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22nd European Mask and Lithography Conference : 23-26 January 2006
| 22nd European Mask and Lithography Conference : 23-26 January 2006 |
| Pubbl/distr/stampa | New York : , : IEEE, , 2011 |
| Descrizione fisica | 1 online resource (175 pages) |
| Disciplina | 621.3815 |
| Altri autori (Persone) | BehringerUwe F. W |
| Soggetto topico |
Microlithography
Integrated circuits - Masks |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996215980503316 |
| New York : , : IEEE, , 2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
23rd European Mask and Lithography Conference : 22-26 January 2007
| 23rd European Mask and Lithography Conference : 22-26 January 2007 |
| Pubbl/distr/stampa | New York : , : IEEE, , 2011 |
| Descrizione fisica | 1 online resource (230 pages) |
| Soggetto topico |
Microlithography
Integrated circuits - Masks |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996215980403316 |
| New York : , : IEEE, , 2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
25th European Mask and Lithography Conference : 12-15 January 2009
| 25th European Mask and Lithography Conference : 12-15 January 2009 |
| Pubbl/distr/stampa | Frankfurt am Main, Germany : , : VDE, , 2011 |
| Descrizione fisica | 1 online resource (135 pages) |
| Disciplina | 621.3815 |
| Altri autori (Persone) | BehringerUwe F. W |
| Soggetto topico |
Microlithography
Integrated circuits - Masks |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996215980303316 |
| Frankfurt am Main, Germany : , : VDE, , 2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
Atzverfahren Fur Die Mikrotechnik
| Atzverfahren Fur Die Mikrotechnik |
| Autore | Kohler |
| Pubbl/distr/stampa | [Place of publication not identified], : Wiley VCH Imprint, 1998 |
| Descrizione fisica | 1 online resource (409 pages) |
| Disciplina | 540 |
| Soggetto topico |
Masks (Electronics)
Microlithography Plasma etching |
| ISBN |
1-280-55937-3
9786610559374 3-527-60291-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | ger |
| Nota di contenuto | Einführung -- Besonderheiten mikrotechnischer Ätzverfahren -- Nassätzverfahren -- Trockenätzverfahren -- Mikroformgebung durch Ätzen von lokal verändertem Material -- Ausgewählte Vorschriften. |
| Record Nr. | UNINA-9910830441103321 |
Kohler
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| [Place of publication not identified], : Wiley VCH Imprint, 1998 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Atzverfahren Fur Die Mikrotechnik
| Atzverfahren Fur Die Mikrotechnik |
| Autore | Kohler |
| Pubbl/distr/stampa | [Place of publication not identified], : Wiley VCH Imprint, 1998 |
| Descrizione fisica | 1 online resource (409 pages) |
| Disciplina | 540 |
| Soggetto topico |
Masks (Electronics)
Microlithography Plasma etching |
| ISBN |
1-280-55937-3
9786610559374 3-527-60291-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | ger |
| Nota di contenuto | Einführung -- Besonderheiten mikrotechnischer Ätzverfahren -- Nassätzverfahren -- Trockenätzverfahren -- Mikroformgebung durch Ätzen von lokal verändertem Material -- Ausgewählte Vorschriften. |
| Record Nr. | UNINA-9910840845003321 |
|
Kohler
|
||
| [Place of publication not identified], : Wiley VCH Imprint, 1998 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Digest of papers : Microprocesses and nanotechnology 2007 : 2007 International Microprocesses and Nanotechnology Conference, November 5-8, 2007, Koyto International Conference Center, Kyoto, Japan
| Digest of papers : Microprocesses and nanotechnology 2007 : 2007 International Microprocesses and Nanotechnology Conference, November 5-8, 2007, Koyto International Conference Center, Kyoto, Japan |
| Pubbl/distr/stampa | [Place of publication not identified], : Japan Society of Applied Physics, 2007 |
| Disciplina | 620/.5 |
| Soggetto topico |
Nanotechnology
Microelectronics Microlithography Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996200407103316 |
| [Place of publication not identified], : Japan Society of Applied Physics, 2007 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
EMLC 2007 : 23rd European Mask and Lithography Conference : 22-25 January 2007, Grenoble, France
| EMLC 2007 : 23rd European Mask and Lithography Conference : 22-25 January 2007, Grenoble, France |
| Pubbl/distr/stampa | [Place of publication not identified], : SPIE, 2007 |
| Disciplina | 621.3815/31 |
| Collana | Proceedings of SPIE EMLC 2007 |
| Soggetto topico |
Integrated circuits - Masks
Microlithography Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996279650603316 |
| [Place of publication not identified], : SPIE, 2007 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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Etching in microsystem technology [[electronic resource] /] / Michael Köhler ; translated by Antje Wiegand
| Etching in microsystem technology [[electronic resource] /] / Michael Köhler ; translated by Antje Wiegand |
| Autore | Köhler J. M (J. Michael), <1956-> |
| Pubbl/distr/stampa | Weinheim ; ; New York, : Wiley-VCH, c1999 |
| Descrizione fisica | 1 online resource (386 p.) |
| Disciplina |
621.381531
660 |
| Soggetto topico |
Masks (Electronics)
Microlithography Plasma etching |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-281-76426-4
9786611764265 3-527-61378-1 3-527-61379-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Etching in Microsystem Technology; Preface; Contents; Table of Contents; Symbols; Abbreviations; 1 Introduction; 2 Distinctive Features of Microtechnical Etching; 2.1 Etching as a Fashioning Method; 2.1.1 Limits of Additive Microtechnical Pattern Generation; 2.1.2 Subtractive Pattern Generation; 2.2 Etch Rate and Selectivity; 2.2.1 Etch Rate and Time Request; 2.2.2 The Etching Process; 2.2.3 Transport Processes; 2.2.4 Process Velocities; 2.3. Isotropic and Anisotropic Etching; 2.4 Edge Geometry and Roughness; 2.4.1 Deviations from Ideal Geometry; 2.4.2 Flank Geometry in Isotropic Etching
2.4.3 Fabrication of Low Slope Angles by Isotropic Etching2.4.4 Flank Geometries in Anisotropic Etching; 2.4.5 Setting the Flank Geometry by Partial Anisotropic Etching; 2.5 Accuracy; 2.6 Monitoring of Etching Processes; 3 Wet-Chemical Etching Methods; 3.1 Etching at the Interface Solid-Liquid; 3.2 Preparation of the Surface; 3.2.1 Surface Condition; 3.2.2 Cleaning; 3.2.3 Digital Etching; 3.3 Etching of Dielectric Materials; 3.3.1 Wet Etching by Physical Dissolution; 3.3.2 Wet-Chemical Etching of Non-Metals; 3.4 Etching of Metals and Semiconductors; 3.4.1 Outer-Currentless Etching 3.4.2 Selectivity in Outer-Currentless Etching3.4.3 Etching of Multilayer Systems Forming Local Elements; 3.4.4 Geometry-Dependent Etch Rates; 3.4.5 Geometry-Dependent Passivation; 3.4.6 Electrochemical Etching; 3.4.7 Photochemical Wet Etching; 3.4.8 Photoelectrochemical Etching(PEC); 3.5 Crystallographic Etching; 3.5.1 Chemical Wet-Etching of Monocrystalline Surfaces; 3.5.2 Anisotropic Etching of Monocrystalline Metals; 3.5.3 Anisotropic Etching of Silicon; 3.5.4 Anisotropic Electrochemical and Photoelectrochemical Etching; 3.5.5 Porous Silicon 3 S.6 Anisotropic Etching of Compound Semiconductors3.6 Preparation of Free-Standing Micropatterns; 3.6.1 Surface Micromachining; 3.6.2 Bulk Micromachining; 3.6.3 Porous Silicon as Sacrificial Material; 4 Dry-Etching Methods; 4.1 Removal at the Interface Solid-Gas; 4.2 Plasma-Free Etching in the Gas Phase; 4.2.1 Plasma-Free Dry-Etching with Reactive Gases; 4.2.2 Photo-Assisted Dry Etching with Reactive Gases; 4.2.3 Directly Writing Micropatterning by Laser Scanning Etching; 4.2.4 Electron-Beam-Assisted Vapour Etching; 4.3 Plasma Etching Methods 4.3.1 Material Removal by Reactions with Plasma Species4.3.2 Plasma Generation; 4.3.3 Plasma Etching in the Barrel Reactor; 4.3.4 Plasma Etching in the Down-Stream Reactor; 4.3.5 Plasma Etching in the Planar-Plate Reactor; 4.3.6 Magnetic-Field-Enhanced Plasma Etching; 4.3.7 Plasma Etching at Low Pressure and High Ion Density; 4.3.8 Forming of Etch Structures in Plasma Etching; 4.3.9 Geometry Influence on Plasma Etching; 4.3.10 Plasma Jet Etching (PJE); 4.3.11 Applications of Plasma Etching; 4.4 Etchig Methods with Energized Particles; 4.4.1 Sputter-Etching; 4.4.2 Reactive Ion Etching (RIE) 4.4.3 Magnetic-Field-Enhanced Reactive Ion Etching (MERIE) |
| Record Nr. | UNINA-9910144331103321 |
|
Köhler J. M (J. Michael), <1956->
|
||
| Weinheim ; ; New York, : Wiley-VCH, c1999 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Etching in microsystem technology [[electronic resource] /] / Michael Köhler ; translated by Antje Wiegand
| Etching in microsystem technology [[electronic resource] /] / Michael Köhler ; translated by Antje Wiegand |
| Autore | Köhler J. M (J. Michael), <1956-> |
| Pubbl/distr/stampa | Weinheim ; ; New York, : Wiley-VCH, c1999 |
| Descrizione fisica | 1 online resource (386 p.) |
| Disciplina |
621.381531
660 |
| Soggetto topico |
Masks (Electronics)
Microlithography Plasma etching |
| ISBN |
1-281-76426-4
9786611764265 3-527-61378-1 3-527-61379-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Etching in Microsystem Technology; Preface; Contents; Table of Contents; Symbols; Abbreviations; 1 Introduction; 2 Distinctive Features of Microtechnical Etching; 2.1 Etching as a Fashioning Method; 2.1.1 Limits of Additive Microtechnical Pattern Generation; 2.1.2 Subtractive Pattern Generation; 2.2 Etch Rate and Selectivity; 2.2.1 Etch Rate and Time Request; 2.2.2 The Etching Process; 2.2.3 Transport Processes; 2.2.4 Process Velocities; 2.3. Isotropic and Anisotropic Etching; 2.4 Edge Geometry and Roughness; 2.4.1 Deviations from Ideal Geometry; 2.4.2 Flank Geometry in Isotropic Etching
2.4.3 Fabrication of Low Slope Angles by Isotropic Etching2.4.4 Flank Geometries in Anisotropic Etching; 2.4.5 Setting the Flank Geometry by Partial Anisotropic Etching; 2.5 Accuracy; 2.6 Monitoring of Etching Processes; 3 Wet-Chemical Etching Methods; 3.1 Etching at the Interface Solid-Liquid; 3.2 Preparation of the Surface; 3.2.1 Surface Condition; 3.2.2 Cleaning; 3.2.3 Digital Etching; 3.3 Etching of Dielectric Materials; 3.3.1 Wet Etching by Physical Dissolution; 3.3.2 Wet-Chemical Etching of Non-Metals; 3.4 Etching of Metals and Semiconductors; 3.4.1 Outer-Currentless Etching 3.4.2 Selectivity in Outer-Currentless Etching3.4.3 Etching of Multilayer Systems Forming Local Elements; 3.4.4 Geometry-Dependent Etch Rates; 3.4.5 Geometry-Dependent Passivation; 3.4.6 Electrochemical Etching; 3.4.7 Photochemical Wet Etching; 3.4.8 Photoelectrochemical Etching(PEC); 3.5 Crystallographic Etching; 3.5.1 Chemical Wet-Etching of Monocrystalline Surfaces; 3.5.2 Anisotropic Etching of Monocrystalline Metals; 3.5.3 Anisotropic Etching of Silicon; 3.5.4 Anisotropic Electrochemical and Photoelectrochemical Etching; 3.5.5 Porous Silicon 3 S.6 Anisotropic Etching of Compound Semiconductors3.6 Preparation of Free-Standing Micropatterns; 3.6.1 Surface Micromachining; 3.6.2 Bulk Micromachining; 3.6.3 Porous Silicon as Sacrificial Material; 4 Dry-Etching Methods; 4.1 Removal at the Interface Solid-Gas; 4.2 Plasma-Free Etching in the Gas Phase; 4.2.1 Plasma-Free Dry-Etching with Reactive Gases; 4.2.2 Photo-Assisted Dry Etching with Reactive Gases; 4.2.3 Directly Writing Micropatterning by Laser Scanning Etching; 4.2.4 Electron-Beam-Assisted Vapour Etching; 4.3 Plasma Etching Methods 4.3.1 Material Removal by Reactions with Plasma Species4.3.2 Plasma Generation; 4.3.3 Plasma Etching in the Barrel Reactor; 4.3.4 Plasma Etching in the Down-Stream Reactor; 4.3.5 Plasma Etching in the Planar-Plate Reactor; 4.3.6 Magnetic-Field-Enhanced Plasma Etching; 4.3.7 Plasma Etching at Low Pressure and High Ion Density; 4.3.8 Forming of Etch Structures in Plasma Etching; 4.3.9 Geometry Influence on Plasma Etching; 4.3.10 Plasma Jet Etching (PJE); 4.3.11 Applications of Plasma Etching; 4.4 Etchig Methods with Energized Particles; 4.4.1 Sputter-Etching; 4.4.2 Reactive Ion Etching (RIE) 4.4.3 Magnetic-Field-Enhanced Reactive Ion Etching (MERIE) |
| Record Nr. | UNINA-9910829980103321 |
|
Köhler J. M (J. Michael), <1956->
|
||
| Weinheim ; ; New York, : Wiley-VCH, c1999 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Etching in microsystem technology [[electronic resource] /] / Michael Köhler ; translated by Antje Wiegand
| Etching in microsystem technology [[electronic resource] /] / Michael Köhler ; translated by Antje Wiegand |
| Autore | Köhler J. M (J. Michael), <1956-> |
| Pubbl/distr/stampa | Weinheim ; ; New York, : Wiley-VCH, c1999 |
| Descrizione fisica | 1 online resource (386 p.) |
| Disciplina |
621.381531
660 |
| Soggetto topico |
Masks (Electronics)
Microlithography Plasma etching |
| ISBN |
1-281-76426-4
9786611764265 3-527-61378-1 3-527-61379-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Etching in Microsystem Technology; Preface; Contents; Table of Contents; Symbols; Abbreviations; 1 Introduction; 2 Distinctive Features of Microtechnical Etching; 2.1 Etching as a Fashioning Method; 2.1.1 Limits of Additive Microtechnical Pattern Generation; 2.1.2 Subtractive Pattern Generation; 2.2 Etch Rate and Selectivity; 2.2.1 Etch Rate and Time Request; 2.2.2 The Etching Process; 2.2.3 Transport Processes; 2.2.4 Process Velocities; 2.3. Isotropic and Anisotropic Etching; 2.4 Edge Geometry and Roughness; 2.4.1 Deviations from Ideal Geometry; 2.4.2 Flank Geometry in Isotropic Etching
2.4.3 Fabrication of Low Slope Angles by Isotropic Etching2.4.4 Flank Geometries in Anisotropic Etching; 2.4.5 Setting the Flank Geometry by Partial Anisotropic Etching; 2.5 Accuracy; 2.6 Monitoring of Etching Processes; 3 Wet-Chemical Etching Methods; 3.1 Etching at the Interface Solid-Liquid; 3.2 Preparation of the Surface; 3.2.1 Surface Condition; 3.2.2 Cleaning; 3.2.3 Digital Etching; 3.3 Etching of Dielectric Materials; 3.3.1 Wet Etching by Physical Dissolution; 3.3.2 Wet-Chemical Etching of Non-Metals; 3.4 Etching of Metals and Semiconductors; 3.4.1 Outer-Currentless Etching 3.4.2 Selectivity in Outer-Currentless Etching3.4.3 Etching of Multilayer Systems Forming Local Elements; 3.4.4 Geometry-Dependent Etch Rates; 3.4.5 Geometry-Dependent Passivation; 3.4.6 Electrochemical Etching; 3.4.7 Photochemical Wet Etching; 3.4.8 Photoelectrochemical Etching(PEC); 3.5 Crystallographic Etching; 3.5.1 Chemical Wet-Etching of Monocrystalline Surfaces; 3.5.2 Anisotropic Etching of Monocrystalline Metals; 3.5.3 Anisotropic Etching of Silicon; 3.5.4 Anisotropic Electrochemical and Photoelectrochemical Etching; 3.5.5 Porous Silicon 3 S.6 Anisotropic Etching of Compound Semiconductors3.6 Preparation of Free-Standing Micropatterns; 3.6.1 Surface Micromachining; 3.6.2 Bulk Micromachining; 3.6.3 Porous Silicon as Sacrificial Material; 4 Dry-Etching Methods; 4.1 Removal at the Interface Solid-Gas; 4.2 Plasma-Free Etching in the Gas Phase; 4.2.1 Plasma-Free Dry-Etching with Reactive Gases; 4.2.2 Photo-Assisted Dry Etching with Reactive Gases; 4.2.3 Directly Writing Micropatterning by Laser Scanning Etching; 4.2.4 Electron-Beam-Assisted Vapour Etching; 4.3 Plasma Etching Methods 4.3.1 Material Removal by Reactions with Plasma Species4.3.2 Plasma Generation; 4.3.3 Plasma Etching in the Barrel Reactor; 4.3.4 Plasma Etching in the Down-Stream Reactor; 4.3.5 Plasma Etching in the Planar-Plate Reactor; 4.3.6 Magnetic-Field-Enhanced Plasma Etching; 4.3.7 Plasma Etching at Low Pressure and High Ion Density; 4.3.8 Forming of Etch Structures in Plasma Etching; 4.3.9 Geometry Influence on Plasma Etching; 4.3.10 Plasma Jet Etching (PJE); 4.3.11 Applications of Plasma Etching; 4.4 Etchig Methods with Energized Particles; 4.4.1 Sputter-Etching; 4.4.2 Reactive Ion Etching (RIE) 4.4.3 Magnetic-Field-Enhanced Reactive Ion Etching (MERIE) |
| Record Nr. | UNINA-9910841565003321 |
|
Köhler J. M (J. Michael), <1956->
|
||
| Weinheim ; ; New York, : Wiley-VCH, c1999 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
