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2008 Symposium on Application specific Processors : Anaheim, CA, 8-9 June 2008
2008 Symposium on Application specific Processors : Anaheim, CA, 8-9 June 2008
Pubbl/distr/stampa [Place of publication not identified], : IEEE, 2008
Soggetto topico Application-specific integrated circuits
Microprocessors
Electrical & Computer Engineering
Engineering & Applied Sciences
Electrical Engineering
ISBN 1-5090-7439-2
1-4244-2334-1
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996204968903316
[Place of publication not identified], : IEEE, 2008
Materiale a stampa
Lo trovi qui: Univ. di Salerno
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2008 Symposium on Application specific Processors : Anaheim, CA, 8-9 June 2008
2008 Symposium on Application specific Processors : Anaheim, CA, 8-9 June 2008
Pubbl/distr/stampa [Place of publication not identified], : IEEE, 2008
Soggetto topico Application-specific integrated circuits
Microprocessors
Electrical & Computer Engineering
Engineering & Applied Sciences
Electrical Engineering
ISBN 1-5090-7439-2
1-4244-2334-1
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910145375003321
[Place of publication not identified], : IEEE, 2008
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
2019 20th International Workshop on Microprocessor/SoC Test, Security and Verification (MTV) / / Institute of Electrical and Electronics Engineers
2019 20th International Workshop on Microprocessor/SoC Test, Security and Verification (MTV) / / Institute of Electrical and Electronics Engineers
Pubbl/distr/stampa Piscataway, NJ : , : IEEE, , 2019
Descrizione fisica 1 online resource (192 pages)
Disciplina 001.6404
Soggetto topico Microprocessors
ISBN 1-7281-5025-6
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti 2019 20th International Workshop on Microprocessor/SoC Test, Security and Verification
Record Nr. UNINA-9910389526003321
Piscataway, NJ : , : IEEE, , 2019
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
2019 20th International Workshop on Microprocessor/SoC Test, Security and Verification (MTV) / / Institute of Electrical and Electronics Engineers
2019 20th International Workshop on Microprocessor/SoC Test, Security and Verification (MTV) / / Institute of Electrical and Electronics Engineers
Pubbl/distr/stampa Piscataway, NJ : , : IEEE, , 2019
Descrizione fisica 1 online resource (192 pages)
Disciplina 001.6404
Soggetto topico Microprocessors
ISBN 1-7281-5025-6
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti 2019 20th International Workshop on Microprocessor/SoC Test, Security and Verification
Record Nr. UNISA-996574764303316
Piscataway, NJ : , : IEEE, , 2019
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
2020 IEEE Hot Chips 32 Symposium (HCS) / / IEEE Hot Chips Symposium, Institute of Electrical and Electronics Engineers
2020 IEEE Hot Chips 32 Symposium (HCS) / / IEEE Hot Chips Symposium, Institute of Electrical and Electronics Engineers
Pubbl/distr/stampa [Piscataway, New Jersey] : , : IEEE, , 2020
Descrizione fisica 1 online resource (various pagings) : illustrations
Disciplina 621.3815
Soggetto topico Microprocessors
Integrated circuits
ISBN 1-7281-7129-6
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti 2020 IEEE Hot Chips 32 Symposium
Record Nr. UNINA-9910437218603321
[Piscataway, New Jersey] : , : IEEE, , 2020
Materiale a stampa
Lo trovi qui: Univ. Federico II
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2020 IEEE Hot Chips 32 Symposium (HCS) / / IEEE Hot Chips Symposium, Institute of Electrical and Electronics Engineers
2020 IEEE Hot Chips 32 Symposium (HCS) / / IEEE Hot Chips Symposium, Institute of Electrical and Electronics Engineers
Pubbl/distr/stampa [Piscataway, New Jersey] : , : IEEE, , 2020
Descrizione fisica 1 online resource (various pagings) : illustrations
Disciplina 621.3815
Soggetto topico Microprocessors
Integrated circuits
ISBN 1-7281-7129-6
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti 2020 IEEE Hot Chips 32 Symposium
Record Nr. UNISA-996575503703316
[Piscataway, New Jersey] : , : IEEE, , 2020
Materiale a stampa
Lo trovi qui: Univ. di Salerno
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3D Stacked Chips : From Emerging Processes to Heterogeneous Systems / / edited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis
3D Stacked Chips : From Emerging Processes to Heterogeneous Systems / / edited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis
Edizione [1st ed. 2016.]
Pubbl/distr/stampa Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016
Descrizione fisica 1 online resource (XXIII, 339 p. 238 illus., 157 illus. in color.)
Disciplina 621.3815
Soggetto topico Electronic circuits
Microprocessors
Circuits and Systems
Electronic Circuits and Devices
Processor Architectures
ISBN 3-319-20481-5
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Introduction to Electrical 3D Integration -- Copper-based TSV – Interposer -- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization -- Energy Efficient Electrical Intra-Chip Stack Communication -- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks -- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver -- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications -- Accurate Temperature Measurement for 3D Thermal Management -- EDA Environments for 3D Chip Stacks -- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias -- Introduction to Optical Inter- and Intraconnects -- Optical Through-Silicon Vias -- Integrated Optical Devices for 3D Photonic Transceivers -- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators -- Athermal photonic circuits for optical on-chip interconnects -- Integrated Circuits for 3D Photonic Transceivers -- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.-.
Record Nr. UNINA-9910254242703321
Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016
Materiale a stampa
Lo trovi qui: Univ. Federico II
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3D Video Coding for Embedded Devices [[electronic resource] ] : Energy Efficient Algorithms and Architectures / / by Bruno Zatt, Muhammad Shafique, Sergio Bampi, Jörg Henkel
3D Video Coding for Embedded Devices [[electronic resource] ] : Energy Efficient Algorithms and Architectures / / by Bruno Zatt, Muhammad Shafique, Sergio Bampi, Jörg Henkel
Autore Zatt Bruno
Edizione [1st ed. 2013.]
Pubbl/distr/stampa New York, NY : , : Springer New York : , : Imprint : Springer, , 2013
Descrizione fisica 1 online resource (219 p.)
Disciplina 004.1
006.22
620
621.381
Soggetto topico Electronic circuits
Electronics
Microelectronics
Microprocessors
Circuits and Systems
Electronics and Microelectronics, Instrumentation
Processor Architectures
ISBN 1-4614-6759-4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Introduction -- Background and Related Work -- Multiview Video Coding Analysis for Energy and Quality -- Energy-Effiecient Algorithms for Multiview Video Coding -- Energy-Efficient Architectures for Multiview Video Coding -- Results and Comparison -- Conclusion and future Works.
Record Nr. UNINA-9910739446903321
Zatt Bruno  
New York, NY : , : Springer New York : , : Imprint : Springer, , 2013
Materiale a stampa
Lo trovi qui: Univ. Federico II
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5G and E-Band Communication Circuits in Deep-Scaled CMOS / / by Marco Vigilante, Patrick Reynaert
5G and E-Band Communication Circuits in Deep-Scaled CMOS / / by Marco Vigilante, Patrick Reynaert
Autore Vigilante Marco
Edizione [1st ed. 2018.]
Pubbl/distr/stampa Cham : , : Springer International Publishing : , : Imprint : Springer, , 2018
Descrizione fisica 1 online resource (205 pages) : illustrations
Disciplina 004.16
Collana Analog Circuits and Signal Processing
Soggetto topico Electronic circuits
Microprocessors
Circuits and Systems
Electronic Circuits and Devices
Processor Architectures
ISBN 3-319-72646-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Introduction -- Gm Stage and Passives in deep-scaled CMOS -- Gain-Bandwidth Enhancement Techniques for mm-Wave fully integrated Amplifiers -- mm-Wave LC VCOs -- mm-Wave Dividers -- mm-Wave Broadband Downconverters -- mm-Wave Highly-Linear Broadband Power Amplifiers -- Conclusion.
Record Nr. UNINA-9910299955203321
Vigilante Marco  
Cham : , : Springer International Publishing : , : Imprint : Springer, , 2018
Materiale a stampa
Lo trovi qui: Univ. Federico II
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8051 Microcontrollers : Fundamental Concepts, Hardware, Software and Applications in Electronics / / by Salvador Pinillos Gimenez
8051 Microcontrollers : Fundamental Concepts, Hardware, Software and Applications in Electronics / / by Salvador Pinillos Gimenez
Autore Gimenez Salvador Pinillos
Edizione [1st ed. 2019.]
Pubbl/distr/stampa Cham : , : Springer International Publishing : , : Imprint : Springer, , 2019
Descrizione fisica 1 online resource (XIII, 322 p. 172 illus., 47 illus. in color.)
Disciplina 004.165
Soggetto topico Electronic circuits
Electronics
Microelectronics
Microprocessors
Circuits and Systems
Electronics and Microelectronics, Instrumentation
Processor Architectures
ISBN 3-319-76439-X
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Fundamental Concepts of Computer Systems -- 8051 Core Microcontrollers -- 8051 - Core Microcontroller Instruction Set -- Flowchart and Assembly Programming -- Subroutine and Structuring of the Assembly Programming Language -- Input/output Ports of 8051 - Core Microcontrollers -- Basic 8051 - Core Microcontroller Interruptions -- Timers/Counters of the 8051 Core Microcontroller -- The Serial Communication Interface of the 8051 - Core Microcontroller.
Record Nr. UNINA-9910337654803321
Gimenez Salvador Pinillos  
Cham : , : Springer International Publishing : , : Imprint : Springer, , 2019
Materiale a stampa
Lo trovi qui: Univ. Federico II
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