Edizione | [2nd edition 2021.] |
Pubbl/distr/stampa |
Singapore : , : Springer, , [2021]
|
Descrizione fisica |
1 online resource (XVII, 622 p. 299 illus., 205 illus. in color.)
|
Disciplina |
929.374
|
Collana |
Springer Series in Advanced Microelectronics
|
Soggetto topico |
Biotechnology
Electronics
Electronics - Materials
Microelectronics
Microelectronics - Packaging
Nanotechnology
Electronic circuits
Optical materials
|
ISBN |
981-15-7090-6
|
Formato |
Materiale a stampa ![](img/format/mas.png) |
Livello bibliografico |
Monografia |
Lingua di pubblicazione |
eng
|
Nota di contenuto |
1. Introduction to 3D microelectronic packaging -- 2. 3D packaging architecture and assembly process design -- 3. Fundamentals of TSV processing and reliability -- 4. Mechanical properties of TSV -- 5. Atomistic View of TSV Protrusion/Intrusion -- 6. Fundamentals and failures in Die preparation for 3D packaging -- 7. Direct Cu to Cu bonding and other alternative interconnects in 3D packaging -- 8. Emerging hybrid bonding techniques for 3D packaging -- 9. Fundamental of Thermal Compressive Bonding process, advanced epoxy, and flux materials in 3D packaging -- 10. Fundamentals of solder alloys in 3D packaging -- 11. Fundamentals of electro migration in interconnects of 3D packages -- 12. Fundamentals of heat dissipation in 3D packaging -- 13. Fundamentals of advanced materials and process in substrate technology -- 14. New substrate technologies for 3D packaging. -15. Thermal mechanical and moisture modeling in 3D packaging -- 16. Stress and Strain measurements in 3D packaging -- 17.Processing and Reliability of Solder Interconnections in Stacked Packaging -- 18. Interconnect Quality and Reliability of 3D Packaging -- 19. Fundamentals of automotive reliability of 3D packages -- 20. Fault isolation and failure analysis of 3D packaging.
|
Record Nr. | UNINA-9910484726403321 |