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10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 26-29 April 2009, Delft, Netherlands / / Institute of Electrical and Electronics Engineers
10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 26-29 April 2009, Delft, Netherlands / / Institute of Electrical and Electronics Engineers
Pubbl/distr/stampa Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2009
Descrizione fisica 1 online resource (114 pages)
Disciplina 621.3815
Soggetto topico Integrated circuits - Simulation methods
Microelectronics - Design
Microelectronics - Simulation methods
ISBN 1-4244-4161-7
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996212387603316
Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2009
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 26-29 April 2009, Delft, Netherlands / / Institute of Electrical and Electronics Engineers
10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 26-29 April 2009, Delft, Netherlands / / Institute of Electrical and Electronics Engineers
Pubbl/distr/stampa Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2009
Descrizione fisica 1 online resource (114 pages)
Disciplina 621.3815
Soggetto topico Integrated circuits - Simulation methods
Microelectronics - Design
Microelectronics - Simulation methods
ISBN 1-4244-4161-7
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910138914903321
Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2009
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 24-27 March 2019, Hannover, Germany / / Institute of Electrical and Electronics Engineers
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 24-27 March 2019, Hannover, Germany / / Institute of Electrical and Electronics Engineers
Pubbl/distr/stampa Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019
Descrizione fisica 1 online resource (78 pages)
Disciplina 621.381011
Soggetto topico Microelectronics - Simulation methods
Systems engineering - Simulation methods
ISBN 1-5386-8040-8
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910325656903321
Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 24-27 March 2019, Hannover, Germany / / Institute of Electrical and Electronics Engineers
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 24-27 March 2019, Hannover, Germany / / Institute of Electrical and Electronics Engineers
Pubbl/distr/stampa Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019
Descrizione fisica 1 online resource (78 pages)
Disciplina 621.381011
Soggetto topico Microelectronics - Simulation methods
Systems engineering - Simulation methods
ISBN 1-5386-8040-8
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996575392303316
Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
EuroSimE : 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems : 7-9 April 2014
EuroSimE : 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems : 7-9 April 2014
Pubbl/distr/stampa New York : , : IEEE, , 2014
Descrizione fisica 1 online resource (120 pages)
Soggetto topico Microelectronics - Simulation methods
Systems engineering - Simulation methods
ISBN 1-4799-4790-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910140442003321
New York : , : IEEE, , 2014
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
EuroSimE : 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems : 7-9 April 2014
EuroSimE : 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems : 7-9 April 2014
Pubbl/distr/stampa New York : , : IEEE, , 2014
Descrizione fisica 1 online resource (120 pages)
Soggetto topico Microelectronics - Simulation methods
Systems engineering - Simulation methods
ISBN 1-4799-4790-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996281108503316
New York : , : IEEE, , 2014
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems : EuroSimE 2007 / / edited by L.J. Ernst ... [et al.] ; fully sponsored by IEEE--CPMT
Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems : EuroSimE 2007 / / edited by L.J. Ernst ... [et al.] ; fully sponsored by IEEE--CPMT
Pubbl/distr/stampa IEEE
Disciplina 621.38101/1
Altri autori (Persone) ErnstL. J
Soggetto topico Microelectronics - Simulation methods
Systems engineering - Simulation methods
ISBN 1-5090-8960-8
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti VLSI Design
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007
Record Nr. UNISA-996281109203316
IEEE
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems : EuroSimE 2007 / / edited by L.J. Ernst ... [et al.] ; fully sponsored by IEEE--CPMT
Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems : EuroSimE 2007 / / edited by L.J. Ernst ... [et al.] ; fully sponsored by IEEE--CPMT
Pubbl/distr/stampa IEEE
Disciplina 621.38101/1
Altri autori (Persone) ErnstL. J
Soggetto topico Microelectronics - Simulation methods
Systems engineering - Simulation methods
ISBN 1-5090-8960-8
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti VLSI Design
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007
Record Nr. UNINA-9910143028503321
IEEE
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui