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2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS : 9-11 April 2008
| 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS : 9-11 April 2008 |
| Pubbl/distr/stampa | New York : , : IEEE, , 2009 |
| Descrizione fisica | 1 online resource (392 pages) |
| Soggetto topico |
Microelectronic packaging
Microelectromechanical systems Micromachining |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996203024203316 |
| New York : , : IEEE, , 2009 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS : 12-15 May 2019, Paris, France / / Institute of Electrical and Electronics Engineers
| 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS : 12-15 May 2019, Paris, France / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 |
| Descrizione fisica | 1 online resource (63 pages) |
| Disciplina | 621.381046 |
| Soggetto topico |
Microelectronic packaging
Microelectromechanical systems Micromachining |
| ISBN | 1-7281-3286-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910330349903321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS : 12-15 May 2019, Paris, France / / Institute of Electrical and Electronics Engineers
| 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS : 12-15 May 2019, Paris, France / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 |
| Descrizione fisica | 1 online resource (63 pages) |
| Disciplina | 621.381046 |
| Soggetto topico |
Microelectronic packaging
Microelectromechanical systems Micromachining |
| ISBN | 1-7281-3286-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996575274203316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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Chemical gas sensors for aeronautic and space applications / / Gary W. Hunter [and six others]
| Chemical gas sensors for aeronautic and space applications / / Gary W. Hunter [and six others] |
| Autore | Hunter G. W (Gary W.) |
| Pubbl/distr/stampa | Cleveland, Ohio : , : National Aeronautics and Space Administration, Lewis Research Center, , June 1997 |
| Descrizione fisica | 1 online resource (11 pages) : illustrations |
| Collana | NASA technical memorandum |
| Soggetto topico |
Aeronautics
Space exploration Gas detectors Hydrocarbons Micromachining Miniaturization |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910706149103321 |
Hunter G. W (Gary W.)
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| Cleveland, Ohio : , : National Aeronautics and Space Administration, Lewis Research Center, , June 1997 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Design, test, integration and packaging of MEMS/MOEMS 2003 : DTIP 2003 : 5-7 May, 2003, Cannes, France
| Design, test, integration and packaging of MEMS/MOEMS 2003 : DTIP 2003 : 5-7 May, 2003, Cannes, France |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2003 |
| Disciplina | 621.381 |
| Soggetto topico |
Microelectromechanical systems
Optoelectronic devices Micromachining Microelectronic packaging Electrical & Computer Engineering Electrical Engineering Engineering & Applied Sciences |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996202409303316 |
| [Place of publication not identified], : IEEE, 2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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Design, test, integration and packaging of MEMS/MOEMS 2003 : DTIP 2003 : 5-7 May, 2003, Cannes, France
| Design, test, integration and packaging of MEMS/MOEMS 2003 : DTIP 2003 : 5-7 May, 2003, Cannes, France |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2003 |
| Disciplina | 621.381 |
| Soggetto topico |
Microelectromechanical systems
Optoelectronic devices Micromachining Microelectronic packaging Electrical & Computer Engineering Electrical Engineering Engineering & Applied Sciences |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910872421603321 |
| [Place of publication not identified], : IEEE, 2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Direct-write technologies for rapid prototyping applications : sensors, electronics, and integrated power sources / / [edited by] Alberto Pique, Douglas B. Chrisey
| Direct-write technologies for rapid prototyping applications : sensors, electronics, and integrated power sources / / [edited by] Alberto Pique, Douglas B. Chrisey |
| Pubbl/distr/stampa | San Diego, : Academic Press, c2002 |
| Descrizione fisica | 1 online resource (753 p.) |
| Disciplina | 621.381 |
| Altri autori (Persone) |
PiqueAlberto
ChriseyDouglas B |
| Soggetto topico |
Electronic apparatus and appliances - Design and construction
Micromachining Rapid prototyping |
| ISBN |
1-281-03272-7
9786611032722 0-08-050464-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Direct-Write Technologies for Rapid Prototyping Applications: Sensors, Electronics, and Integrated Power Sources; Copyright Page; Contents; Preface; Contributors; Chapter 1. Introduction to Direct-Write Technologies for Rapid Prototyping; 1. Direct-Write Technologies; 2. Electronics; 3. Biomaterials; 4. Miscellaneous Application Areas; 5. Conclusions; Part I: Applications; Chapter 2. Overview of Commercial and Military Application Areas in Passive and Active Electronic Devices; 1. Introduction; 2. Direct-Write Electronic Component Manufacturing
3. Making Direct-Write Processes a Reality4. Applications of Direct-Write Manufacturing; 5. Conclusions; Chapter 3. Role of Direct-Write Tools and Technologies for Microelectronic Manufacturing; 1. Introduction; 2. Direct-Write Technology in the Microelectronics Industry; 3. Next Generation System; 4. Technology Diffusion in Microelectronic Industry; 5. Conclusions; Chapter 4. Direct-Write Materials and Layers for Electrochemical Power Devices; 1. Introduction; 2. Background; 3. Need for Direct-Write Layers; 4. Materials for Metal-Air Batteries and PEM Fuel Cells 5. Direct-Write Layers for Battery and Fuel Cell Applications6. Conclusions; Chapter 5. The Role of Direct Writing for Chemical and Biological Materials: Commercial and Military Sensing Applications; 1. Introduction; 2. Chemical Microsensors; 3. Biosensors and Microwell Technology .; 4. Coating Techniques for Sensing Applications; 5. Case Studies; 6. Summary; Part II: Materials; Chapter 6. Advanced Materials Systems for Ultra-Low- Temperature, Digital, Direct-Write Technologies; 1. Introduction; 2. Deposition Methods and Associated Materials Requirements; 3. Super-Low-Fire Inks and Pastes 4. Conductors5. Resistors; 6. Dielectrics and Ferrites; 7. Phosphor Materials for Information Display Technologies; 8. Materials for Metal-Air Batteries and Proton Exchange Membrane Fuel Cells; 9. Conclusions; Part III: Direct-Write Techniques; Chapter 7. Direct Write Using Ink-Jet Techniques; 1. Introduction; 2. History; 3. Background on Ink-Jet Technology; 4. Jetting Materials; 5. Pattern/Image Formation: Fluid/Substrate Interaction; 6. Throughput Considerations; 7. Direct-Write Applications; 8. Commercial Systems; 9. Future Trends; 10. Summary Chapter 8. Micropen Printing of Electronic Components1. Introduction; 2. The Micropen; 3. Rheological Characteristics of Thick-Film Pastes; 4. Prototyping of Components from Commercial Slurries; 5. Summary; Chapter 9. Direct Write Thermal Spraying of Multilayer Electronics and Sensor Structures; 1. Introduction; 2. Process Description; 3. Materials and Microstructural Characteristics; 4. Multilayer Electronic Circuits and Sensors by Thermal Spray; 5. Fine Feature Deposition by Direct-Write Thermal Spray; 6. Summary Chapter 10. Dip-Pen Nanolithography: Direct Writing Soft Structures on the Sub-100-Nanometer-Length Scale |
| Record Nr. | UNINA-9911004751203321 |
| San Diego, : Academic Press, c2002 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Electrochemical micromachining for nanofabrication, MEMS and nanotechnology / / Bijoy Bhattacharyya
| Electrochemical micromachining for nanofabrication, MEMS and nanotechnology / / Bijoy Bhattacharyya |
| Autore | Bhattacharyya Bijoy |
| Pubbl/distr/stampa | Amsterdam, [Netherlands] : , : William Andrew, , 2015 |
| Descrizione fisica | 1 online resource (297 p.) |
| Disciplina | 671.35 |
| Collana | Micro & Nano Technologies Series |
| Soggetto topico |
Micromachining
Nanotechnology Microelectromechanical systems |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Electrochemical Micromachining for Nanofabrication, MEMS and Nanotechnology; Copyright; Dedication; Contents; About the Author; Foreword; Preface; Acknowledgment; Symbols; CHAPTER 1 - INTRODUCTION; 1.1 MICROMACHINING AND NANOFABRICATION; 1.2 MEMS AND MICROSYSTEMS; 1.3 CONDITIONS FOR MICROMACHINING AND NANOFABRICATION; 1.4 TYPES OF MICROMACHINING PROCESSES; 1.5 ELECTROCHEMICAL MICROMACHINING; 1.6 ELECTROCHEMICAL TECHNOLOGY FOR MICROSYSTEMS AND NANOFABRICATION; REFERENCES; CHAPTER 2 - ELECTROCHEMICAL MACHINING: MACRO TO MICRO; INTRODUCTION; 2.1 BACKGROUND OF ECM
2.2 FUNDAMENTALS OF ANODIC DISSOLUTION2.3 IMPORTANT INFLUENCING FACTORS OF ECM FOR MICROMACHINING; 2.4 EMM: PRESENT STATUS; REFERENCES; CHAPTER 3 - PRINCIPLE OF MATERIAL REMOVAL IN ELECTROCHEMICAL MICROMACHINING; 3.1 MECHANISM OF MATERIAL REMOVAL; 3.2 EQUIVALENT ELECTRICAL CIRCUIT FOR EMM; 3.3 MRR MODEL; REFERENCES; CHAPTER 4 - TYPES OF EMM; INTRODUCTION; 4.1 THROUGH-MASK EMM; 4.2 MASKLESS EMM; 4.3 THREE-DIMENSIONAL EMM; REFERENCES; CHAPTER 5 - ELECTROCHEMICAL MICROMACHINING SETUP; 5.1 DETAILS OF EMM SETUP; 5.2 CURRENT STATUS OF DEVELOPMENTS IN EMM SETUP; 5.3 IEG CONTROL STRATEGY; REFERENCES CHAPTER 6 - DESIGN AND DEVELOPMENTS OF MICROTOOLSINTRODUCTION; 6.1 TYPES OF EMM TOOLS; 6.2 MICROTOOL DESIGN FOR EMM; 6.3 METHODS OF MICROTOOL FABRICATION; 6.4 EMM FOR MICROTOOL FABRICATION; 6.5 DIFFERENT FEATURES OF MICROTOOLS FABRICATED BY EMM; REFERENCES; CHAPTER 7 - INFLUENCING FACTORS OF EMM; INTRODUCTION; 7.1 EMM POWER SUPPLY; 7.2 ELECTROLYTE FOR EMM; 7.3 INFLUENCE OF IEG; 7.4 INFLUENCE OF TEMPERATURE, CONCENTRATION, AND ELECTROLYTE FLOW; 7.5 INFLUENCE OF TOOL FEED RATE; REFERENCES; CHAPTER 8 - IMPROVEMENT OF MACHINING ACCURACY; INTRODUCTION; 8.1 TOOL INSULATION 8.2 ELECTROLYTE CIRCULATION8.3 SHAPE OF THE MICROTOOL; 8.4 TOOL MOVEMENT STRATEGY; 8.5 STRAY CURRENT AND MICROSPARKS PHENOMENA IN EMM; 8.6 HYBRID EMM; 8.7 SELECTION OF COMBINATION OF MACHINING PARAMETERS; REFERENCES; CHAPTER 9 - ADVANTAGES, LIMITATIONS, AND APPLICATIONS OF EMM; INTRODUCTION; 9.1 ADVANTAGES; 9.2 APPLICATIONS; 9.3 LIMITATIONS AND REMEDIES; REFERENCES; CHAPTER 10 - MICRODEVICES FABRICATION FOR MICROELECTROMECHANICAL SYSTEMS AND OTHER MICROENGINEERING APPLICATIONS; INTRODUCTION; 10.1 MICROELECTROMECHANICAL SYSTEMS; 10.2 SEMICONDUCTOR MICROMACHINING BY EMM 10.3 MICROENGINEERING APPLICATIONSREFERENCES; CHAPTER 11 - ELECTROCHEMICAL MICROSYSTEM TECHNOLOGY; INTRODUCTION; 11.1 FEATURES OF EMST; 11.2 SCALING DOWN AND SCALING UP; 11.3 ELECTROCHEMICAL MICROCELL AND MICROELECTRODE; 11.4 ELECTROCHEMICAL REACTIONS IN EMST; 11.5 APPLICATIONS OF EMST IN MICROSYSTEM TECHNOLOGY; REFERENCES; CHAPTER 12 - RECENT ADVANCEMENTS IN EMM FOR MICRO AND NANOFABRICATION; INTRODUCTION; 12.1 WIRE EMM; 12.2 SOLID-STATE EMM; 12.3 SURFACE STRUCTURING; 12.4 ELECTROCHEMICAL WET STAMPING; 12.5 ELECTROCHEMICAL PATTERNING BY ENFACE TECHNOLOGY; 12.6 NANOFABRICATION BY EMM REFERENCES |
| Record Nr. | UNINA-9910788294403321 |
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Bhattacharyya Bijoy
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| Amsterdam, [Netherlands] : , : William Andrew, , 2015 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Electrochemical micromachining for nanofabrication, MEMS and nanotechnology / / Bijoy Bhattacharyya
| Electrochemical micromachining for nanofabrication, MEMS and nanotechnology / / Bijoy Bhattacharyya |
| Autore | Bhattacharyya Bijoy |
| Pubbl/distr/stampa | Amsterdam, [Netherlands] : , : William Andrew, , 2015 |
| Descrizione fisica | 1 online resource (297 p.) |
| Disciplina | 671.35 |
| Collana | Micro & Nano Technologies Series |
| Soggetto topico |
Micromachining
Nanotechnology Microelectromechanical systems |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Electrochemical Micromachining for Nanofabrication, MEMS and Nanotechnology; Copyright; Dedication; Contents; About the Author; Foreword; Preface; Acknowledgment; Symbols; CHAPTER 1 - INTRODUCTION; 1.1 MICROMACHINING AND NANOFABRICATION; 1.2 MEMS AND MICROSYSTEMS; 1.3 CONDITIONS FOR MICROMACHINING AND NANOFABRICATION; 1.4 TYPES OF MICROMACHINING PROCESSES; 1.5 ELECTROCHEMICAL MICROMACHINING; 1.6 ELECTROCHEMICAL TECHNOLOGY FOR MICROSYSTEMS AND NANOFABRICATION; REFERENCES; CHAPTER 2 - ELECTROCHEMICAL MACHINING: MACRO TO MICRO; INTRODUCTION; 2.1 BACKGROUND OF ECM
2.2 FUNDAMENTALS OF ANODIC DISSOLUTION2.3 IMPORTANT INFLUENCING FACTORS OF ECM FOR MICROMACHINING; 2.4 EMM: PRESENT STATUS; REFERENCES; CHAPTER 3 - PRINCIPLE OF MATERIAL REMOVAL IN ELECTROCHEMICAL MICROMACHINING; 3.1 MECHANISM OF MATERIAL REMOVAL; 3.2 EQUIVALENT ELECTRICAL CIRCUIT FOR EMM; 3.3 MRR MODEL; REFERENCES; CHAPTER 4 - TYPES OF EMM; INTRODUCTION; 4.1 THROUGH-MASK EMM; 4.2 MASKLESS EMM; 4.3 THREE-DIMENSIONAL EMM; REFERENCES; CHAPTER 5 - ELECTROCHEMICAL MICROMACHINING SETUP; 5.1 DETAILS OF EMM SETUP; 5.2 CURRENT STATUS OF DEVELOPMENTS IN EMM SETUP; 5.3 IEG CONTROL STRATEGY; REFERENCES CHAPTER 6 - DESIGN AND DEVELOPMENTS OF MICROTOOLSINTRODUCTION; 6.1 TYPES OF EMM TOOLS; 6.2 MICROTOOL DESIGN FOR EMM; 6.3 METHODS OF MICROTOOL FABRICATION; 6.4 EMM FOR MICROTOOL FABRICATION; 6.5 DIFFERENT FEATURES OF MICROTOOLS FABRICATED BY EMM; REFERENCES; CHAPTER 7 - INFLUENCING FACTORS OF EMM; INTRODUCTION; 7.1 EMM POWER SUPPLY; 7.2 ELECTROLYTE FOR EMM; 7.3 INFLUENCE OF IEG; 7.4 INFLUENCE OF TEMPERATURE, CONCENTRATION, AND ELECTROLYTE FLOW; 7.5 INFLUENCE OF TOOL FEED RATE; REFERENCES; CHAPTER 8 - IMPROVEMENT OF MACHINING ACCURACY; INTRODUCTION; 8.1 TOOL INSULATION 8.2 ELECTROLYTE CIRCULATION8.3 SHAPE OF THE MICROTOOL; 8.4 TOOL MOVEMENT STRATEGY; 8.5 STRAY CURRENT AND MICROSPARKS PHENOMENA IN EMM; 8.6 HYBRID EMM; 8.7 SELECTION OF COMBINATION OF MACHINING PARAMETERS; REFERENCES; CHAPTER 9 - ADVANTAGES, LIMITATIONS, AND APPLICATIONS OF EMM; INTRODUCTION; 9.1 ADVANTAGES; 9.2 APPLICATIONS; 9.3 LIMITATIONS AND REMEDIES; REFERENCES; CHAPTER 10 - MICRODEVICES FABRICATION FOR MICROELECTROMECHANICAL SYSTEMS AND OTHER MICROENGINEERING APPLICATIONS; INTRODUCTION; 10.1 MICROELECTROMECHANICAL SYSTEMS; 10.2 SEMICONDUCTOR MICROMACHINING BY EMM 10.3 MICROENGINEERING APPLICATIONSREFERENCES; CHAPTER 11 - ELECTROCHEMICAL MICROSYSTEM TECHNOLOGY; INTRODUCTION; 11.1 FEATURES OF EMST; 11.2 SCALING DOWN AND SCALING UP; 11.3 ELECTROCHEMICAL MICROCELL AND MICROELECTRODE; 11.4 ELECTROCHEMICAL REACTIONS IN EMST; 11.5 APPLICATIONS OF EMST IN MICROSYSTEM TECHNOLOGY; REFERENCES; CHAPTER 12 - RECENT ADVANCEMENTS IN EMM FOR MICRO AND NANOFABRICATION; INTRODUCTION; 12.1 WIRE EMM; 12.2 SOLID-STATE EMM; 12.3 SURFACE STRUCTURING; 12.4 ELECTROCHEMICAL WET STAMPING; 12.5 ELECTROCHEMICAL PATTERNING BY ENFACE TECHNOLOGY; 12.6 NANOFABRICATION BY EMM REFERENCES |
| Record Nr. | UNINA-9910809581903321 |
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Bhattacharyya Bijoy
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| Amsterdam, [Netherlands] : , : William Andrew, , 2015 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Experimental performance of a micromachined heat flux sensor / / S. Stefanescu, R.G. DeAnna, M. Mehregany
| Experimental performance of a micromachined heat flux sensor / / S. Stefanescu, R.G. DeAnna, M. Mehregany |
| Autore | Stefanescu S. |
| Pubbl/distr/stampa | Cleveland, Ohio : , : National Aeronautics and Space Administration, Lewis Research Center, , April 1998 |
| Descrizione fisica | 1 online resource (11 pages .) : illustrations |
| Collana | NASA technical memorandum |
| Soggetto topico |
Micromachining
Miniaturization Fabrication Polyimides Thin films |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910705873303321 |
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Stefanescu S.
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| Cleveland, Ohio : , : National Aeronautics and Space Administration, Lewis Research Center, , April 1998 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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