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2D Boron: Boraphene, Borophene, Boronene / / edited by Iwao Matsuda, Kehui Wu
| 2D Boron: Boraphene, Borophene, Boronene / / edited by Iwao Matsuda, Kehui Wu |
| Edizione | [1st ed. 2021.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2021 |
| Descrizione fisica | 1 online resource (XI, 160 p. 103 illus., 57 illus. in color.) |
| Disciplina | 553.61 |
| Soggetto topico |
Optical materials
Nanotechnology Nanochemistry Inorganic chemistry Optical Materials Inorganic Chemistry |
| ISBN | 3-030-49999-5 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Chapter 1. A Historical Review of Theoretical Boron Allotropes in Various Dimensions -- Chapter 2. Borophenes: insights and predictions from computational analyses -- Chapter 3. Synthesis of Borophene -- Chapter 4. Electronic Structure of Borophene -- Chapter 5. Chemically Modified Borophene -- Chapter 6. Physical and Chemical Properties of Boron Solids. |
| Record Nr. | UNINA-9910483922603321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2021 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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2D Nanoelectronics : Physics and Devices of Atomically Thin Materials / / by Mircea Dragoman, Daniela Dragoman
| 2D Nanoelectronics : Physics and Devices of Atomically Thin Materials / / by Mircea Dragoman, Daniela Dragoman |
| Autore | Dragoman Mircea |
| Edizione | [1st ed. 2017.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 |
| Descrizione fisica | 1 online resource (XII, 199 p. 220 illus., 131 illus. in color.) |
| Disciplina | 620.5 |
| Collana | NanoScience and Technology |
| Soggetto topico |
Optical materials
Semiconductors Microtechnology Microelectromechanical systems Lasers Condensed matter Optical Materials Microsystems and MEMS Laser Condensed Matter Physics |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Carbon-based nanoelectronics -- Metallic chalcogenides nanoelectronics -- Silicene and germanium nanoelectronics -- 2D electron gas nanoelctronics -- Other 2D materials. |
| Record Nr. | UNINA-9910155299003321 |
Dragoman Mircea
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| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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2D Transition-Metal Dichalcogenides (TMDs): Fundamentals and Application / / by Abhay Kumar Singh
| 2D Transition-Metal Dichalcogenides (TMDs): Fundamentals and Application / / by Abhay Kumar Singh |
| Autore | Singh Abhay Kumar |
| Edizione | [1st ed. 2025.] |
| Pubbl/distr/stampa | Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2025 |
| Descrizione fisica | 1 online resource (862 pages) |
| Disciplina |
530.41
620.19 |
| Collana | Materials Horizons: From Nature to Nanomaterials |
| Soggetto topico |
Condensed matter
Materials Materials - Analysis Optical materials Building materials Biomaterials Two-dimensional Materials Materials for Devices Materials Characterization Technique Optical Materials Structural Materials Biomedical Materials |
| ISBN | 9789819602476 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | 1. Basics of TMDs -- 2. Fabrication approaches of TMDs -- 3. Structures and defects of TMDs -- 4. 2D TMDs properties -- 5. Spin-Valley coupling in TMDs -- 5. Heterostructures. |
| Record Nr. | UNINA-9910983039603321 |
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Singh Abhay Kumar
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| Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2025 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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3D Microelectronic Packaging : From Architectures to Applications / / edited by Yan Li, Deepak Goyal
| 3D Microelectronic Packaging : From Architectures to Applications / / edited by Yan Li, Deepak Goyal |
| Edizione | [2nd ed. 2021.] |
| Pubbl/distr/stampa | Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2021 |
| Descrizione fisica | 1 online resource (XVII, 622 p. 299 illus., 205 illus. in color.) |
| Disciplina | 929.374 |
| Collana | Springer Series in Advanced Microelectronics |
| Soggetto topico |
Electronic circuits
Electronics Optical materials Microtechnology Microelectromechanical systems Metals Electronic Circuits and Systems Electronics and Microelectronics, Instrumentation Optical Materials Microsystems and MEMS Metals and Alloys |
| ISBN | 981-15-7090-6 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | 1. Introduction to 3D microelectronic packaging -- 2. 3D packaging architecture and assembly process design -- 3. Fundamentals of TSV processing and reliability -- 4. Mechanical properties of TSV -- 5. Atomistic View of TSV Protrusion/Intrusion -- 6. Fundamentals and failures in Die preparation for 3D packaging -- 7. Direct Cu to Cu bonding and other alternative interconnects in 3D packaging -- 8. Emerging hybrid bonding techniques for 3D packaging -- 9. Fundamental of Thermal Compressive Bonding process, advanced epoxy, and flux materials in 3D packaging -- 10. Fundamentals of solder alloys in 3D packaging -- 11. Fundamentals of electro migration in interconnects of 3D packages -- 12. Fundamentals of heat dissipation in 3D packaging -- 13. Fundamentals of advanced materials and process in substrate technology -- 14. New substrate technologies for 3D packaging. -15. Thermal mechanical and moisture modeling in 3D packaging -- 16. Stress and Strain measurements in 3D packaging -- 17.Processing and Reliability of Solder Interconnections in Stacked Packaging -- 18. Interconnect Quality and Reliability of 3D Packaging -- 19. Fundamentals of automotive reliability of 3D packages -- 20. Fault isolation and failure analysis of 3D packaging. |
| Record Nr. | UNINA-9910863106303321 |
| Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2021 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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3D Microelectronic Packaging : From Fundamentals to Applications / / edited by Yan Li, Deepak Goyal
| 3D Microelectronic Packaging : From Fundamentals to Applications / / edited by Yan Li, Deepak Goyal |
| Edizione | [1st ed. 2017.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 |
| Descrizione fisica | 1 online resource (IX, 463 p. 331 illus., 253 illus. in color.) |
| Disciplina | 621.381 |
| Collana | Springer Series in Advanced Microelectronics |
| Soggetto topico |
Electronics
Optical materials Electronic circuits Microtechnology Microelectromechanical systems Metals Electronics and Microelectronics, Instrumentation Optical Materials Electronic Circuits and Systems Microsystems and MEMS Metals and Alloys |
| ISBN | 3-319-44586-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction to 3D Microelectronic Packaging.-3D packaging architecture and assembly process design.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV -- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging -- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages -- Fundamentals of solder alloys in 3D packaging.-Fundamentals of Electromigration in interconnects of 3D packages.-Fundamentals of heat dissipation in 3D IC packaging -- Fundamentals of advanced materials and processes in organic substrate technology -- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization -- Processing and Reliability of Solder Interconnections in Stacked Packaging -- Interconnect Quality and Reliability of 3D Packaging -- Fault isolation and failure analysis of 3D packaging. . |
| Record Nr. | UNINA-9910163046303321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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3rd International Congress on Energy Efficiency and Energy Related Materials (ENEFM2015) : Proceedings, Oludeniz, Turkey, 19–23 October 2015 / / edited by Ahmet Yavuz Oral, Zehra Banu Bahsi Oral
| 3rd International Congress on Energy Efficiency and Energy Related Materials (ENEFM2015) : Proceedings, Oludeniz, Turkey, 19–23 October 2015 / / edited by Ahmet Yavuz Oral, Zehra Banu Bahsi Oral |
| Edizione | [1st ed. 2017.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 |
| Descrizione fisica | 1 online resource (XX, 301 p. 170 illus., 114 illus. in color.) |
| Disciplina | 658.26 |
| Collana | Springer Proceedings in Energy |
| Soggetto topico |
Energy policy
Electric power production Renewable energy sources Optical materials Energy Policy, Economics and Management Electrical Power Engineering Mechanical Power Engineering Renewable Energy Optical Materials |
| ISBN | 3-319-45677-6 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Urban DC Microgrids for Advanced Local Energy Management with Smart Grid Communication -- Proper Orthogonal Decomposition Applied to a Turbine Stage with in-situ Combustion -- Strategies of Maximizing the Benefits of Storage and Diesel Generator for Standalone Microgrid -- Optimal Control of the DC Motors with Feedforward Compensation of the Load Torque -- Photovoltaic Power Conversion System as a Reserve Power Source to a Modern Elevator -- Urban Cycle Simulator for Electric Vehicles Applications -- Impacts of Network Structure on the Optimum Design of Hybrid Standalone Microgrid -- Energy Yield Potential Estimation using Marine Current Turbine Simulations for the Bosphorus -- Co-pyrolysis of Lignite – Oil Shale Mixtures. |
| Record Nr. | UNINA-9910136004003321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Advanced Display Technology : Next Generation Self-Emitting Displays / / edited by In Byeong Kang, Chang Wook Han, Jae Kyeong Jeong
| Advanced Display Technology : Next Generation Self-Emitting Displays / / edited by In Byeong Kang, Chang Wook Han, Jae Kyeong Jeong |
| Edizione | [1st ed. 2021.] |
| Pubbl/distr/stampa | Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2021 |
| Descrizione fisica | 1 online resource (VIII, 328 p. 239 illus., 214 illus. in color.) |
| Disciplina | 621.3815422 |
| Collana | Series in Display Science and Technology |
| Soggetto topico |
Signal processing
Optoelectronic devices Optical materials Electronic circuits Signal, Speech and Image Processing Digital and Analog Signal Processing Optoelectronic Devices Optical Materials Electronic Circuits and Systems |
| ISBN | 981-336-582-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Chapter 1 - Metal Oxide Thin-Film Transistor. - Chapter 2 - Pixel circuit of OLED display -- Chapter 3 - Phosphorescent OLEDs for power efficient displays -- Chapter 4 - TADF and hyperfluorescence.-Chapter 5 - Solution-processible OLED material based on conjugated polymer technology -- Chapter 6 - Soluble small molecules for ink jet printed OLEDs – history, status and prospects -- Chapter 7 - Chemical mechanisms of intrinsic degradation of emitting layers in OLED devices -- Chapter 8 - White OLED device technology and large-sized applications -- Chapter 9 - Encapsulation technology for flexible OLEDs -- Chapter 10 - Quantum dot-enabled displays -- Chapter 11 - Quantum dot based displays -- Chapter 12 - Micro LED technology for display applications -- Chapter 13 - Display techniques for augmented reality and virtual reality. |
| Record Nr. | UNINA-9910484589203321 |
| Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2021 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Advanced Fiber Sensing Technologies / / edited by Lei Wei
| Advanced Fiber Sensing Technologies / / edited by Lei Wei |
| Edizione | [1st ed. 2020.] |
| Pubbl/distr/stampa | Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2020 |
| Descrizione fisica | 1 online resource (307 pages) |
| Disciplina | 681.2 |
| Collana | Progress in Optical Science and Photonics |
| Soggetto topico |
Lasers
Optical materials Telecommunication Analytical chemistry Materials - Analysis Laser Optical Materials Microwaves, RF Engineering and Optical Communications Analytical Chemistry Characterization and Analytical Technique |
| ISBN | 981-15-5507-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Plasmonic Photonic Crystal Fibers -- Hybrid Fiber-Optic Sensors -- Microstructured Fibers for Sensing -- Optical Microfiber Sensors -- Fiber-Based Infrasound Sensing -- Specialty Fiber Grating-Based Acoustic Sensing -- Electrospinning Nanofibers -- Nanofibers for Gas Sensing -- Sapphire-Derived Fibers and Optical Fiber Sensing -- Thermoelectric Fibers -- In-Fiber Breakup -- Nano- and Micro-Structuring of Materials Using Polymer Cold Drawing Process -- Fiber-Based Triboelectric Nanogenerators -- Fiber-Shaped Energy-Storage Devices -- Brillouin Fiber Laser Sensors. |
| Record Nr. | UNINA-9910407737803321 |
| Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Advanced Functional Materials : Proceedings of Chinese Materials Conference 2017 / / edited by Yafang Han
| Advanced Functional Materials : Proceedings of Chinese Materials Conference 2017 / / edited by Yafang Han |
| Edizione | [1版. 2018.] |
| Pubbl/distr/stampa | Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2018 |
| Descrizione fisica | 1 online resource (942 pages) |
| Disciplina | 620.11 |
| Soggetto topico |
Ceramic materials
Polymers Materials Optical materials Biomaterials Ceramics Materials Engineering Optical Materials |
| ISBN | 981-13-0110-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Compressive Strength of Al2O3 Composites Reinforced with Three-dimensional Carbon Fiber Preform -- Luminescence Properties of Lu3+-doped YAG Prepared by a Solid-State Reaction Method -- Infrared Emission Properties of Cr3+-Doped NiAl2O4 Spinel Ceramics. |
| Record Nr. | UNINA-9910298604803321 |
| Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Advanced Materials : Manufacturing, Physics, Mechanics and Applications / / edited by Ivan A. Parinov, Shun-Hsyung Chang, Vitaly Yu. Topolov
| Advanced Materials : Manufacturing, Physics, Mechanics and Applications / / edited by Ivan A. Parinov, Shun-Hsyung Chang, Vitaly Yu. Topolov |
| Edizione | [1st ed. 2016.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016 |
| Descrizione fisica | 1 online resource (702 p.) |
| Disciplina | 620.11 |
| Collana | Springer Proceedings in Physics |
| Soggetto topico |
Optical materials
Semiconductors Microtechnology Microelectromechanical systems Nanotechnology Optical Materials Microsystems and MEMS |
| ISBN | 3-319-26324-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Processing Techniques of Advanced Materials -- Physics of Advanced Materials -- Mechanics of Advanced Materials -- Applications of Advanced Materials. |
| Record Nr. | UNINA-9910254611803321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Soggetto topico
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Optical Materials
(334)
- Optical materials (334)
- Lasers (93)
- Laser (91)
- Nanotechnology (67)