10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 26-29 April 2009, Delft, Netherlands / / Institute of Electrical and Electronics Engineers
| 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 26-29 April 2009, Delft, Netherlands / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2009 |
| Descrizione fisica | 1 online resource (114 pages) |
| Disciplina | 621.3815 |
| Soggetto topico |
Integrated circuits - Simulation methods
Microelectronics - Design Microelectronics - Simulation methods |
| ISBN | 1-4244-4161-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996212387603316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2009 | ||
| Lo trovi qui: Univ. di Salerno | ||
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10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 26-29 April 2009, Delft, Netherlands / / Institute of Electrical and Electronics Engineers
| 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 26-29 April 2009, Delft, Netherlands / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2009 |
| Descrizione fisica | 1 online resource (114 pages) |
| Disciplina | 621.3815 |
| Soggetto topico |
Integrated circuits - Simulation methods
Microelectronics - Design Microelectronics - Simulation methods |
| ISBN | 1-4244-4161-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910138914903321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2009 | ||
| Lo trovi qui: Univ. Federico II | ||
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2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 24-27 March 2019, Hannover, Germany / / Institute of Electrical and Electronics Engineers
| 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 24-27 March 2019, Hannover, Germany / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 |
| Descrizione fisica | 1 online resource (78 pages) |
| Disciplina | 621.381011 |
| Soggetto topico |
Microelectronics - Simulation methods
Systems engineering - Simulation methods |
| ISBN | 1-5386-8040-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910325656903321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 24-27 March 2019, Hannover, Germany / / Institute of Electrical and Electronics Engineers
| 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 24-27 March 2019, Hannover, Germany / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 |
| Descrizione fisica | 1 online resource (78 pages) |
| Disciplina | 621.381011 |
| Soggetto topico |
Microelectronics - Simulation methods
Systems engineering - Simulation methods |
| ISBN | 1-5386-8040-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996575392303316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 | ||
| Lo trovi qui: Univ. di Salerno | ||
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EuroSimE : 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems : 7-9 April 2014
| EuroSimE : 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems : 7-9 April 2014 |
| Pubbl/distr/stampa | New York : , : IEEE, , 2014 |
| Descrizione fisica | 1 online resource (120 pages) |
| Soggetto topico |
Microelectronics - Simulation methods
Systems engineering - Simulation methods |
| ISBN | 1-4799-4790-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910140442003321 |
| New York : , : IEEE, , 2014 | ||
| Lo trovi qui: Univ. Federico II | ||
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EuroSimE : 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems : 7-9 April 2014
| EuroSimE : 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems : 7-9 April 2014 |
| Pubbl/distr/stampa | New York : , : IEEE, , 2014 |
| Descrizione fisica | 1 online resource (120 pages) |
| Soggetto topico |
Microelectronics - Simulation methods
Systems engineering - Simulation methods |
| ISBN | 1-4799-4790-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996281108503316 |
| New York : , : IEEE, , 2014 | ||
| Lo trovi qui: Univ. di Salerno | ||
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Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems : EuroSimE 2007 / / edited by L.J. Ernst ... [et al.] ; fully sponsored by IEEE--CPMT
| Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems : EuroSimE 2007 / / edited by L.J. Ernst ... [et al.] ; fully sponsored by IEEE--CPMT |
| Pubbl/distr/stampa | IEEE |
| Disciplina | 621.38101/1 |
| Altri autori (Persone) | ErnstL. J |
| Soggetto topico |
Microelectronics - Simulation methods
Systems engineering - Simulation methods |
| ISBN | 1-5090-8960-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti |
VLSI Design
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 |
| Record Nr. | UNISA-996281109203316 |
| IEEE | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems : EuroSimE 2007 / / edited by L.J. Ernst ... [et al.] ; fully sponsored by IEEE--CPMT
| Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems : EuroSimE 2007 / / edited by L.J. Ernst ... [et al.] ; fully sponsored by IEEE--CPMT |
| Pubbl/distr/stampa | IEEE |
| Disciplina | 621.38101/1 |
| Altri autori (Persone) | ErnstL. J |
| Soggetto topico |
Microelectronics - Simulation methods
Systems engineering - Simulation methods |
| ISBN |
9781509089604
1509089608 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti |
VLSI Design
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 |
| Record Nr. | UNINA-9910143028503321 |
| IEEE | ||
| Lo trovi qui: Univ. Federico II | ||
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