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2008 Symposium on Application specific Processors : Anaheim, CA, 8-9 June 2008
| 2008 Symposium on Application specific Processors : Anaheim, CA, 8-9 June 2008 |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2008 |
| Soggetto topico |
Application-specific integrated circuits
Microprocessors Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| ISBN |
1-5090-7439-2
1-4244-2334-1 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996204968903316 |
| [Place of publication not identified], : IEEE, 2008 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
2008 Symposium on Application specific Processors : Anaheim, CA, 8-9 June 2008
| 2008 Symposium on Application specific Processors : Anaheim, CA, 8-9 June 2008 |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2008 |
| Soggetto topico |
Application-specific integrated circuits
Microprocessors Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| ISBN |
9781509074396
1509074392 9781424423347 1424423341 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910145375003321 |
| [Place of publication not identified], : IEEE, 2008 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2009 IEEE 7th Symposium on Application Specific Processors
| 2009 IEEE 7th Symposium on Application Specific Processors |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2009 |
| Descrizione fisica | 1 online resource (121 pages) |
| Disciplina | 621.3815 |
| Soggetto topico |
Application-specific integrated circuits
Microprocessors |
| ISBN |
9781509068647
1509068643 9781424449385 1424449383 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910140042703321 |
| [Place of publication not identified], : IEEE, 2009 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2010 IEEE 8th Symposium on Application Specific Processors
| 2010 IEEE 8th Symposium on Application Specific Processors |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2010 |
| Descrizione fisica | 1 online resource : illustrations |
| Disciplina | 621.3815 |
| Soggetto topico |
Application-specific integrated circuits
Microprocessors |
| ISBN |
9781424479542
1424479541 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910140696603321 |
| [Place of publication not identified], : IEEE, 2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2011 12th International Workshop on Microprocessor Test and Verification
| 2011 12th International Workshop on Microprocessor Test and Verification |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2011 |
| Descrizione fisica | 1 online resource |
| Disciplina | 004.16 |
| Soggetto topico | Microprocessors |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910141336503321 |
| [Place of publication not identified], : IEEE, 2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2019 20th International Workshop on Microprocessor/SoC Test, Security and Verification (MTV) / / Institute of Electrical and Electronics Engineers
| 2019 20th International Workshop on Microprocessor/SoC Test, Security and Verification (MTV) / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, NJ : , : IEEE, , 2019 |
| Descrizione fisica | 1 online resource (192 pages) |
| Disciplina | 001.6404 |
| Soggetto topico | Microprocessors |
| ISBN | 1-7281-5025-6 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | 2019 20th International Workshop on Microprocessor/SoC Test, Security and Verification |
| Record Nr. | UNINA-9910389526003321 |
| Piscataway, NJ : , : IEEE, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2019 20th International Workshop on Microprocessor/SoC Test, Security and Verification (MTV) / / Institute of Electrical and Electronics Engineers
| 2019 20th International Workshop on Microprocessor/SoC Test, Security and Verification (MTV) / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, NJ : , : IEEE, , 2019 |
| Descrizione fisica | 1 online resource (192 pages) |
| Disciplina | 001.6404 |
| Soggetto topico | Microprocessors |
| ISBN | 1-7281-5025-6 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | 2019 20th International Workshop on Microprocessor/SoC Test, Security and Verification |
| Record Nr. | UNISA-996574764303316 |
| Piscataway, NJ : , : IEEE, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
2020 IEEE Hot Chips 32 Symposium (HCS) / / IEEE Hot Chips Symposium, Institute of Electrical and Electronics Engineers
| 2020 IEEE Hot Chips 32 Symposium (HCS) / / IEEE Hot Chips Symposium, Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | [Piscataway, New Jersey] : , : IEEE, , 2020 |
| Descrizione fisica | 1 online resource (various pagings) : illustrations |
| Disciplina | 621.3815 |
| Soggetto topico |
Microprocessors
Integrated circuits |
| ISBN | 1-7281-7129-6 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | 2020 IEEE Hot Chips 32 Symposium |
| Record Nr. | UNINA-9910437218603321 |
| [Piscataway, New Jersey] : , : IEEE, , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2020 IEEE Hot Chips 32 Symposium (HCS) / / IEEE Hot Chips Symposium, Institute of Electrical and Electronics Engineers
| 2020 IEEE Hot Chips 32 Symposium (HCS) / / IEEE Hot Chips Symposium, Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | [Piscataway, New Jersey] : , : IEEE, , 2020 |
| Descrizione fisica | 1 online resource (various pagings) : illustrations |
| Disciplina | 621.3815 |
| Soggetto topico |
Microprocessors
Integrated circuits |
| ISBN | 1-7281-7129-6 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | 2020 IEEE Hot Chips 32 Symposium |
| Record Nr. | UNISA-996575503703316 |
| [Piscataway, New Jersey] : , : IEEE, , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
3D Stacked Chips : From Emerging Processes to Heterogeneous Systems / / edited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis
| 3D Stacked Chips : From Emerging Processes to Heterogeneous Systems / / edited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis |
| Edizione | [1st ed. 2016.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016 |
| Descrizione fisica | 1 online resource (XXIII, 339 p. 238 illus., 157 illus. in color.) |
| Disciplina | 621.3815 |
| Soggetto topico |
Electronic circuits
Microprocessors Circuits and Systems Electronic Circuits and Devices Processor Architectures |
| ISBN | 3-319-20481-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction to Electrical 3D Integration -- Copper-based TSV – Interposer -- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization -- Energy Efficient Electrical Intra-Chip Stack Communication -- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks -- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver -- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications -- Accurate Temperature Measurement for 3D Thermal Management -- EDA Environments for 3D Chip Stacks -- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias -- Introduction to Optical Inter- and Intraconnects -- Optical Through-Silicon Vias -- Integrated Optical Devices for 3D Photonic Transceivers -- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators -- Athermal photonic circuits for optical on-chip interconnects -- Integrated Circuits for 3D Photonic Transceivers -- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.-. |
| Record Nr. | UNINA-9910254242703321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Soggetto topico
-
Microprocessors
(774)
- Processor Architectures (644)
- Computer architecture (243)
- Electronic circuits (242)
- Circuits and Systems (188)