Info
1998 International Conference on Multichip Modules and High Density Packaging
| 1998 International Conference on Multichip Modules and High Density Packaging |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 1998 |
| Disciplina | 621.381/046 |
| Soggetto topico |
Multichip modules (Microelectronics) - Congresses
Microelectronic packaging - Congresses Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996212591603316 |
| [Place of publication not identified], : IEEE, 1998 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
1998 International Conference on Multichip Modules and High Density Packaging
| 1998 International Conference on Multichip Modules and High Density Packaging |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 1998 |
| Disciplina | 621.381/046 |
| Soggetto topico |
Multichip modules (Microelectronics) - Congresses
Microelectronic packaging Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910872663403321 |
| [Place of publication not identified], : IEEE, 1998 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Proceedings : 1997 International Conference on Multichip Modules, April 2-4, 1997, The Adam's Mark Hotel, Denver, Colorado
| Proceedings : 1997 International Conference on Multichip Modules, April 2-4, 1997, The Adam's Mark Hotel, Denver, Colorado |
| Pubbl/distr/stampa | [Place of publication not identified], : Institute of Electrical and Electronics Engineers, 1997 |
| Soggetto topico |
Multichip modules (Microelectronics) - Congresses
Microelectronic packaging - Congresses Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996217392003316 |
| [Place of publication not identified], : Institute of Electrical and Electronics Engineers, 1997 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
Proceedings : 1997 International Conference on Multichip Modules, April 2-4, 1997, The Adam's Mark Hotel, Denver, Colorado
| Proceedings : 1997 International Conference on Multichip Modules, April 2-4, 1997, The Adam's Mark Hotel, Denver, Colorado |
| Pubbl/distr/stampa | [Place of publication not identified], : Institute of Electrical and Electronics Engineers, 1997 |
| Soggetto topico |
Multichip modules (Microelectronics) - Congresses
Microelectronic packaging Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910872440203321 |
| [Place of publication not identified], : Institute of Electrical and Electronics Engineers, 1997 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
