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3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility / / by Professor Lih-Tyng Hwang, Professor Tzyy-Sheng Jason Horng
3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility / / by Professor Lih-Tyng Hwang, Professor Tzyy-Sheng Jason Horng
Autore Hwang Lih-Tyng
Edizione [1st edition.]
Pubbl/distr/stampa Hoboken, New Jersey : , : John Wiley & Sons, , 2018
Descrizione fisica 1 online resource (464 pages)
Disciplina 621.39/5
Soggetto topico Mobile communication systems - Technological innovations
ISBN 1-119-28966-1
1-119-28967-X
1-119-28965-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto 1 MM and MTM for Mobility 1 -- 1.1 Convergence in Communications and the Future, 5G 3 -- 1.1.1 From 1980 (1G) to 2010 (4G) 3 -- 1.1.2 LTE-A and Rel 10 in 2010s 6 -- 1.1.3 The Future: 5G and IoT (Targeting 2020) 8 -- 1.2 Review of Key Products in Communication Networks 14 -- 1.2.1 Wired Communications 14 -- 1.2.2 Wireless Communications 21 -- 1.3 MM and MTM, an Intro to Hardware Technology 31 -- 1.3.1 Moore's Law 31 -- 1.3.2 More Than Moore 43 -- 1.3.3 MTM Packaging Map and MMiư MTM Business Model 53 -- 2 Interconnects 67 -- 2.1 Hierarchy of Interconnection 69 -- 2.1.1 Oniư Chip (Level 0) Interconnections 69 -- 2.1.2 Peripheral Pads on Semiconductor ICs (Level 0) 72 -- 2.1.3 Al pads (Wirebond and Flip Chip) 73 -- 2.1.4 Cu/Lowiư K Re-Distribution Using Damascene Techniques (Flip Chip) 74 -- 2.1.5 Au Pads (III-V) 77 -- 2.1.6 Level 1 Interconnections: WB and FC--Why FC Interconnections are Preferred? 78 -- 2.2 Level 1, Interconnection Gap in FC-PBGA, and Level 0.5 80 -- 2.2.1 Wirebonds 80 -- 2.2.2 Flip Chip Bumps with UBM 85 -- 2.2.3 TSV and Microbumps, Cu or Au Stud Bumps (Level 0.5) 91 -- 2.3 Changing Dynamics of Semiconductor Manufacturing 100 -- 2.3.1 Bumping Itself is a Business 100 -- 2.3.2 Cu/Low-K in BEOL 102 -- 2.3.3 Wafer Fab Foundry and OSAT are Competing for Their Business Shares 102 -- 3 Stateiư of iưtheiư Art IC Packages, Modules, and Substrates 111 -- 3.1 Single-Chip Packages (SCPs): Standardized Packages 113 -- 3.1.1 Lead Frame Based: SO, QFP/QFN, and TAB 114 -- 3.1.2 Organic Interposer Based: BGA/CSP and LGA 114 -- 3.1.3 Known Good Bare Die 120 -- 3.1.4 Single-Chip Packaging Processes 121 -- 3.1.5 IC Testing 123 -- 3.2 Advanced IC Substrates and Assembly 124 -- 3.2.1 MLO Substrates for ICs 126 -- 3.2.2 Multi-Layered Organic (MLO) for IC Packages 127 -- 3.3 Customized Assemblies: MCP/MCMs and Modules 130 -- 3.3.1 Multi-Chip Module (MCM) or Multi-Chip Package (MCP) 131 -- 3.3.2 Modules 132 -- 4 Passives Technology 139 -- 4.1 Thick-Film Ceramic Technology (TFC) for MLC 146.
4.1.1 Green Tapes 146 -- 4.1.2 Thick-Film Fabrication 149 -- 4.1.3 LTCC EPs, Thick-Film IPD, and LTCC-Based RF Modules 151 -- 4.1.4 SMT (or SMD) 155 -- 4.2 MLO Passives by Laminate Organic (LO) 156 -- 4.2.1 MLO-Based RF Modules 156 -- 4.2.2 Laminates 156 -- 4.2.3 MLO Fabrication 157 -- 4.2.4 MLO EPs and RF Modules 159 -- 4.3 On-Chip Passives 166 -- 4.3.1 RF Isolation (BCM4330) 166 -- 4.3.2 Monolithic FEOL On-Chip Passives 168 -- 4.3.3 Rs, Ls, and Cs in BEOL Layers 170 -- 4.3.4 Goals 172 -- 4.4 Thin-Film Multilayer (TFM) and IPD 173 -- 4.5 Summary on Passives Fabrication Technologies: Solutions for RF-Passives Systems 191 -- 5 Electrical Design for 5G Hardware--Digital Focus 199 -- 5.1 Introduction to PCB 201 -- 5.2 Signal Transmission Techniques: Singled-Ended and Differential Signals 202 -- 5.2.1 Single-Ended and Differential 202 -- 5.3 Co-Design Examples 216 -- 5.3.1 Interconnection RF Models and Library 216 -- 5.3.2 Chip-Package and Chip-Package-Board Co-Designs 219 -- 5.4 Wide I/O Memory Using TSVs 228 -- 5.4.1 JEDEC Memory Standards 230 -- 5.4.2 Data Structure Using TSV-Based Wide I/O 230 -- 6 Electrical Design for 5G Hardware--RF Focus 239 -- 6.1 PHY, Modulated RF Carriers; a PoP Possible? 240 -- 6.1.1 Frequency Bands and Wave Propagation Characteristics 240 -- 6.1.2 Narrow-Band Process and CW Carrier for Digital Signals 242 -- 6.2 Antennas 244 -- 6.2.1 Two Often Encountered RF Passive Structures in Modern Portable Electronics: Antenna and Its Feed 244 -- 6.2.2 Types of Antennas: Linear, Microstrip-Patch, and Multi-Element Antenna 245 -- 6.2.3 Active-Integrated Antennas and Measurement of Antenna Performance 251 -- 6.3 RF Functional Components 256 -- 6.3.1 Bandpass Filters 256 -- 6.3.2 Baluns 257 -- 6.3.3 Switches and Duplexers 262 -- 6.4 EMI/EMC 263 -- 6.4.1 Sources of Interference 264 -- 6.4.2 Diagnostic and Regulations Conformation Techniques 264 -- 6.4.3 Containment Techniques 267 -- 7 Product, Process Development, and Control 271.
7.1 Business Processes 272 -- 7.1.1 Strategic Management (Product and Process Development) 272 -- 7.1.2 Design and Manufacturing; Outsourced or Not 273 -- 7.2 History of Statistical Approach for Quality Management 273 -- 7.2.1 Quality Guidelines and Standards 274 -- 7.2.2 Semiconductor Process Development and Characterization 274 -- 7.3 APQP--An Iterative Process for Product and Process Development 275 -- 7.3.1 Translate Product Ideas Into Processes 275 -- 7.4 FMEA, Control Plan, and Initial Process Study 276 -- 7.4.1 RPN 276 -- 7.4.2 Locating the Root Causes 281 -- 7.4.3 Pre-Launch Control Plan 283 -- 7.4.4 Initial Process Study 284 -- 7.5 PPAP and SPC 287 -- 7.5.1 PPAP 287 -- 7.5.2 SPC 287 -- 8 Product Life and Reliability Assessment 291 -- 8.1 Product Life Prediction 292 -- 8.1.1 Calculate MTTF from Processes and Theoretical Distributions 293 -- 8.1.2 Practices to Obtain the Expected Product Life 296 -- 8.1.3 Activation Energy 300 -- 8.2 Reliability Assessment 301 -- 8.2.1 Assessment Variables for Reliability Tests 302 -- 8.2.2 Reliability Assessment Practices 303 -- 8.2.3 Discussions on Weibull Analysis and Weibull Plotting 309 -- 9 Hardware Solutions for 5G Mobility 317 -- 9.1 5G Mobility Products and Planar Solutions 318 -- 9.1.1 High-Density and Logic Products 319 -- 9.1.2 RF-Passives Systems 326 -- 9.1.3 A Summary: WLP and LPP Used for Both HD&L and RF-Passives Products 333 -- 9.2 Advanced Interconnection and Future Business Model 336 -- 9.2.1 Advanced Interconnection 336 -- 9.2.2 New Business Model 341 -- 9.3 Finale--What's Not 343 -- 9.3.1 New from Wafer Foundries 343 -- 9.3.2 System and Architectural Design of Mobile Handsets 345 -- 9.3.3 Thermo-Mechanical and Thermal Science 349 -- 9.3.4 Sensors and IoT 349 -- A Failure Mechanisms and Failure Analysis 357 -- A.1 Failure Mechanisms, or Macroscopic Models 358 -- A.1.1 Silicon Oxide Breakdown 359 -- A.1.2 Stress-Induced Migration (SM) 360 -- A.1.3 Electro-Migration (EM) and Hillocks 360.
A.1.4 Spiking 362 -- A.1.5 IMC, Purple plague (Gold-Al Intermetallics) 363 -- A.1.6 Fatigue and Creeping 364 -- A.1.7 Die Cracking 366 -- A.1.8 Delamination and Popcorning 366 -- A.1.9 Corrosion 367 -- A.2 Failure Analysis (FA) Techniques and FA Tools 368 -- A.2.1 De-Processing (or De-Capping) Techniques 368 -- A.2.2 Microscopic and Analytical Tools 369 -- B ANOVA 375 -- B.1 One-Way ANOVA 376 -- B.2 Two-Way ANOVA 377 -- C Gauge R&R and DOE 381 -- C.1 GR&R 381 -- C.1.1 AIAG's Xbar/Range Method for Gauge R&R Study 381 -- C.1.2 Minitab 383 -- C.1.3 GR&R Casted in the ANOVA Format 383 -- C.1.4 Criteria 384 -- C.2 DOE 384 -- C.2.1 DOE Guidelines 385 -- C.2.2 2k Runs, Unreplicated Case 386 -- C.2.3 Fractional Factorial Designs, 2k-p Run, p = 1, 2,.., < k 399 -- D Statistics Tables 409 -- D.1 F Distribution 409 D.2 Poisson Table of Expected # of Occurrences at a Confidence Level (C.L.) 409 -- D.3 MR Percentile Table 409.
Record Nr. UNINA-9910271018703321
Hwang Lih-Tyng  
Hoboken, New Jersey : , : John Wiley & Sons, , 2018
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility / / by Professor Lih-Tyng Hwang, Professor Tzyy-Sheng Jason Horng
3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility / / by Professor Lih-Tyng Hwang, Professor Tzyy-Sheng Jason Horng
Autore Hwang Lih-Tyng
Edizione [1st edition.]
Pubbl/distr/stampa Hoboken, New Jersey : , : John Wiley & Sons, , 2018
Descrizione fisica 1 online resource (464 pages)
Disciplina 621.39/5
Soggetto topico Mobile communication systems - Technological innovations
ISBN 1-119-28966-1
1-119-28967-X
1-119-28965-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto 1 MM and MTM for Mobility 1 -- 1.1 Convergence in Communications and the Future, 5G 3 -- 1.1.1 From 1980 (1G) to 2010 (4G) 3 -- 1.1.2 LTE-A and Rel 10 in 2010s 6 -- 1.1.3 The Future: 5G and IoT (Targeting 2020) 8 -- 1.2 Review of Key Products in Communication Networks 14 -- 1.2.1 Wired Communications 14 -- 1.2.2 Wireless Communications 21 -- 1.3 MM and MTM, an Intro to Hardware Technology 31 -- 1.3.1 Moore's Law 31 -- 1.3.2 More Than Moore 43 -- 1.3.3 MTM Packaging Map and MMiư MTM Business Model 53 -- 2 Interconnects 67 -- 2.1 Hierarchy of Interconnection 69 -- 2.1.1 Oniư Chip (Level 0) Interconnections 69 -- 2.1.2 Peripheral Pads on Semiconductor ICs (Level 0) 72 -- 2.1.3 Al pads (Wirebond and Flip Chip) 73 -- 2.1.4 Cu/Lowiư K Re-Distribution Using Damascene Techniques (Flip Chip) 74 -- 2.1.5 Au Pads (III-V) 77 -- 2.1.6 Level 1 Interconnections: WB and FC--Why FC Interconnections are Preferred? 78 -- 2.2 Level 1, Interconnection Gap in FC-PBGA, and Level 0.5 80 -- 2.2.1 Wirebonds 80 -- 2.2.2 Flip Chip Bumps with UBM 85 -- 2.2.3 TSV and Microbumps, Cu or Au Stud Bumps (Level 0.5) 91 -- 2.3 Changing Dynamics of Semiconductor Manufacturing 100 -- 2.3.1 Bumping Itself is a Business 100 -- 2.3.2 Cu/Low-K in BEOL 102 -- 2.3.3 Wafer Fab Foundry and OSAT are Competing for Their Business Shares 102 -- 3 Stateiư of iưtheiư Art IC Packages, Modules, and Substrates 111 -- 3.1 Single-Chip Packages (SCPs): Standardized Packages 113 -- 3.1.1 Lead Frame Based: SO, QFP/QFN, and TAB 114 -- 3.1.2 Organic Interposer Based: BGA/CSP and LGA 114 -- 3.1.3 Known Good Bare Die 120 -- 3.1.4 Single-Chip Packaging Processes 121 -- 3.1.5 IC Testing 123 -- 3.2 Advanced IC Substrates and Assembly 124 -- 3.2.1 MLO Substrates for ICs 126 -- 3.2.2 Multi-Layered Organic (MLO) for IC Packages 127 -- 3.3 Customized Assemblies: MCP/MCMs and Modules 130 -- 3.3.1 Multi-Chip Module (MCM) or Multi-Chip Package (MCP) 131 -- 3.3.2 Modules 132 -- 4 Passives Technology 139 -- 4.1 Thick-Film Ceramic Technology (TFC) for MLC 146.
4.1.1 Green Tapes 146 -- 4.1.2 Thick-Film Fabrication 149 -- 4.1.3 LTCC EPs, Thick-Film IPD, and LTCC-Based RF Modules 151 -- 4.1.4 SMT (or SMD) 155 -- 4.2 MLO Passives by Laminate Organic (LO) 156 -- 4.2.1 MLO-Based RF Modules 156 -- 4.2.2 Laminates 156 -- 4.2.3 MLO Fabrication 157 -- 4.2.4 MLO EPs and RF Modules 159 -- 4.3 On-Chip Passives 166 -- 4.3.1 RF Isolation (BCM4330) 166 -- 4.3.2 Monolithic FEOL On-Chip Passives 168 -- 4.3.3 Rs, Ls, and Cs in BEOL Layers 170 -- 4.3.4 Goals 172 -- 4.4 Thin-Film Multilayer (TFM) and IPD 173 -- 4.5 Summary on Passives Fabrication Technologies: Solutions for RF-Passives Systems 191 -- 5 Electrical Design for 5G Hardware--Digital Focus 199 -- 5.1 Introduction to PCB 201 -- 5.2 Signal Transmission Techniques: Singled-Ended and Differential Signals 202 -- 5.2.1 Single-Ended and Differential 202 -- 5.3 Co-Design Examples 216 -- 5.3.1 Interconnection RF Models and Library 216 -- 5.3.2 Chip-Package and Chip-Package-Board Co-Designs 219 -- 5.4 Wide I/O Memory Using TSVs 228 -- 5.4.1 JEDEC Memory Standards 230 -- 5.4.2 Data Structure Using TSV-Based Wide I/O 230 -- 6 Electrical Design for 5G Hardware--RF Focus 239 -- 6.1 PHY, Modulated RF Carriers; a PoP Possible? 240 -- 6.1.1 Frequency Bands and Wave Propagation Characteristics 240 -- 6.1.2 Narrow-Band Process and CW Carrier for Digital Signals 242 -- 6.2 Antennas 244 -- 6.2.1 Two Often Encountered RF Passive Structures in Modern Portable Electronics: Antenna and Its Feed 244 -- 6.2.2 Types of Antennas: Linear, Microstrip-Patch, and Multi-Element Antenna 245 -- 6.2.3 Active-Integrated Antennas and Measurement of Antenna Performance 251 -- 6.3 RF Functional Components 256 -- 6.3.1 Bandpass Filters 256 -- 6.3.2 Baluns 257 -- 6.3.3 Switches and Duplexers 262 -- 6.4 EMI/EMC 263 -- 6.4.1 Sources of Interference 264 -- 6.4.2 Diagnostic and Regulations Conformation Techniques 264 -- 6.4.3 Containment Techniques 267 -- 7 Product, Process Development, and Control 271.
7.1 Business Processes 272 -- 7.1.1 Strategic Management (Product and Process Development) 272 -- 7.1.2 Design and Manufacturing; Outsourced or Not 273 -- 7.2 History of Statistical Approach for Quality Management 273 -- 7.2.1 Quality Guidelines and Standards 274 -- 7.2.2 Semiconductor Process Development and Characterization 274 -- 7.3 APQP--An Iterative Process for Product and Process Development 275 -- 7.3.1 Translate Product Ideas Into Processes 275 -- 7.4 FMEA, Control Plan, and Initial Process Study 276 -- 7.4.1 RPN 276 -- 7.4.2 Locating the Root Causes 281 -- 7.4.3 Pre-Launch Control Plan 283 -- 7.4.4 Initial Process Study 284 -- 7.5 PPAP and SPC 287 -- 7.5.1 PPAP 287 -- 7.5.2 SPC 287 -- 8 Product Life and Reliability Assessment 291 -- 8.1 Product Life Prediction 292 -- 8.1.1 Calculate MTTF from Processes and Theoretical Distributions 293 -- 8.1.2 Practices to Obtain the Expected Product Life 296 -- 8.1.3 Activation Energy 300 -- 8.2 Reliability Assessment 301 -- 8.2.1 Assessment Variables for Reliability Tests 302 -- 8.2.2 Reliability Assessment Practices 303 -- 8.2.3 Discussions on Weibull Analysis and Weibull Plotting 309 -- 9 Hardware Solutions for 5G Mobility 317 -- 9.1 5G Mobility Products and Planar Solutions 318 -- 9.1.1 High-Density and Logic Products 319 -- 9.1.2 RF-Passives Systems 326 -- 9.1.3 A Summary: WLP and LPP Used for Both HD&L and RF-Passives Products 333 -- 9.2 Advanced Interconnection and Future Business Model 336 -- 9.2.1 Advanced Interconnection 336 -- 9.2.2 New Business Model 341 -- 9.3 Finale--What's Not 343 -- 9.3.1 New from Wafer Foundries 343 -- 9.3.2 System and Architectural Design of Mobile Handsets 345 -- 9.3.3 Thermo-Mechanical and Thermal Science 349 -- 9.3.4 Sensors and IoT 349 -- A Failure Mechanisms and Failure Analysis 357 -- A.1 Failure Mechanisms, or Macroscopic Models 358 -- A.1.1 Silicon Oxide Breakdown 359 -- A.1.2 Stress-Induced Migration (SM) 360 -- A.1.3 Electro-Migration (EM) and Hillocks 360.
A.1.4 Spiking 362 -- A.1.5 IMC, Purple plague (Gold-Al Intermetallics) 363 -- A.1.6 Fatigue and Creeping 364 -- A.1.7 Die Cracking 366 -- A.1.8 Delamination and Popcorning 366 -- A.1.9 Corrosion 367 -- A.2 Failure Analysis (FA) Techniques and FA Tools 368 -- A.2.1 De-Processing (or De-Capping) Techniques 368 -- A.2.2 Microscopic and Analytical Tools 369 -- B ANOVA 375 -- B.1 One-Way ANOVA 376 -- B.2 Two-Way ANOVA 377 -- C Gauge R&R and DOE 381 -- C.1 GR&R 381 -- C.1.1 AIAG's Xbar/Range Method for Gauge R&R Study 381 -- C.1.2 Minitab 383 -- C.1.3 GR&R Casted in the ANOVA Format 383 -- C.1.4 Criteria 384 -- C.2 DOE 384 -- C.2.1 DOE Guidelines 385 -- C.2.2 2k Runs, Unreplicated Case 386 -- C.2.3 Fractional Factorial Designs, 2k-p Run, p = 1, 2,.., < k 399 -- D Statistics Tables 409 -- D.1 F Distribution 409 D.2 Poisson Table of Expected # of Occurrences at a Confidence Level (C.L.) 409 -- D.3 MR Percentile Table 409.
Record Nr. UNINA-9910830231303321
Hwang Lih-Tyng  
Hoboken, New Jersey : , : John Wiley & Sons, , 2018
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
5G : an introduction to the 5th generation mobile networks / / Ulrich Trick
5G : an introduction to the 5th generation mobile networks / / Ulrich Trick
Autore Trick Ulrich
Pubbl/distr/stampa Berlin ; ; München ; ; Boston : , : De Gruyter Oldenbourg, , [2021]
Descrizione fisica 1 online resource (xii, 282 pages) : illustrations
Disciplina 621.38456
Collana De Gruyter STEM
Soggetto topico Mobile communication systems - Technological innovations
ISBN 3-11-072450-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Frontmatter -- Preface -- Contents -- 1 Evolution of Mobile Networks -- 2 3G/4G Mobile Networks and NGN (Next Generation Networks) -- 3 Future Networks -- 4 5G Use Cases and Requirements -- 5 5G Standardization and Regulation -- 6 5G Networks at a Glance -- 7 5G Access Networks -- 8 5G Core Network -- 9 5G System -- 10 5G and Security -- 11 5G and Environment -- 12 Future Developments -- Abbreviations -- References -- Index
Record Nr. UNINA-9910554219803321
Trick Ulrich  
Berlin ; ; München ; ; Boston : , : De Gruyter Oldenbourg, , [2021]
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
5G for the connected world / / edited by Devaki Chandramouli, Rainer Liebhart,, Juho Pirskanen, Kangasala, Finland
5G for the connected world / / edited by Devaki Chandramouli, Rainer Liebhart,, Juho Pirskanen, Kangasala, Finland
Edizione [1st edition]
Pubbl/distr/stampa Hoboken, New Jersey : , : John Wiley & Sons, Inc., , 2019
Descrizione fisica 1 online resource (516 pages)
Disciplina 621.38456
Soggetto topico Mobile communication systems - Technological innovations
Broadband communication systems - Technological innovations
Wireless sensor networks - Technological innovations
Soggetto genere / forma Electronic books.
ISBN 1-119-24707-1
1-119-24711-X
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover; Title Page; Copyright; Contents; About the Editors; List of Contributors; Foreword by Tommi Uitto; Foreword by Karri Kuoppamaki; Preface; Acknowledgements; Introduction; Terminology; Chapter 1 Drivers and Motivation for 5G; 1.1 Drivers for 5G; 1.2 ITU-R and IMT 2020 Vision; 1.3 NGMN (Next Generation Mobile Networks); 1.4 5GPPP (5G Public-Private Partnership); 1.5 Requirements for Support of Known and New Services; 1.5.1 Massive IoT; 1.5.2 Time Critical Communication; 1.5.3 Enhanced Mobile Broadband (eMBB); 1.5.4 Enhanced Vehicular Communications; 1.5.5 Network Operations
1.6 5G Use Cases1.6.1 5G to the Home; 1.6.2 In-Vehicle Infotainment; 1.6.3 Hot Spots; 1.6.4 Truck Platooning; 1.6.5 Connected Health Care; 1.6.6 Industry 4.0; 1.6.7 Megacities; 1.7 Business Models; 1.7.1 Asset Provider Role; 1.7.2 Connectivity Provider Role; 1.7.3 Partner Service Provider Role; 1.8 Deployment Strategies; 1.9 3GPP Role and Timelines; References; Chapter 2 Wireless Spectrum for 5G; 2.1 Current Spectrum for Mobile Communication; 2.2 Spectrum Considerations for 5G; 2.3 Identified New Spectrum; 2.4 Spectrum Regulations; 2.4.1 Licensed Spectrum; 2.4.2 License-Exempt Spectrum
2.4.3 New Regulatory Approaches2.5 Characteristics of Spectrum Available for 5G; 2.5.1 Pathloss; 2.5.2 Multipath Propagation; 2.6 NR Bands Defined by 3GPP; References; Chapter 3 Radio Access Technology; 3.1 Evolution Toward 5G; 3.1.1 Introduction; 3.1.2 Pre-Standard Solutions; 3.2 Basic Building Blocks; 3.2.1 Waveforms for Downlink and Uplink; 3.2.2 Multiple Access; 3.2.3 5G Numerology and Frame Structures; 3.2.4 Bandwidth and Carrier Aggregation; 3.2.5 Massive MIMO (Massive Multiple Input Multiple Output); 3.2.6 Channel Coding; 3.2.6.1 Channel Coding for User Plane Data
3.2.6.2 Channel Coding for Physical Control Channels3.3 Downlink Physical Layer; 3.3.1 Synchronization and Cell Detection; 3.3.1.1 Primary Synchronization Signal (PSS); 3.3.1.2 Secondary Synchronization Signal (SSS); 3.3.1.3 Physical Broadcast Channel (PBCH); 3.3.1.4 SS Block Burst Set; 3.3.2 System Information Broadcast (SIB); 3.3.2.1 Remaining Minimum System Information (RMSI); 3.3.2.2 Other System Information; 3.3.3 Downlink Data Transmission; 3.4 Uplink Physical Layer; 3.4.1 Random Access; 3.4.1.1 Long Sequence; 3.4.1.2 Short Sequence; 3.4.2 Uplink Data Transmission
3.4.3 Contention-Based Access3.5 Radio Protocols; 3.5.1 Overall Radio Protocol Architecture; 3.5.2 Medium Access Control (MAC); 3.5.2.1 Logical Channels and Transport Channels; 3.5.2.2 MAC PDU Structures for Efficient Processing; 3.5.2.3 Procedures to Support UL Scheduling; 3.5.2.4 Discontinuous Reception and Transmission; 3.5.2.5 Random Access Procedure; 3.5.2.6 Beam Failure Management; 3.5.3 Radio Link Control (RLC); 3.5.3.1 Segmentation; 3.5.3.2 Error Correction Through ARQ; 3.5.3.3 Reduced RLC Functions for Efficient Processing; 3.5.4 Packet Data Convergence Protocol (PDCP)
Record Nr. UNINA-9910467527803321
Hoboken, New Jersey : , : John Wiley & Sons, Inc., , 2019
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
5G for the connected world / / edited by Devaki Chandramouli, Rainer Liebhart,, Juho Pirskanen, Kangasala, Finland
5G for the connected world / / edited by Devaki Chandramouli, Rainer Liebhart,, Juho Pirskanen, Kangasala, Finland
Edizione [1st edition]
Pubbl/distr/stampa Hoboken, New Jersey : , : John Wiley & Sons, Inc., , 2019
Descrizione fisica 1 online resource (516 pages)
Disciplina 621.38456
Collana THEi Wiley ebooks.
Soggetto topico Mobile communication systems - Technological innovations
Broadband communication systems - Technological innovations
Wireless sensor networks - Technological innovations
ISBN 1-119-24713-6
1-119-24707-1
1-119-24711-X
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover; Title Page; Copyright; Contents; About the Editors; List of Contributors; Foreword by Tommi Uitto; Foreword by Karri Kuoppamaki; Preface; Acknowledgements; Introduction; Terminology; Chapter 1 Drivers and Motivation for 5G; 1.1 Drivers for 5G; 1.2 ITU-R and IMT 2020 Vision; 1.3 NGMN (Next Generation Mobile Networks); 1.4 5GPPP (5G Public-Private Partnership); 1.5 Requirements for Support of Known and New Services; 1.5.1 Massive IoT; 1.5.2 Time Critical Communication; 1.5.3 Enhanced Mobile Broadband (eMBB); 1.5.4 Enhanced Vehicular Communications; 1.5.5 Network Operations
1.6 5G Use Cases1.6.1 5G to the Home; 1.6.2 In-Vehicle Infotainment; 1.6.3 Hot Spots; 1.6.4 Truck Platooning; 1.6.5 Connected Health Care; 1.6.6 Industry 4.0; 1.6.7 Megacities; 1.7 Business Models; 1.7.1 Asset Provider Role; 1.7.2 Connectivity Provider Role; 1.7.3 Partner Service Provider Role; 1.8 Deployment Strategies; 1.9 3GPP Role and Timelines; References; Chapter 2 Wireless Spectrum for 5G; 2.1 Current Spectrum for Mobile Communication; 2.2 Spectrum Considerations for 5G; 2.3 Identified New Spectrum; 2.4 Spectrum Regulations; 2.4.1 Licensed Spectrum; 2.4.2 License-Exempt Spectrum
2.4.3 New Regulatory Approaches2.5 Characteristics of Spectrum Available for 5G; 2.5.1 Pathloss; 2.5.2 Multipath Propagation; 2.6 NR Bands Defined by 3GPP; References; Chapter 3 Radio Access Technology; 3.1 Evolution Toward 5G; 3.1.1 Introduction; 3.1.2 Pre-Standard Solutions; 3.2 Basic Building Blocks; 3.2.1 Waveforms for Downlink and Uplink; 3.2.2 Multiple Access; 3.2.3 5G Numerology and Frame Structures; 3.2.4 Bandwidth and Carrier Aggregation; 3.2.5 Massive MIMO (Massive Multiple Input Multiple Output); 3.2.6 Channel Coding; 3.2.6.1 Channel Coding for User Plane Data
3.2.6.2 Channel Coding for Physical Control Channels3.3 Downlink Physical Layer; 3.3.1 Synchronization and Cell Detection; 3.3.1.1 Primary Synchronization Signal (PSS); 3.3.1.2 Secondary Synchronization Signal (SSS); 3.3.1.3 Physical Broadcast Channel (PBCH); 3.3.1.4 SS Block Burst Set; 3.3.2 System Information Broadcast (SIB); 3.3.2.1 Remaining Minimum System Information (RMSI); 3.3.2.2 Other System Information; 3.3.3 Downlink Data Transmission; 3.4 Uplink Physical Layer; 3.4.1 Random Access; 3.4.1.1 Long Sequence; 3.4.1.2 Short Sequence; 3.4.2 Uplink Data Transmission
3.4.3 Contention-Based Access3.5 Radio Protocols; 3.5.1 Overall Radio Protocol Architecture; 3.5.2 Medium Access Control (MAC); 3.5.2.1 Logical Channels and Transport Channels; 3.5.2.2 MAC PDU Structures for Efficient Processing; 3.5.2.3 Procedures to Support UL Scheduling; 3.5.2.4 Discontinuous Reception and Transmission; 3.5.2.5 Random Access Procedure; 3.5.2.6 Beam Failure Management; 3.5.3 Radio Link Control (RLC); 3.5.3.1 Segmentation; 3.5.3.2 Error Correction Through ARQ; 3.5.3.3 Reduced RLC Functions for Efficient Processing; 3.5.4 Packet Data Convergence Protocol (PDCP)
Record Nr. UNINA-9910526825503321
Hoboken, New Jersey : , : John Wiley & Sons, Inc., , 2019
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
5G for the connected world / / edited by Devaki Chandramouli, Rainer Liebhart,, Juho Pirskanen, Kangasala, Finland
5G for the connected world / / edited by Devaki Chandramouli, Rainer Liebhart,, Juho Pirskanen, Kangasala, Finland
Edizione [1st edition]
Pubbl/distr/stampa Hoboken, New Jersey : , : John Wiley & Sons, Inc., , 2019
Descrizione fisica 1 online resource (516 pages)
Disciplina 621.38456
Collana THEi Wiley ebooks.
Soggetto topico Mobile communication systems - Technological innovations
Broadband communication systems - Technological innovations
Wireless sensor networks - Technological innovations
ISBN 1-119-24713-6
1-119-24707-1
1-119-24711-X
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover; Title Page; Copyright; Contents; About the Editors; List of Contributors; Foreword by Tommi Uitto; Foreword by Karri Kuoppamaki; Preface; Acknowledgements; Introduction; Terminology; Chapter 1 Drivers and Motivation for 5G; 1.1 Drivers for 5G; 1.2 ITU-R and IMT 2020 Vision; 1.3 NGMN (Next Generation Mobile Networks); 1.4 5GPPP (5G Public-Private Partnership); 1.5 Requirements for Support of Known and New Services; 1.5.1 Massive IoT; 1.5.2 Time Critical Communication; 1.5.3 Enhanced Mobile Broadband (eMBB); 1.5.4 Enhanced Vehicular Communications; 1.5.5 Network Operations
1.6 5G Use Cases1.6.1 5G to the Home; 1.6.2 In-Vehicle Infotainment; 1.6.3 Hot Spots; 1.6.4 Truck Platooning; 1.6.5 Connected Health Care; 1.6.6 Industry 4.0; 1.6.7 Megacities; 1.7 Business Models; 1.7.1 Asset Provider Role; 1.7.2 Connectivity Provider Role; 1.7.3 Partner Service Provider Role; 1.8 Deployment Strategies; 1.9 3GPP Role and Timelines; References; Chapter 2 Wireless Spectrum for 5G; 2.1 Current Spectrum for Mobile Communication; 2.2 Spectrum Considerations for 5G; 2.3 Identified New Spectrum; 2.4 Spectrum Regulations; 2.4.1 Licensed Spectrum; 2.4.2 License-Exempt Spectrum
2.4.3 New Regulatory Approaches2.5 Characteristics of Spectrum Available for 5G; 2.5.1 Pathloss; 2.5.2 Multipath Propagation; 2.6 NR Bands Defined by 3GPP; References; Chapter 3 Radio Access Technology; 3.1 Evolution Toward 5G; 3.1.1 Introduction; 3.1.2 Pre-Standard Solutions; 3.2 Basic Building Blocks; 3.2.1 Waveforms for Downlink and Uplink; 3.2.2 Multiple Access; 3.2.3 5G Numerology and Frame Structures; 3.2.4 Bandwidth and Carrier Aggregation; 3.2.5 Massive MIMO (Massive Multiple Input Multiple Output); 3.2.6 Channel Coding; 3.2.6.1 Channel Coding for User Plane Data
3.2.6.2 Channel Coding for Physical Control Channels3.3 Downlink Physical Layer; 3.3.1 Synchronization and Cell Detection; 3.3.1.1 Primary Synchronization Signal (PSS); 3.3.1.2 Secondary Synchronization Signal (SSS); 3.3.1.3 Physical Broadcast Channel (PBCH); 3.3.1.4 SS Block Burst Set; 3.3.2 System Information Broadcast (SIB); 3.3.2.1 Remaining Minimum System Information (RMSI); 3.3.2.2 Other System Information; 3.3.3 Downlink Data Transmission; 3.4 Uplink Physical Layer; 3.4.1 Random Access; 3.4.1.1 Long Sequence; 3.4.1.2 Short Sequence; 3.4.2 Uplink Data Transmission
3.4.3 Contention-Based Access3.5 Radio Protocols; 3.5.1 Overall Radio Protocol Architecture; 3.5.2 Medium Access Control (MAC); 3.5.2.1 Logical Channels and Transport Channels; 3.5.2.2 MAC PDU Structures for Efficient Processing; 3.5.2.3 Procedures to Support UL Scheduling; 3.5.2.4 Discontinuous Reception and Transmission; 3.5.2.5 Random Access Procedure; 3.5.2.6 Beam Failure Management; 3.5.3 Radio Link Control (RLC); 3.5.3.1 Segmentation; 3.5.3.2 Error Correction Through ARQ; 3.5.3.3 Reduced RLC Functions for Efficient Processing; 3.5.4 Packet Data Convergence Protocol (PDCP)
Record Nr. UNINA-9910817720003321
Hoboken, New Jersey : , : John Wiley & Sons, Inc., , 2019
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Comunicación móvil / / Carmen Costa-Sánchez and Xosé López-García (coordinador)
Comunicación móvil / / Carmen Costa-Sánchez and Xosé López-García (coordinador)
Pubbl/distr/stampa Barcelona : , : Editorial UOC, , 2020
Descrizione fisica 1 recurso en línea (241 páginas)
Disciplina 621.38456
Collana Manuales series
Soggetto topico Cell phone systems
Mobile communication systems - Technological innovations
Mobile computing
ISBN 84-9180-671-7
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione spa
Record Nr. UNINA-9910794184803321
Barcelona : , : Editorial UOC, , 2020
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Comunicación móvil / / Carmen Costa-Sánchez and Xosé López-García (coordinador)
Comunicación móvil / / Carmen Costa-Sánchez and Xosé López-García (coordinador)
Pubbl/distr/stampa Barcelona : , : Editorial UOC, , 2020
Descrizione fisica 1 recurso en línea (241 páginas)
Disciplina 621.38456
Collana Manuales series
Soggetto topico Cell phone systems
Mobile communication systems - Technological innovations
Mobile computing
ISBN 84-9180-671-7
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione spa
Record Nr. UNINA-9910822508803321
Barcelona : , : Editorial UOC, , 2020
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Converged communications : evolution from telephony to 5G mobile internet / / Erkki Koivusalo
Converged communications : evolution from telephony to 5G mobile internet / / Erkki Koivusalo
Autore Koivusalo Erkki
Pubbl/distr/stampa Piscataway, New Jersey ; ; Hoboken, New Jersey : , : IEEE Press : , : Wiley, , [2023]
Descrizione fisica 1 online resource (479 pages)
Disciplina 621.38456
Soggetto topico 5G mobile communication systems
Mobile communication systems - Technological innovations
Mobile communication systems
ISBN 1-119-86753-3
1-119-86751-7
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover -- Title Page -- Copyright Page -- Contents -- Preface -- Acknowledgments -- Acronyms -- About the Companion Website -- Introduction - The Evolution -- Part I Fixed Telephone Systems -- Chapter 1 Fixed Telephone Networks -- 1.1 Telephone Network -- 1.1.1 Analog and Digital Representation of Voice -- 1.1.2 Telephone Network Elements -- 1.1.3 Evolution of the Fixed Telephony Network from Analog to Digital -- 1.1.4 Telephone Numbering -- 1.1.5 Tasks and Roles of Telephone Exchanges -- 1.1.6 The Subscriber Line -- 1.1.7 Telephony Signaling on the Analog Subscriber Line -- 1.1.8 Trunk Lines -- 1.1.9 Telephone Networks and Data Communications -- 1.2 Telephone Exchange and Signaling Systems -- 1.2.1 Operation and Structure of a Telephone Exchange -- 1.2.2 Intelligent Networks -- 1.2.3 Signaling between Exchanges -- 1.2.3.1 Channel Associated Signaling -- 1.2.3.2 Common Channel Signaling and SS7 -- 1.2.4 ISDN -- 1.3 Transmission Networks -- 1.3.1 E1 and T1 -- 1.3.1.1 Standardization of E1 and T1 -- 1.3.1.2 Endpoints of E1 and T1 Lines -- 1.3.1.3 Frame Structures -- 1.3.2 V5 -- 1.3.3 PDH -- 1.3.3.1 Standardization of PDH -- 1.3.3.2 PDH Signal Hierarchy and Operation -- 1.3.3.3 PDH Network Architecture -- 1.3.4 SDH -- 1.3.4.1 Standardization of SDH -- 1.3.4.2 Basic Principles of SDH Multiplexing -- 1.3.4.3 SDH Network Architecture -- 1.3.5 Microwave Links -- 1.3.5.1 Standardization of Microwave Link Systems -- 1.3.5.2 Architecture of Microwave Radio Links -- 1.3.6 Wavelength Division Multiplexing (WDM) -- 1.3.6.1 Standardization of WDM Systems -- 1.3.6.2 WDM System Building Blocks -- 1.3.6.3 WDM Network Architecture -- 1.4 Questions -- References -- Part II Data Communication Systems -- Chapter 2 Data over Telephony Line -- 2.1 Subscriber Line Data Technologies -- 2.1.1 Narrowband Analog Modems -- 2.1.2 Digital Subscriber Line (DSL) Technologies.
2.2 Asymmetric Digital Subscriber Line -- 2.2.1 Architecture of ADSL System -- 2.2.2 ADSL Modulation Methods -- 2.2.3 ADSL Latency Paths and Bearers -- 2.2.4 ADSL Modem Functional Block Model -- 2.2.5 ADSL Frame Structure -- 2.2.6 ADSL Bearers and Transport Classes -- 2.2.7 ADSL Line Initialization -- 2.3 VDSL -- 2.3.1 Architecture and Bands of VDSL System -- 2.3.2 VDSL Frame Structure -- 2.3.3 VDSL Overhead -- 2.3.4 VDSL Line Initialization -- 2.4 Questions -- References -- Chapter 3 Data Network Technologies -- 3.1 Data Link Protocols -- 3.1.1 Ethernet -- 3.1.1.1 Ethernet Standardization -- 3.1.1.2 Ethernet Media Access Control and Networking -- 3.1.1.3 Ethernet Layers and Frames -- 3.1.2 WLAN Systems -- 3.1.3 HDLC and LLC -- 3.1.3.1 Architecture of the HDLC System -- 3.1.3.2 HDLC Frame Structures -- 3.1.3.3 Operation of HDLC -- 3.1.3.4 LLC Protocol -- 3.1.4 PPP -- 3.2 Switching Protocols for Virtual Connections -- 3.2.1 Frame Relay -- 3.2.2 ATM -- 3.2.3 MPLS -- 3.3 Internet Protocol Version 4 -- 3.3.1 History of IPv4 Protocol Suite -- 3.3.2 IPv4 -- 3.3.2.1 Architecture and Services of IPv4 -- 3.3.2.2 IPv4 Addressing -- 3.3.2.3 IPv4 Packet Structure -- 3.3.3 ICMP and IGMP -- 3.3.4 UDP -- 3.3.5 TCP -- 3.3.6 SCTP -- 3.3.7 QUIC -- 3.3.8 DNS -- 3.3.9 DHCP -- 3.3.10 Security of IPv4 Data Flows -- 3.3.10.1 IPSec -- 3.3.10.2 TLS -- 3.4 Internet Protocol Version 6 -- 3.4.1 Standardization of IPv6 and the Initial Challenges -- 3.4.2 IPv6 -- 3.4.2.1 IPv6 Addressing -- 3.4.2.2 IPv6 Packet Structure -- 3.4.3 Methods to Support the Parallel Use of IPv4 and IPv6 -- 3.4.4 ICMPv6 -- 3.4.5 DHCPv6 -- 3.5 IP Routing -- 3.6 Web Browsing with HTTP Protocol -- 3.7 Questions -- References -- Part III Mobile Cellular Systems -- Chapter 4 Cellular Networks -- 4.1 Cellular Networking Concepts -- 4.1.1 Structure of a Cellular Network -- 4.1.2 Operation of Cellular Network.
4.1.3 Antenna Technologies -- 4.1.4 Multiplexing Methods in Cellular Networks -- 4.1.4.1 Frequency Division Multiple Access (FDMA) -- 4.1.4.2 Code Division Multiple Access (CDMA) -- 4.1.4.3 Orthogonal Frequency Division Multiple Access (OFDMA) -- 4.1.5 Mobility Management -- 4.2 History of Cellular Technologies -- 4.3 First Generation -- 4.4 Questions -- References -- Chapter 5 Second Generation -- 5.1 GSM -- 5.1.1 Standardization of Second Generation Cellular Systems -- 5.1.2 Frequency Bands Used for GSM -- 5.1.3 Architecture and Services of GSM Systems -- 5.1.3.1 GSM Services -- 5.1.3.2 GSM System Architecture -- 5.1.3.3 GSM Functions and Procedures -- 5.1.3.4 GSM Protocol Stack Architecture -- 5.1.4 GSM Radio Interface -- 5.1.4.1 Modulation and Multiplexing -- 5.1.4.2 Frame Structure and Logical Channels -- 5.1.4.3 GSM Bursts and Channel Coding -- 5.1.4.4 GSM Frequency Hopping -- 5.1.5 Signaling Protocols between MS and GSM Network -- 5.1.5.1 LAPDm Protocol -- 5.1.5.2 RIL3 Protocols -- 5.1.6 Signaling Protocols of GSM Network -- 5.1.6.1 Layer 1 -- 5.1.6.2 Layer 2 -- 5.1.6.3 Layer 3 -- 5.1.6.4 SS7 Protocols -- 5.1.7 Radio Resource Management -- 5.1.7.1 GSM Radio Channel Assignment -- 5.1.7.2 Changing Channel Type or Data Rate -- 5.1.7.3 Releasing GSM Radio Channel -- 5.1.8 Security Management -- 5.1.8.1 Security Algorithms -- 5.1.8.2 Security Procedures -- 5.1.8.3 Hiding The Identity of the User -- 5.1.9 Communication Management -- 5.1.9.1 Mobile Originated Call -- 5.1.9.2 Mobile Terminated Call -- 5.1.9.3 Call Release -- 5.1.9.4 Other Communication Management Functions -- 5.1.10 Voice and Message Communications -- 5.1.10.1 Voice Encoding for GSM Circuit Switched Call -- 5.1.10.2 Short Messages -- 5.1.11 Data Connections -- 5.1.11.1 Circuit Switched Data -- 5.1.11.2 Data Connectivity to External Data Networks.
5.1.11.3 Data Transport within the GSM Network -- 5.1.12 Mobility Management -- 5.1.12.1 PLMN and Cell Selection -- 5.1.12.2 Location Update -- 5.1.12.3 Handover in Dedicated Mode -- 5.2 General Packet Radio Service -- 5.2.1 Standardization of General Packet Radio Service -- 5.2.2 Architecture and Services of GPRS System -- 5.2.2.1 GPRS System Architecture -- 5.2.2.2 GPRS Functions and Procedures -- 5.2.2.3 GPRS Protocol Stack Architecture -- 5.2.3 GPRS Radio Interface -- 5.2.3.1 GPRS Radio Resource Allocation -- 5.2.3.2 GPRS Logical Channels -- 5.2.3.3 GPRS Channel Coding and Transmitter Design -- 5.2.4 Protocols between MS and GPRS Network -- 5.2.4.1 MAC Protocol -- 5.2.4.2 RLC Protocol -- 5.2.4.3 LLC Protocol -- 5.2.4.4 SNDCP Protocol -- 5.2.5 Protocols of GPRS Network -- 5.2.5.1 NS Layer Protocols -- 5.2.5.2 BSSGP Protocol -- 5.2.5.3 GTP Protocol -- 5.2.6 Radio Resource Management -- 5.2.6.1 Opening and Releasing of Dedicated GPRS Radio Channels -- 5.2.7 Mobility Management -- 5.2.7.1 GPRS Attach -- 5.2.7.2 Cell Reselection -- 5.2.7.3 Routing Area Update -- 5.2.8 Packet Data Connections -- 5.2.8.1 PDP Context Management -- 5.2.8.2 Transfer of Packet Data in GPRS System -- 5.3 EDGE -- 5.3.1 ECSD -- 5.3.2 EGPRS -- 5.3.3 EGPRS2 -- 5.4 Questions -- References -- Chapter 6 Third Generation -- 6.1 Universal Mobile Telecommunications System (UMTS) -- 6.1.1 Standardization of Third-Generation Cellular Systems -- 6.1.2 Frequency Bands Used for WCDMA UMTS -- 6.1.3 Architecture and Services of UMTS Systems -- 6.1.3.1 UMTS Services -- 6.1.3.2 UMTS System Architecture -- 6.1.3.3 UMTS Bearer Model -- 6.1.3.4 UMTS Functions and Procedures -- 6.1.3.5 UMTS Protocol Stack Architecture -- 6.1.3.6 UMTS Radio Channel Architecture -- 6.1.4 WCDMA Radio Interface -- 6.1.4.1 Modulation and Multiplexing -- 6.1.4.2 Operation of WCDMA Rake Receiver.
6.1.4.3 UMTS Handover Types -- 6.1.4.4 Power Control -- 6.1.4.5 Logical and Transport Channels -- 6.1.4.6 Frame Structure and Physical Channels -- 6.1.4.7 WCDMA Transmitter Design -- 6.1.5 Protocols between UE and UMTS Radio Network -- 6.1.5.1 MAC Protocol -- 6.1.5.2 RLC Protocol -- 6.1.5.3 Packet Data Convergence Protocol -- 6.1.5.4 Radio Resource Control Protocol -- 6.1.6 Signaling Protocols between UE and Core Network -- 6.1.6.1 Mobility Management Protocol -- 6.1.6.2 Connection Management Protocol -- 6.1.6.3 GPRS Mobility Management Protocol -- 6.1.6.4 Session Management Protocol -- 6.1.7 Protocols of UTRAN Radio and Core Networks -- 6.1.7.1 Link and Network Layers -- 6.1.7.2 Iu User Plane Protocol -- 6.1.7.3 Frame Protocol -- 6.1.7.4 Node B Application Protocol -- 6.1.7.5 Radio Access Network Application Protocol -- 6.1.7.6 Radio Network Subsystem Application Protocol -- 6.1.7.7 Mobile Application Protocol -- 6.1.7.8 GPRS Tunneling Protocol -- 6.1.8 Radio Resource Management -- 6.1.8.1 UMTS Cell Search and Initial Access -- 6.1.8.2 Opening and Releasing RRC Connections -- 6.1.8.3 Selection of Channel Type and Adjusting Data Rate -- 6.1.9 Security Management -- 6.1.9.1 Security Algorithms -- 6.1.9.2 Security Procedures -- 6.1.10 Communications Management -- 6.1.10.1 Mobile Originated Circuit Switched Call -- 6.1.10.2 Mobile Terminated Circuit Switched Call -- 6.1.10.3 Circuit Switched Call Release -- 6.1.11 Voice and Message Communications -- 6.1.11.1 Voice Encoding for UMTS Circuit Switched Calls -- 6.1.11.2 Short Message -- 6.1.12 Packet Data Connections -- 6.1.12.1 Quality of Service Classes and Parameters -- 6.1.12.2 Packet Data Protocol (PDP) Context Activation by UE -- 6.1.12.3 Packet Data Protocol Context Activation by the Gateway GPRS Support Node (GGSN) -- 6.1.12.4 Packet Data Protocol Context Deactivation -- 6.1.13 Mobility Management.
6.1.13.1 Cell Reselection.
Record Nr. UNINA-9910831091503321
Koivusalo Erkki  
Piscataway, New Jersey ; ; Hoboken, New Jersey : , : IEEE Press : , : Wiley, , [2023]
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Enabling technologies for mobile services : the MobiLife book / / editor, Mika Klemettinen
Enabling technologies for mobile services : the MobiLife book / / editor, Mika Klemettinen
Pubbl/distr/stampa Chichester, England ; , : J. Wiley, , c2007
Descrizione fisica 1 online resource (439 p.)
Disciplina 621.38456
Altri autori (Persone) KlemettinenMika
Soggetto topico Mobile communication systems - Technological innovations
Wireless communication systems - Technological innovations
ISBN 1-280-97415-X
9786610974153
0-470-51789-1
0-470-51788-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Preface -- Acknowledgments -- Contributors -- List of Figures -- List of Tables -- 1 Introduction (Mika Klemettinen) -- 2 Users, Applications and Services, and User Centricity (Annakaisa Hỹrynen) -- 3 Mobile Services Architecture (Bernd Mrohs and Stephan Steglich) -- 4 Context Awareness and Management (Patrik Florěn and Matthias Wagner) -- 5 Multimodality and Personalisation (David Bonnefoy, Olaf Drg̲ehorn, and Ralf Kernchen) -- 6 Privacy, Trust and Group Communications (Gr̲an Schultz, Olivier Coutand, Ronald van Eijk, Johan Hjelm, Silke Holtmanns, Markus Miettinen, and Rinaldo Nani) -- 7 Reference Applications (Dario Melpignano) -- 8 Trials and Evaluation for Acceptance (Esko Kurvinen, Renata Guarneri, and Jukka T Salo) -- 9 Marketplace Dynamics and Business Models Framework (Ulla Killstrom) -- 10 Legal and Regulatory Framework (Olli Pitkanen) -- 11 Conclusions (Mika Klemettinen) -- Glossary -- Index
Record Nr. UNINA-9910143740503321
Chichester, England ; , : J. Wiley, , c2007
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui

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