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Lead-free solder interconnect reliability [[electronic resource] /] / edited by Dongkai Shangguan
| Lead-free solder interconnect reliability [[electronic resource] /] / edited by Dongkai Shangguan |
| Pubbl/distr/stampa | Materials Park, OH, : ASM International, 2005 |
| Descrizione fisica | 1 online resource (302 p.) |
| Disciplina | 621.381/046 |
| Altri autori (Persone) | ShangguanDongkai <1963-> |
| Soggetto topico |
Microelectronic packaging - Reliability
Solder and soldering Lead-free electronics manufacturing processes |
| Soggetto genere / forma | Electronic books. |
| ISBN | 1-61503-093-X |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
""Contents""; ""Foreword""; ""Preface""; ""Lead-Free Soldering and Environmental Compliance: An Overview""; ""Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects""; ""Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties""; ""Lead-Free Solder Joint Reliability Trends""; ""Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects""; ""Tin Whisker Growth on Lead-Free Solder Finishes""; ""Accelerated Testing Methodology for Lead-Free Solder Interconnects""
""Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects""""Design for Reliability Finite Element Modeling of Lead-Free Solder Interconnects""; ""Characterization and Failure Analyses of Lead-Free Solder Defects""; ""Reliability of Interconnects with Conductive Adhesives""; ""Lead-Free Solder Interconnect Reliability Outlook""; ""Index"" |
| Record Nr. | UNINA-9910458703703321 |
| Materials Park, OH, : ASM International, 2005 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Lead-free solder interconnect reliability [[electronic resource] /] / edited by Dongkai Shangguan
| Lead-free solder interconnect reliability [[electronic resource] /] / edited by Dongkai Shangguan |
| Pubbl/distr/stampa | Materials Park, OH, : ASM International, 2005 |
| Descrizione fisica | 1 online resource (302 p.) |
| Disciplina | 621.381/046 |
| Altri autori (Persone) | ShangguanDongkai <1963-> |
| Soggetto topico |
Microelectronic packaging - Reliability
Solder and soldering Lead-free electronics manufacturing processes |
| ISBN | 1-61503-093-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
""Contents""; ""Foreword""; ""Preface""; ""Lead-Free Soldering and Environmental Compliance: An Overview""; ""Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects""; ""Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties""; ""Lead-Free Solder Joint Reliability Trends""; ""Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects""; ""Tin Whisker Growth on Lead-Free Solder Finishes""; ""Accelerated Testing Methodology for Lead-Free Solder Interconnects""
""Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects""""Design for Reliability Finite Element Modeling of Lead-Free Solder Interconnects""; ""Characterization and Failure Analyses of Lead-Free Solder Defects""; ""Reliability of Interconnects with Conductive Adhesives""; ""Lead-Free Solder Interconnect Reliability Outlook""; ""Index"" |
| Record Nr. | UNINA-9910791454203321 |
| Materials Park, OH, : ASM International, 2005 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Lead-free solder interconnect reliability / / edited by Dongkai Shangguan
| Lead-free solder interconnect reliability / / edited by Dongkai Shangguan |
| Edizione | [1st ed.] |
| Pubbl/distr/stampa | Materials Park, OH, : ASM International, 2005 |
| Descrizione fisica | 1 online resource (302 p.) |
| Disciplina | 621.381/046 |
| Altri autori (Persone) | ShangguanDongkai <1963-> |
| Soggetto topico |
Microelectronic packaging - Reliability
Solder and soldering Lead-free electronics manufacturing processes |
| ISBN | 1-61503-093-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
""Contents""; ""Foreword""; ""Preface""; ""Lead-Free Soldering and Environmental Compliance: An Overview""; ""Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects""; ""Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties""; ""Lead-Free Solder Joint Reliability Trends""; ""Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects""; ""Tin Whisker Growth on Lead-Free Solder Finishes""; ""Accelerated Testing Methodology for Lead-Free Solder Interconnects""
""Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects""""Design for Reliability Finite Element Modeling of Lead-Free Solder Interconnects""; ""Characterization and Failure Analyses of Lead-Free Solder Defects""; ""Reliability of Interconnects with Conductive Adhesives""; ""Lead-Free Solder Interconnect Reliability Outlook""; ""Index"" |
| Record Nr. | UNINA-9910809229003321 |
| Materials Park, OH, : ASM International, 2005 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
