
| Disciplina | 929.374 |
| Collana | Springer Series in Advanced Microelectronics |
| Soggetto topico |
Biotechnology
Electronics Electronics - Materials Microelectronics Microelectronics - Packaging Nanotechnology Electronic circuits Optical materials |
| ISBN | 981-15-7090-6 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | 1. Introduction to 3D microelectronic packaging -- 2. 3D packaging architecture and assembly process design -- 3. Fundamentals of TSV processing and reliability -- 4. Mechanical properties of TSV -- 5. Atomistic View of TSV Protrusion/Intrusion -- 6. Fundamentals and failures in Die preparation for 3D packaging -- 7. Direct Cu to Cu bonding and other alternative interconnects in 3D packaging -- 8. Emerging hybrid bonding techniques for 3D packaging -- 9. Fundamental of Thermal Compressive Bonding process, advanced epoxy, and flux materials in 3D packaging -- 10. Fundamentals of solder alloys in 3D packaging -- 11. Fundamentals of electro migration in interconnects of 3D packages -- 12. Fundamentals of heat dissipation in 3D packaging -- 13. Fundamentals of advanced materials and process in substrate technology -- 14. New substrate technologies for 3D packaging. -15. Thermal mechanical and moisture modeling in 3D packaging -- 16. Stress and Strain measurements in 3D packaging -- 17.Processing and Reliability of Solder Interconnections in Stacked Packaging -- 18. Interconnect Quality and Reliability of 3D Packaging -- 19. Fundamentals of automotive reliability of 3D packages -- 20. Fault isolation and failure analysis of 3D packaging. |
| Record Nr. | UNINA-9910484726403321 |
| Singapore : , : Springer, , [2021] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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3D Microelectronic Packaging [[electronic resource] ] : From Fundamentals to Applications / / edited by Yan Li, Deepak Goyal
| 3D Microelectronic Packaging [[electronic resource] ] : From Fundamentals to Applications / / edited by Yan Li, Deepak Goyal |
| Edizione | [1st ed. 2017.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 |
| Descrizione fisica | 1 online resource (IX, 463 p. 331 illus., 253 illus. in color.) |
| Disciplina | 621.381 |
| Collana | Springer Series in Advanced Microelectronics |
| Soggetto topico |
Electronics
Microelectronics Optical materials Electronic materials Electronic circuits Biotechnology Nanotechnology Metals Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Electronic Circuits and Devices Microengineering Nanotechnology and Microengineering Metallic Materials |
| ISBN | 3-319-44586-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction to 3D Microelectronic Packaging.-3D packaging architecture and assembly process design.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV -- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging -- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages -- Fundamentals of solder alloys in 3D packaging.-Fundamentals of Electromigration in interconnects of 3D packages.-Fundamentals of heat dissipation in 3D IC packaging -- Fundamentals of advanced materials and processes in organic substrate technology -- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization -- Processing and Reliability of Solder Interconnections in Stacked Packaging -- Interconnect Quality and Reliability of 3D Packaging -- Fault isolation and failure analysis of 3D packaging. . |
| Record Nr. | UNINA-9910163046303321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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3D printing of optical components / / edited by Andreas Heinrich
| 3D printing of optical components / / edited by Andreas Heinrich |
| Edizione | [1st ed. 2021.] |
| Pubbl/distr/stampa | Cham, Switzerland : , : Springer, , [2021] |
| Descrizione fisica | 1 online resource (XII, 297 p. 223 illus., 192 illus. in color.) |
| Disciplina | 621.36 |
| Collana | Springer Series in Optical Sciences |
| Soggetto topico |
Photonics
Optical materials Lasers |
| ISBN | 3-030-58960-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction into Additive Manufacturing -- Selective laser melting of reflective optics -- 3D printing of optics based on conventional printing technologies -- 3D printing of transparent glasses -- Industrial Scale Fabrication of Optical Components using High Precision 3D Printing: Aspects – Applications – Perspectives -- 3D-printed micro-optics by femtosecond direct laser writing -- Hybrid polymers for conventional and additive manufacturing of microoptical elements -- Index. |
| Record Nr. | UNINA-9910484225303321 |
| Cham, Switzerland : , : Springer, , [2021] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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3D printing of optical components / / edited by Andreas Heinrich
| 3D printing of optical components / / edited by Andreas Heinrich |
| Edizione | [1st ed. 2021.] |
| Pubbl/distr/stampa | Cham, Switzerland : , : Springer, , [2021] |
| Descrizione fisica | 1 online resource (XII, 297 p. 223 illus., 192 illus. in color.) |
| Disciplina | 621.36 |
| Collana | Springer Series in Optical Sciences |
| Soggetto topico |
Photonics
Optical materials Lasers |
| ISBN | 3-030-58960-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction into Additive Manufacturing -- Selective laser melting of reflective optics -- 3D printing of optics based on conventional printing technologies -- 3D printing of transparent glasses -- Industrial Scale Fabrication of Optical Components using High Precision 3D Printing: Aspects – Applications – Perspectives -- 3D-printed micro-optics by femtosecond direct laser writing -- Hybrid polymers for conventional and additive manufacturing of microoptical elements -- Index. |
| Record Nr. | UNISA-996466737503316 |
| Cham, Switzerland : , : Springer, , [2021] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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Soggetto topico
-
Optical materials
(721)
- Optical and Electronic Materials (624)
- Electronic materials (618)
- Photonics (211)
- Lasers (207)