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10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 26-29 April 2009, Delft, Netherlands / / Institute of Electrical and Electronics Engineers
| 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 26-29 April 2009, Delft, Netherlands / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2009 |
| Descrizione fisica | 1 online resource (114 pages) |
| Disciplina | 621.3815 |
| Soggetto topico |
Integrated circuits - Simulation methods
Microelectronics - Design Microelectronics - Simulation methods |
| ISBN | 1-4244-4161-7 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996212387603316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2009 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 26-29 April 2009, Delft, Netherlands / / Institute of Electrical and Electronics Engineers
| 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 26-29 April 2009, Delft, Netherlands / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2009 |
| Descrizione fisica | 1 online resource (114 pages) |
| Disciplina | 621.3815 |
| Soggetto topico |
Integrated circuits - Simulation methods
Microelectronics - Design Microelectronics - Simulation methods |
| ISBN | 1-4244-4161-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910138914903321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2009 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Inkjet-based micromanufacturing [[electronic resource] /] / edited by Jan G. Korvink, Patrick J. Smith, and Dong-Youn Shin
| Inkjet-based micromanufacturing [[electronic resource] /] / edited by Jan G. Korvink, Patrick J. Smith, and Dong-Youn Shin |
| Pubbl/distr/stampa | Weinheim, Germany, : Wiley-VCH, c2012 |
| Descrizione fisica | 1 online resource (389 p.) |
| Disciplina | 621.319 |
| Altri autori (Persone) |
KorvinkJ. G (Jan G.)
SmithPatrick J., Dr. ShinDong-Youn |
| Collana | Advanced micro & nanosystems |
| Soggetto topico |
Microelectronics - Design
Microfabrication Ink-jet printing Microelectromechanical systems - Design and construction |
| ISBN |
1-283-59695-4
9786613909404 3-527-64711-2 3-527-64710-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Inkjet-based Micromanufacturing; Contents; List of Contributors; 1 Overview of Inkjet-Based Micromanufacturing; 1.1 Introduction; 1.2 Inkjet Technology; 1.2.1 Continuous Mode Inkjet (CIJ) Technology; 1.2.2 Demand Mode Inkjet Technology; 1.3 Fluid Requirements; 1.4 Pattern Formation: Fluid/Substrate Interaction; 1.5 Micromanufacturing; 1.5.1 Introduction; 1.5.2 Limitations and Opportunities in Micromanufacturing; 1.5.3 Benefits of Inkjet in Microfabrication; 1.6 Examples of Inkjet in Micromanufacturing; 1.6.1 Chemical Sensors; 1.6.2 Optical MEMS Devices; 1.6.3 Bio-MEMS Devices
1.6.4 Assembly and Packaging1.7 Conclusions; Acknowledgments; References; 2 Combinatorial Screening of Materials Using Inkjet Printing as a Patterning Technique; 2.1 Introduction; 2.2 Inkjet Printing - from Well-Defined Dots to Homogeneous Films; 2.3 Thin-Film Libraries Prepared by Inkjet Printing; 2.4 Combinatorial Screening of Materials for Organic Solar Cells; 2.5 Conclusion and Outlook; References; 3 Thermal Inkjet; 3.1 History of Thermal Inkjet Technology; 3.2 Market Trends for Inkjet Products and Electrophotography; 3.3 Structures of Various TIJ Heads 3.4 Research on Rapid Boiling and Principle of TIJ3.5 Inkjetting Mechanism of TIJ; 3.6 Basic Jetting Behavior of TIJ; 3.6.1 Input Power Characteristics; 3.6.2 Frequency Characteristics; 3.6.3 Dependency on Temperature; 3.7 TIJ Behavior Analysis Using Simulation; 3.7.1 Cylindrical Thermal Propagating Calculation Based on the Finite Element Method (Software Name: Ansys); 3.7.2 Fluidic Free Boundary Calculation Based on the Finite Differentiation Method (Software name: Flow3D); 3.8 Issues with Reliability in TIJ; 3.9 Present and Future Evolution in TIJ Technology; References 4 High-Resolution Electrohydrodynamic Inkjet4.1 Introduction; 4.2 Printing System; 4.3 Control of Jet Motions; 4.4 Drop-on-Demand Mode Printing; 4.5 Versatility of Printable Materials and Resolutions; 4.6 Applications in Electronics and Biotechnology; 4.7 High-Resolution Printing of Charge; References; 5 Cross Talk in Piezo Inkjet; 5.1 Introduction; 5.2 Electrical Cross Talk; 5.3 Direct Cross Talk; 5.4 Pressure-Induced Cross Talk; 5.5 Acoustic Cross Talk; 5.6 Printhead Resonance; 5.7 Residual Vibrations; References; 6 Patterning; 6.1 Introduction; 6.1.1 Droplet Impact and Final Droplet Radius 6.1.2 Evaporation of Inkjet-Printed Droplets at Room Temperature6.1.3 Morphological Control for Ink Droplets, Lines, and Films; 6.2 Conclusion; References; 7 Drying of Inkjet-Printed Droplets; 7.1 Introduction; 7.2 Modeling of Drying of a Droplet; 7.2.1 Fluid Model; 7.2.2 Lubrication Approximation; 7.2.3 Solute Concentration; 7.2.4 Evaporation Velocity; 7.2.5 Numerical Method; 7.3 Results; 7.3.1 Droplet Shape Evolution; 7.3.2 Layer Thickness; 7.3.3 Effect of Diffusion; Acknowledgments; References; 8 Postprinting Processes for Inorganic Inks for Plastic Electronics Applications 8.1 Introduction |
| Record Nr. | UNINA-9910130580503321 |
| Weinheim, Germany, : Wiley-VCH, c2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Inkjet-based micromanufacturing / / edited by Jan G. Korvink, Patrick J. Smith, and Dong-Youn Shin
| Inkjet-based micromanufacturing / / edited by Jan G. Korvink, Patrick J. Smith, and Dong-Youn Shin |
| Edizione | [1st ed.] |
| Pubbl/distr/stampa | Weinheim, Germany, : Wiley-VCH, c2012 |
| Descrizione fisica | 1 online resource (389 p.) |
| Disciplina | 621.319 |
| Altri autori (Persone) |
KorvinkJ. G (Jan G.)
SmithPatrick J., Dr. ShinDong-Youn |
| Collana | Advanced micro & nanosystems |
| Soggetto topico |
Microelectronics - Design
Microfabrication Ink-jet printing Microelectromechanical systems - Design and construction |
| ISBN |
9786613909404
9781283596954 1283596954 9783527647118 3527647112 9783527647101 3527647104 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Inkjet-based Micromanufacturing; Contents; List of Contributors; 1 Overview of Inkjet-Based Micromanufacturing; 1.1 Introduction; 1.2 Inkjet Technology; 1.2.1 Continuous Mode Inkjet (CIJ) Technology; 1.2.2 Demand Mode Inkjet Technology; 1.3 Fluid Requirements; 1.4 Pattern Formation: Fluid/Substrate Interaction; 1.5 Micromanufacturing; 1.5.1 Introduction; 1.5.2 Limitations and Opportunities in Micromanufacturing; 1.5.3 Benefits of Inkjet in Microfabrication; 1.6 Examples of Inkjet in Micromanufacturing; 1.6.1 Chemical Sensors; 1.6.2 Optical MEMS Devices; 1.6.3 Bio-MEMS Devices
1.6.4 Assembly and Packaging1.7 Conclusions; Acknowledgments; References; 2 Combinatorial Screening of Materials Using Inkjet Printing as a Patterning Technique; 2.1 Introduction; 2.2 Inkjet Printing - from Well-Defined Dots to Homogeneous Films; 2.3 Thin-Film Libraries Prepared by Inkjet Printing; 2.4 Combinatorial Screening of Materials for Organic Solar Cells; 2.5 Conclusion and Outlook; References; 3 Thermal Inkjet; 3.1 History of Thermal Inkjet Technology; 3.2 Market Trends for Inkjet Products and Electrophotography; 3.3 Structures of Various TIJ Heads 3.4 Research on Rapid Boiling and Principle of TIJ3.5 Inkjetting Mechanism of TIJ; 3.6 Basic Jetting Behavior of TIJ; 3.6.1 Input Power Characteristics; 3.6.2 Frequency Characteristics; 3.6.3 Dependency on Temperature; 3.7 TIJ Behavior Analysis Using Simulation; 3.7.1 Cylindrical Thermal Propagating Calculation Based on the Finite Element Method (Software Name: Ansys); 3.7.2 Fluidic Free Boundary Calculation Based on the Finite Differentiation Method (Software name: Flow3D); 3.8 Issues with Reliability in TIJ; 3.9 Present and Future Evolution in TIJ Technology; References 4 High-Resolution Electrohydrodynamic Inkjet4.1 Introduction; 4.2 Printing System; 4.3 Control of Jet Motions; 4.4 Drop-on-Demand Mode Printing; 4.5 Versatility of Printable Materials and Resolutions; 4.6 Applications in Electronics and Biotechnology; 4.7 High-Resolution Printing of Charge; References; 5 Cross Talk in Piezo Inkjet; 5.1 Introduction; 5.2 Electrical Cross Talk; 5.3 Direct Cross Talk; 5.4 Pressure-Induced Cross Talk; 5.5 Acoustic Cross Talk; 5.6 Printhead Resonance; 5.7 Residual Vibrations; References; 6 Patterning; 6.1 Introduction; 6.1.1 Droplet Impact and Final Droplet Radius 6.1.2 Evaporation of Inkjet-Printed Droplets at Room Temperature6.1.3 Morphological Control for Ink Droplets, Lines, and Films; 6.2 Conclusion; References; 7 Drying of Inkjet-Printed Droplets; 7.1 Introduction; 7.2 Modeling of Drying of a Droplet; 7.2.1 Fluid Model; 7.2.2 Lubrication Approximation; 7.2.3 Solute Concentration; 7.2.4 Evaporation Velocity; 7.2.5 Numerical Method; 7.3 Results; 7.3.1 Droplet Shape Evolution; 7.3.2 Layer Thickness; 7.3.3 Effect of Diffusion; Acknowledgments; References; 8 Postprinting Processes for Inorganic Inks for Plastic Electronics Applications 8.1 Introduction |
| Record Nr. | UNINA-9910817246103321 |
| Weinheim, Germany, : Wiley-VCH, c2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Robust design of microelectronics assemblies against mechanical shock, temperature and moisture / / E-H Wong, Y.-W Mai
| Robust design of microelectronics assemblies against mechanical shock, temperature and moisture / / E-H Wong, Y.-W Mai |
| Autore | Wong E- H. |
| Pubbl/distr/stampa | Boston, MA : , : Elsevier, , [2015] |
| Descrizione fisica | 1 online resource (477 p.) |
| Disciplina | 621.381046 |
| Collana | Woodhead Publishing series in electronic and optical materials |
| Soggetto topico |
Microelectronics - Design
Industrial design Robust control |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Related titles; Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and MoistureWoodhead Publishing Series i ...; Copyright; Contents; Woodhead Publishing Series in Electronic and Optical Materials; Foreword; Preface; 1 - Introduction; 1.1 Introduction to microelectronic packaging; 1.2 Introduction to robust design; 1.3 Organisation of the book; References; Part 1 - Advances in robust design against temperature-induced failures; 2 - Robust design of microelectronic assemblies against mismatched thermal expansion; 2.1 Introduction; 2.2 Fundamentals
2.3 Comprehensive analysis of a bilayer structure2.4 Microelectronic assembly as a sandwich structure with a continuous bonding layer; 2.5 PCB assembly as a sandwich structure with a layer of solder joints; References; 2. Appendix: prior published works in thermoelasticity; 2. Nomenclature; 2. Mathematical symbols; 3 - Advances in creep-fatigue modelling of solder joints; 3.1 Introduction; 3.2 Life-prediction models for creep-fatigue; 3.3 The unified equation; 3.4 Self-validations and benchmarking; 3.5 Applications; References Part 2 - Advances in robust design against moisture-induced failures4 - Moisture properties and their characterisations; 4.1 Introduction; 4.2 Thermodynamics of water; 4.3 Sorption and its characterisation; 4.4 Diffusivity and its characterisation; 4.5 Hygroscopic swelling and its characterisation; References; 5 - Advances in diffusion and vapour pressure modelling; 5.1 The discontinuity of concentration; 5.2 The fractional saturation; 5.3 Diffusion under time-varying temperature and pressure; 5.4 Advances in vapour pressure modelling; References; Part 3 - Robust design against drop impact 6 - The physics of failure of portable electronic devices in drop impact6.1 Product drop testing; 6.2 The physics of failure; References; 7 - Subsystem testing of solder joints against drop impact; 7.1 Board-level testing; 7.2 Component-level testing; References; 8 - Fatigue resistance of solder joints: strain-life representation; 8.1 Introduction; 8.2 Design of test specimens; 8.3 Fatigue resistance equations: materials; 8.4 Fatigue resistance equations: frequency; 8.5 Fatigue resistance equations: environment; References; 9 - Fatigue crack growth in solder joints at high strain rate 9.1 Introduction9.2 Establishment of continuous crack growth tracking capability; 9.3 Crack propagation characteristics: board-level drop shock test; 9.4 Crack propagation characteristics: high-speed cyclic bending test; 9.5 Three-dimensional fracture mechanics modelling of the crack front; 9.6 Crack propagation in the solder joints of a mobile phone experiencing drop impact; References; 10 - Dynamic deformation of a printed circuit board in drop-shock; 10.1 Introduction; 10.2 Vibration of a test board in the JESD22-B111 drop-shock test 10.3 Analytical solutions for a spring-mass system subjected to half-sine shock |
| Record Nr. | UNINA-9910788103703321 |
Wong E- H.
|
||
| Boston, MA : , : Elsevier, , [2015] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Robust design of microelectronics assemblies against mechanical shock, temperature and moisture / / E-H Wong, Y.-W Mai
| Robust design of microelectronics assemblies against mechanical shock, temperature and moisture / / E-H Wong, Y.-W Mai |
| Autore | Wong E- H. |
| Pubbl/distr/stampa | Boston, MA : , : Elsevier, , [2015] |
| Descrizione fisica | 1 online resource (477 p.) |
| Disciplina | 621.381046 |
| Collana | Woodhead Publishing series in electronic and optical materials |
| Soggetto topico |
Microelectronics - Design
Industrial design Robust control |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Related titles; Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and MoistureWoodhead Publishing Series i ...; Copyright; Contents; Woodhead Publishing Series in Electronic and Optical Materials; Foreword; Preface; 1 - Introduction; 1.1 Introduction to microelectronic packaging; 1.2 Introduction to robust design; 1.3 Organisation of the book; References; Part 1 - Advances in robust design against temperature-induced failures; 2 - Robust design of microelectronic assemblies against mismatched thermal expansion; 2.1 Introduction; 2.2 Fundamentals
2.3 Comprehensive analysis of a bilayer structure2.4 Microelectronic assembly as a sandwich structure with a continuous bonding layer; 2.5 PCB assembly as a sandwich structure with a layer of solder joints; References; 2. Appendix: prior published works in thermoelasticity; 2. Nomenclature; 2. Mathematical symbols; 3 - Advances in creep-fatigue modelling of solder joints; 3.1 Introduction; 3.2 Life-prediction models for creep-fatigue; 3.3 The unified equation; 3.4 Self-validations and benchmarking; 3.5 Applications; References Part 2 - Advances in robust design against moisture-induced failures4 - Moisture properties and their characterisations; 4.1 Introduction; 4.2 Thermodynamics of water; 4.3 Sorption and its characterisation; 4.4 Diffusivity and its characterisation; 4.5 Hygroscopic swelling and its characterisation; References; 5 - Advances in diffusion and vapour pressure modelling; 5.1 The discontinuity of concentration; 5.2 The fractional saturation; 5.3 Diffusion under time-varying temperature and pressure; 5.4 Advances in vapour pressure modelling; References; Part 3 - Robust design against drop impact 6 - The physics of failure of portable electronic devices in drop impact6.1 Product drop testing; 6.2 The physics of failure; References; 7 - Subsystem testing of solder joints against drop impact; 7.1 Board-level testing; 7.2 Component-level testing; References; 8 - Fatigue resistance of solder joints: strain-life representation; 8.1 Introduction; 8.2 Design of test specimens; 8.3 Fatigue resistance equations: materials; 8.4 Fatigue resistance equations: frequency; 8.5 Fatigue resistance equations: environment; References; 9 - Fatigue crack growth in solder joints at high strain rate 9.1 Introduction9.2 Establishment of continuous crack growth tracking capability; 9.3 Crack propagation characteristics: board-level drop shock test; 9.4 Crack propagation characteristics: high-speed cyclic bending test; 9.5 Three-dimensional fracture mechanics modelling of the crack front; 9.6 Crack propagation in the solder joints of a mobile phone experiencing drop impact; References; 10 - Dynamic deformation of a printed circuit board in drop-shock; 10.1 Introduction; 10.2 Vibration of a test board in the JESD22-B111 drop-shock test 10.3 Analytical solutions for a spring-mass system subjected to half-sine shock |
| Record Nr. | UNINA-9910824188203321 |
|
Wong E- H.
|
||
| Boston, MA : , : Elsevier, , [2015] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Third IEEE International Workshop on Electronic Design, Test, and Applications : proceedings, 17-19 January 2006, Kuala Lumpur, Malaysia
| Third IEEE International Workshop on Electronic Design, Test, and Applications : proceedings, 17-19 January 2006, Kuala Lumpur, Malaysia |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE Computer Society, 2006 |
| Disciplina | 621.381 |
| Soggetto topico |
Integrated circuits - Testing
Integrated circuits - Design and construction Microelectronics - Design Microelectronics - Testing Electrical & Computer Engineering Electrical Engineering Engineering & Applied Sciences |
| ISBN | 1-5090-9447-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996218384203316 |
| [Place of publication not identified], : IEEE Computer Society, 2006 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
Third IEEE International Workshop on Electronic Design, Test, and Applications : proceedings, 17-19 January 2006, Kuala Lumpur, Malaysia
| Third IEEE International Workshop on Electronic Design, Test, and Applications : proceedings, 17-19 January 2006, Kuala Lumpur, Malaysia |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE Computer Society, 2006 |
| Disciplina | 621.381 |
| Soggetto topico |
Integrated circuits - Testing
Integrated circuits - Design and construction Microelectronics - Design Microelectronics - Testing Electrical & Computer Engineering Electrical Engineering Engineering & Applied Sciences |
| ISBN |
9781509094479
1509094474 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910145454703321 |
| [Place of publication not identified], : IEEE Computer Society, 2006 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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