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The (Non-)Local Density of States of Electronic Excitations in Organic Semiconductors / / by Carl. R Poelking
| The (Non-)Local Density of States of Electronic Excitations in Organic Semiconductors / / by Carl. R Poelking |
| Autore | Poelking Carl. R |
| Edizione | [1st ed. 2018.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2018 |
| Descrizione fisica | 1 online resource (XIV, 133 p. 42 illus. in color.) |
| Disciplina | 530.416 |
| Collana | Springer Theses, Recognizing Outstanding Ph.D. Research |
| Soggetto topico |
Semiconductors
Optical materials Electronic materials Polymers Physics Optical and Electronic Materials Polymer Sciences Applied and Technical Physics |
| ISBN | 3-319-69599-1 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Organic Electronics in a Nutshell -- Particle-Based Models -- Long-Range Polarized Embedding of Electronic Excitations -- Charge Carriers at Organic–Organic Interfaces -- Charge Carriers in Disordered Bulk Mesophases -- Charge Transfer States at Donor–Acceptor Heterojunctions -- Conclusions & Outlook. |
| Record Nr. | UNINA-9910300534803321 |
Poelking Carl. R
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| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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1D Oxide Nanostructures Obtained by Sol-Gel and Hydrothermal Methods / / by Crina Anastasescu, Susana Mihaiu, Silviu Preda, Maria Zaharescu
| 1D Oxide Nanostructures Obtained by Sol-Gel and Hydrothermal Methods / / by Crina Anastasescu, Susana Mihaiu, Silviu Preda, Maria Zaharescu |
| Autore | Anastasescu Crina |
| Edizione | [1st ed. 2016.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016 |
| Descrizione fisica | 1 online resource (89 p.) |
| Disciplina | 620.11 |
| Collana | SpringerBriefs in Materials |
| Soggetto topico |
Ceramics
Glass Composite materials Nanochemistry Nanoscience Nanostructures Optical materials Electronics - Materials Lasers Photonics Catalysis Ceramics, Glass, Composites, Natural Materials Nanoscale Science and Technology Optical and Electronic Materials Optics, Lasers, Photonics, Optical Devices |
| ISBN | 3-319-32988-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction (general considerations on the 1 D oxide nanostructures) -- Synthesis of oxide nanotubes by sol-gel method -- Synthesis of oxide nanotubes/nanorods by hydrothermal method. |
| Record Nr. | UNINA-9910254059103321 |
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Anastasescu Crina
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| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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2018 IEEE Research and Applications of Photonics In Defense Conference : 22-24 August 2018, Miramar Beach, FL, USA / / IEEE Photonics Society
| 2018 IEEE Research and Applications of Photonics In Defense Conference : 22-24 August 2018, Miramar Beach, FL, USA / / IEEE Photonics Society |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (124 pages) |
| Disciplina | 621.36 |
| Soggetto topico |
Photonics
Optoelectronic devices Optical materials |
| ISBN | 1-5386-5349-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996280102503316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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2018 IEEE Research and Applications of Photonics In Defense Conference : 22-24 August 2018, Miramar Beach, FL, USA / / IEEE Photonics Society
| 2018 IEEE Research and Applications of Photonics In Defense Conference : 22-24 August 2018, Miramar Beach, FL, USA / / IEEE Photonics Society |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (124 pages) |
| Disciplina | 621.36 |
| Soggetto topico |
Photonics
Optoelectronic devices Optical materials |
| ISBN | 1-5386-5349-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910291754403321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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2D boron : boraphene, borophene, boronene / / Iwao Matsuda; Kehui Wu
| 2D boron : boraphene, borophene, boronene / / Iwao Matsuda; Kehui Wu |
| Edizione | [1st ed. 2021.] |
| Pubbl/distr/stampa | Cham, Switzerland : , : Springer, , [2021] |
| Descrizione fisica | 1 online resource (XI, 160 p. 103 illus., 57 illus. in color.) |
| Disciplina | 553.61 |
| Soggetto topico |
Boron
Optical materials Two-dimensional materials |
| ISBN | 3-030-49999-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Chapter 1. A Historical Review of Theoretical Boron Allotropes in Various Dimensions -- Chapter 2. Borophenes: insights and predictions from computational analyses -- Chapter 3. Synthesis of Borophene -- Chapter 4. Electronic Structure of Borophene -- Chapter 5. Chemically Modified Borophene -- Chapter 6. Physical and Chemical Properties of Boron Solids. |
| Record Nr. | UNINA-9910483922603321 |
| Cham, Switzerland : , : Springer, , [2021] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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2D Nanoelectronics : Physics and Devices of Atomically Thin Materials / / by Mircea Dragoman, Daniela Dragoman
| 2D Nanoelectronics : Physics and Devices of Atomically Thin Materials / / by Mircea Dragoman, Daniela Dragoman |
| Autore | Dragoman Mircea |
| Edizione | [1st ed. 2017.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 |
| Descrizione fisica | 1 online resource (XII, 199 p. 220 illus., 131 illus. in color.) |
| Disciplina | 620.5 |
| Collana | NanoScience and Technology |
| Soggetto topico |
Optical materials
Electronic materials Semiconductors Nanotechnology Lasers Photonics Solid state physics Optical and Electronic Materials Nanotechnology and Microengineering Optics, Lasers, Photonics, Optical Devices Solid State Physics |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Carbon-based nanoelectronics -- Metallic chalcogenides nanoelectronics -- Silicene and germanium nanoelectronics -- 2D electron gas nanoelctronics -- Other 2D materials. |
| Record Nr. | UNINA-9910155299003321 |
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Dragoman Mircea
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| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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2D Transition-Metal Dichalcogenides (TMDs): Fundamentals and Application / / by Abhay Kumar Singh
| 2D Transition-Metal Dichalcogenides (TMDs): Fundamentals and Application / / by Abhay Kumar Singh |
| Autore | Singh Abhay Kumar |
| Edizione | [1st ed. 2025.] |
| Pubbl/distr/stampa | Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2025 |
| Descrizione fisica | 1 online resource (862 pages) |
| Disciplina |
530.41
620.19 |
| Collana | Materials Horizons: From Nature to Nanomaterials |
| Soggetto topico |
Condensed matter
Materials Materials - Analysis Optical materials Building materials Biomaterials Two-dimensional Materials Materials for Devices Materials Characterization Technique Optical Materials Structural Materials Biomedical Materials |
| ISBN |
9789819602476
9789819602469 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | 1. Basics of TMDs -- 2. Fabrication approaches of TMDs -- 3. Structures and defects of TMDs -- 4. 2D TMDs properties -- 5. Spin-Valley coupling in TMDs -- 5. Heterostructures. |
| Record Nr. | UNINA-9910983039603321 |
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Singh Abhay Kumar
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| Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2025 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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3D microelectronic packaging : from architectures to applications / / editors, Yan Li, Deepak Goyal
| 3D microelectronic packaging : from architectures to applications / / editors, Yan Li, Deepak Goyal |
| Edizione | [2nd edition 2021.] |
| Pubbl/distr/stampa | Singapore : , : Springer, , [2021] |
| Descrizione fisica | 1 online resource (XVII, 622 p. 299 illus., 205 illus. in color.) |
| Disciplina | 929.374 |
| Collana | Springer Series in Advanced Microelectronics |
| Soggetto topico |
Biotechnology
Electronics Electronics - Materials Microelectronics Microelectronics - Packaging Nanotechnology Electronic circuits Optical materials |
| ISBN | 981-15-7090-6 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | 1. Introduction to 3D microelectronic packaging -- 2. 3D packaging architecture and assembly process design -- 3. Fundamentals of TSV processing and reliability -- 4. Mechanical properties of TSV -- 5. Atomistic View of TSV Protrusion/Intrusion -- 6. Fundamentals and failures in Die preparation for 3D packaging -- 7. Direct Cu to Cu bonding and other alternative interconnects in 3D packaging -- 8. Emerging hybrid bonding techniques for 3D packaging -- 9. Fundamental of Thermal Compressive Bonding process, advanced epoxy, and flux materials in 3D packaging -- 10. Fundamentals of solder alloys in 3D packaging -- 11. Fundamentals of electro migration in interconnects of 3D packages -- 12. Fundamentals of heat dissipation in 3D packaging -- 13. Fundamentals of advanced materials and process in substrate technology -- 14. New substrate technologies for 3D packaging. -15. Thermal mechanical and moisture modeling in 3D packaging -- 16. Stress and Strain measurements in 3D packaging -- 17.Processing and Reliability of Solder Interconnections in Stacked Packaging -- 18. Interconnect Quality and Reliability of 3D Packaging -- 19. Fundamentals of automotive reliability of 3D packages -- 20. Fault isolation and failure analysis of 3D packaging. |
| Record Nr. | UNINA-9910484726403321 |
| Singapore : , : Springer, , [2021] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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3D Microelectronic Packaging : From Fundamentals to Applications / / edited by Yan Li, Deepak Goyal
| 3D Microelectronic Packaging : From Fundamentals to Applications / / edited by Yan Li, Deepak Goyal |
| Edizione | [1st ed. 2017.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 |
| Descrizione fisica | 1 online resource (IX, 463 p. 331 illus., 253 illus. in color.) |
| Disciplina | 621.381 |
| Collana | Springer Series in Advanced Microelectronics |
| Soggetto topico |
Electronics
Microelectronics Optical materials Electronic materials Electronic circuits Biotechnology Nanotechnology Metals Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Electronic Circuits and Devices Microengineering Nanotechnology and Microengineering Metallic Materials |
| ISBN | 3-319-44586-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction to 3D Microelectronic Packaging.-3D packaging architecture and assembly process design.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV -- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging -- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages -- Fundamentals of solder alloys in 3D packaging.-Fundamentals of Electromigration in interconnects of 3D packages.-Fundamentals of heat dissipation in 3D IC packaging -- Fundamentals of advanced materials and processes in organic substrate technology -- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization -- Processing and Reliability of Solder Interconnections in Stacked Packaging -- Interconnect Quality and Reliability of 3D Packaging -- Fault isolation and failure analysis of 3D packaging. . |
| Record Nr. | UNINA-9910163046303321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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3D printing of optical components / / edited by Andreas Heinrich
| 3D printing of optical components / / edited by Andreas Heinrich |
| Edizione | [1st ed. 2021.] |
| Pubbl/distr/stampa | Cham, Switzerland : , : Springer, , [2021] |
| Descrizione fisica | 1 online resource (XII, 297 p. 223 illus., 192 illus. in color.) |
| Disciplina | 621.36 |
| Collana | Springer Series in Optical Sciences |
| Soggetto topico |
Photonics
Optical materials Lasers |
| ISBN | 3-030-58960-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction into Additive Manufacturing -- Selective laser melting of reflective optics -- 3D printing of optics based on conventional printing technologies -- 3D printing of transparent glasses -- Industrial Scale Fabrication of Optical Components using High Precision 3D Printing: Aspects – Applications – Perspectives -- 3D-printed micro-optics by femtosecond direct laser writing -- Hybrid polymers for conventional and additive manufacturing of microoptical elements -- Index. |
| Record Nr. | UNINA-9910484225303321 |
| Cham, Switzerland : , : Springer, , [2021] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Soggetto topico
-
Optical materials
(698)
- Optical and Electronic Materials (557)
- Electronic materials (446)
- Photonics (199)
- Lasers (198)