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2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 12-15, September, 2004, Portland, OR
| 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 12-15, September, 2004, Portland, OR |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2004 |
| Disciplina | 621.381/046 |
| Soggetto topico |
Microelectronic packaging - Materials
Polymers - Reliability Integrated circuits - Materials Photonics Polymeric composites Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996204495903316 |
| [Place of publication not identified], : IEEE, 2004 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 12-15, September, 2004, Portland, OR
| 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 12-15, September, 2004, Portland, OR |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2004 |
| Disciplina | 621.381/046 |
| Soggetto topico |
Microelectronic packaging - Materials
Polymers - Reliability Integrated circuits - Materials Photonics Polymeric composites Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910872499003321 |
| [Place of publication not identified], : IEEE, 2004 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Adhesion in microelectronics / / edited by K. L. Mittal and Tanweer Ahsan
| Adhesion in microelectronics / / edited by K. L. Mittal and Tanweer Ahsan |
| Pubbl/distr/stampa | Hoboken, New Jersey ; ; Salem, Massachusetts : , : Scrivener Publishing : , : Wiley, , 2014 |
| Descrizione fisica | 1 online resource (367 p.) |
| Disciplina | 621.381/046 |
| Collana | Adhesion and Adhesives: Fundamental and Applied Aspects |
| Soggetto topico |
Microelectronic packaging - Materials
Adhesives Adhesive joints |
| ISBN |
1-118-83134-9
1-118-83137-3 1-118-83135-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Cover; Title Page; Copyright Page; Contents; Preface; Acknowledgements; Part 1: Adhesion: Fundamentals and Measurement; 1 Study of Molecular Bonding or Adhesion by Inelastic Electron Tunneling Spectroscopy, with Special Reference to Microelectronics; 1.1 Introduction; 1.2 Principles of IETS; 1.2.1 General Overview; 1.2.2 Key Principles of Operation; 1.2.3 IET Spectrometer Design and Implementation; 1.2.4 IET Sample Preparation; 1.3 Application of IETS in Microelectronics; 1.4 Prospects; 1.5 Summary; References; 2 Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics
2.1. Introduction2.2 Mechanical Methods; 2.2.1 Commonly Used Qualitative or Semi-quantitative Methods; 2.2.2 Quantitative Methods; 2.3 Laser Based Techniques; 2.3.1 Laser Induced Delamination (LID); 2.3.2 Laser Direct Ablation Induced De-adhesion; 2.3.3 Laser Spallation Technique; 2.4 Summary and Remarks; References; Part 2: Ways to Promote/Enhance Adhesion; 3 Tailoring of Interface/Interphase to Promote Metal-Polymer Adhesion; 3.1 Introduction; 3.1.1 Role of Surface Energy for Metal-Polymer Adhesion; 3.1.2 Physical Effects Produced by Covalent Bonding of Metal to Polymer 3.1.3 Thermal Expansion Coefficients of Metals and Polymers3.1.4 Differences Between Al-Polyolefin and Polyolefin-Al Laminates; 3.1.5 Types of Covalent Metal-Polymer Bonds; 3.1.6 Redox Reactions across the Metal-Polymer Interface; 3.1.7 Reactions of Transition Metals with Aromatic Polymers; 3.1.8 Loss in Anisotropic Orientation of Polymers Caused by Pretreatment or by Contact with Metals; 3.1.9 Combination of Plasma Pretreatment and Metal Deposition; 3.1.10 Thermodynamics; 3.2 New Concepts for Ideal Design of Metal-Polymer Interfaces with Covalently Bonded Flexible Spacer Molecules 3.2.1 Principal Functions of Spacers3.2.2 Ways to Graft Spacer Molecules onto Polyolefin Surfaces; 3.2.3 Grafting of Spacer Molecules onto Monotype Functional Groups at the Polyolefin Surface for Realizing New Interface Design in Metal-Polymer Systems; 3.3 Situation at Al Oxide/Hydroxide Surfaces Using Aluminium as Substrate; 3.4. Adhesion Promotion by Non-specific Functionalization of Polyolefin Surfaces; 3.4.1 General; 3.4.2 Introduction of Functional Groups onto Polyolefin Surfaces; 3.4.3 Usual Pretreatment Processes and Their Advantages and Disadvantages 3.4.4 Use of Adhesion Promoting Layers Deposited by Plasma Polymerization3.4.5 Use of Silanes and Siloxanes; 3.4.6 Other Methods; 3.5 Methods for Producing Monosort Functional Groups at Polyolefin Surfaces; 3.5.1 Oxygen Plasma and Wet-chemical Reduction of O-functional Groups to OH Groups; 3.5.2 Underwater Capillary Discharge Plasma or Glow Discharge Electrolysis (GDE); 3.5.3 Electrospray-Ionization Deposition of Ultra-thin Polymer Layers; 3.5.4 Allylamine Plasma Polymerization for Producing NH2 Groups; 3.5.5 Allyl Alcohol Plasma Polymerization for Producing OH Groups 3.5.6 Acrylic Acid Plasma Polymerization for Producing COOH Groups |
| Record Nr. | UNINA-9910132344303321 |
| Hoboken, New Jersey ; ; Salem, Massachusetts : , : Scrivener Publishing : , : Wiley, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Adhesion in microelectronics / / edited by K. L. Mittal and Tanweer Ahsan
| Adhesion in microelectronics / / edited by K. L. Mittal and Tanweer Ahsan |
| Pubbl/distr/stampa | Hoboken, New Jersey ; ; Salem, Massachusetts : , : Scrivener Publishing : , : Wiley, , 2014 |
| Descrizione fisica | 1 online resource (367 p.) |
| Disciplina | 621.381/046 |
| Collana | Adhesion and Adhesives: Fundamental and Applied Aspects |
| Soggetto topico |
Microelectronic packaging - Materials
Adhesives Adhesive joints |
| ISBN |
1-118-83134-9
1-118-83137-3 1-118-83135-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Cover; Title Page; Copyright Page; Contents; Preface; Acknowledgements; Part 1: Adhesion: Fundamentals and Measurement; 1 Study of Molecular Bonding or Adhesion by Inelastic Electron Tunneling Spectroscopy, with Special Reference to Microelectronics; 1.1 Introduction; 1.2 Principles of IETS; 1.2.1 General Overview; 1.2.2 Key Principles of Operation; 1.2.3 IET Spectrometer Design and Implementation; 1.2.4 IET Sample Preparation; 1.3 Application of IETS in Microelectronics; 1.4 Prospects; 1.5 Summary; References; 2 Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics
2.1. Introduction2.2 Mechanical Methods; 2.2.1 Commonly Used Qualitative or Semi-quantitative Methods; 2.2.2 Quantitative Methods; 2.3 Laser Based Techniques; 2.3.1 Laser Induced Delamination (LID); 2.3.2 Laser Direct Ablation Induced De-adhesion; 2.3.3 Laser Spallation Technique; 2.4 Summary and Remarks; References; Part 2: Ways to Promote/Enhance Adhesion; 3 Tailoring of Interface/Interphase to Promote Metal-Polymer Adhesion; 3.1 Introduction; 3.1.1 Role of Surface Energy for Metal-Polymer Adhesion; 3.1.2 Physical Effects Produced by Covalent Bonding of Metal to Polymer 3.1.3 Thermal Expansion Coefficients of Metals and Polymers3.1.4 Differences Between Al-Polyolefin and Polyolefin-Al Laminates; 3.1.5 Types of Covalent Metal-Polymer Bonds; 3.1.6 Redox Reactions across the Metal-Polymer Interface; 3.1.7 Reactions of Transition Metals with Aromatic Polymers; 3.1.8 Loss in Anisotropic Orientation of Polymers Caused by Pretreatment or by Contact with Metals; 3.1.9 Combination of Plasma Pretreatment and Metal Deposition; 3.1.10 Thermodynamics; 3.2 New Concepts for Ideal Design of Metal-Polymer Interfaces with Covalently Bonded Flexible Spacer Molecules 3.2.1 Principal Functions of Spacers3.2.2 Ways to Graft Spacer Molecules onto Polyolefin Surfaces; 3.2.3 Grafting of Spacer Molecules onto Monotype Functional Groups at the Polyolefin Surface for Realizing New Interface Design in Metal-Polymer Systems; 3.3 Situation at Al Oxide/Hydroxide Surfaces Using Aluminium as Substrate; 3.4. Adhesion Promotion by Non-specific Functionalization of Polyolefin Surfaces; 3.4.1 General; 3.4.2 Introduction of Functional Groups onto Polyolefin Surfaces; 3.4.3 Usual Pretreatment Processes and Their Advantages and Disadvantages 3.4.4 Use of Adhesion Promoting Layers Deposited by Plasma Polymerization3.4.5 Use of Silanes and Siloxanes; 3.4.6 Other Methods; 3.5 Methods for Producing Monosort Functional Groups at Polyolefin Surfaces; 3.5.1 Oxygen Plasma and Wet-chemical Reduction of O-functional Groups to OH Groups; 3.5.2 Underwater Capillary Discharge Plasma or Glow Discharge Electrolysis (GDE); 3.5.3 Electrospray-Ionization Deposition of Ultra-thin Polymer Layers; 3.5.4 Allylamine Plasma Polymerization for Producing NH2 Groups; 3.5.5 Allyl Alcohol Plasma Polymerization for Producing OH Groups 3.5.6 Acrylic Acid Plasma Polymerization for Producing COOH Groups |
| Record Nr. | UNINA-9910819143603321 |
| Hoboken, New Jersey ; ; Salem, Massachusetts : , : Scrivener Publishing : , : Wiley, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
LCP for microwave packages and modules / / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara [[electronic resource]]
| LCP for microwave packages and modules / / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara [[electronic resource]] |
| Pubbl/distr/stampa | Cambridge : , : Cambridge University Press, , 2012 |
| Descrizione fisica | 1 online resource (xiv, 253 pages) : digital, PDF file(s) |
| Disciplina | 621.381/3 |
| Collana | The Cambridge RF and microwave engineering series |
| Soggetto topico |
Microwave devices - Materials
Flexible electronics Microelectronic packaging - Materials Liquid crystal devices Polymer liquid crystals |
| ISBN |
1-107-22699-6
1-139-41127-6 1-280-77372-3 9786613684493 1-139-42263-4 0-511-77724-8 1-139-41961-7 1-139-41756-8 1-139-42166-2 1-139-42370-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Machine generated contents note: 1. Introduction; 2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham; 3. Fabrication techniques for processing LCP laminates; 4. LCP for wafer level chip scale MEMS; 5. LCP for surface mount interconnects, packages, and modules; 6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 8. LCP reliability. |
| Altri titoli varianti | LCP for Microwave Packages & Modules |
| Record Nr. | UNINA-9910462435303321 |
| Cambridge : , : Cambridge University Press, , 2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
LCP for microwave packages and modules / / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara [[electronic resource]]
| LCP for microwave packages and modules / / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara [[electronic resource]] |
| Pubbl/distr/stampa | Cambridge : , : Cambridge University Press, , 2012 |
| Descrizione fisica | 1 online resource (xiv, 253 pages) : digital, PDF file(s) |
| Disciplina | 621.381/3 |
| Collana | The Cambridge RF and microwave engineering series |
| Soggetto topico |
Microwave devices - Materials
Flexible electronics Microelectronic packaging - Materials Liquid crystal devices Polymer liquid crystals |
| ISBN |
1-107-22699-6
1-139-41127-6 1-280-77372-3 9786613684493 1-139-42263-4 0-511-77724-8 1-139-41961-7 1-139-41756-8 1-139-42166-2 1-139-42370-3 |
| Classificazione | TEC024000 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Machine generated contents note: 1. Introduction; 2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham; 3. Fabrication techniques for processing LCP laminates; 4. LCP for wafer level chip scale MEMS; 5. LCP for surface mount interconnects, packages, and modules; 6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 8. LCP reliability. |
| Altri titoli varianti | LCP for Microwave Packages & Modules |
| Record Nr. | UNINA-9910790345703321 |
| Cambridge : , : Cambridge University Press, , 2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
LCP for microwave packages and modules / / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara [[electronic resource]]
| LCP for microwave packages and modules / / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara [[electronic resource]] |
| Pubbl/distr/stampa | Cambridge : , : Cambridge University Press, , 2012 |
| Descrizione fisica | 1 online resource (xiv, 253 pages) : digital, PDF file(s) |
| Disciplina | 621.381/3 |
| Collana | The Cambridge RF and microwave engineering series |
| Soggetto topico |
Microwave devices - Materials
Flexible electronics Microelectronic packaging - Materials Liquid crystal devices Polymer liquid crystals |
| ISBN |
1-107-22699-6
1-139-41127-6 1-280-77372-3 9786613684493 1-139-42263-4 0-511-77724-8 1-139-41961-7 1-139-41756-8 1-139-42166-2 1-139-42370-3 |
| Classificazione | TEC024000 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Machine generated contents note: 1. Introduction; 2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham; 3. Fabrication techniques for processing LCP laminates; 4. LCP for wafer level chip scale MEMS; 5. LCP for surface mount interconnects, packages, and modules; 6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 8. LCP reliability. |
| Altri titoli varianti | LCP for Microwave Packages & Modules |
| Record Nr. | UNINA-9910820646203321 |
| Cambridge : , : Cambridge University Press, , 2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Polytronic 2005 : 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics : October 23-24, 2005, Hotel Mercure Panorama, Wrocław, Poland : proceedings
| Polytronic 2005 : 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics : October 23-24, 2005, Hotel Mercure Panorama, Wrocław, Poland : proceedings |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2006 |
| Disciplina | 621.381046 |
| Soggetto topico |
Microelectronic packaging - Materials
Polymers - Reliability Integrated circuits - Materials Photonics Polymeric composites Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| ISBN | 1-5090-9952-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996207502403316 |
| [Place of publication not identified], : IEEE, 2006 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
Polytronic 2005 : 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics : October 23-24, 2005, Hotel Mercure Panorama, Wrocław, Poland : proceedings
| Polytronic 2005 : 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics : October 23-24, 2005, Hotel Mercure Panorama, Wrocław, Poland : proceedings |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2006 |
| Disciplina | 621.381046 |
| Soggetto topico |
Microelectronic packaging - Materials
Polymers - Reliability Integrated circuits - Materials Photonics Polymeric composites Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| ISBN | 1-5090-9952-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910145606003321 |
| [Place of publication not identified], : IEEE, 2006 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Polytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics : Odaiba, Tokyo, Japan, January 15-18, 2007 s / / IEEE Components, Packaging and Manufacturing Technology Society
| Polytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics : Odaiba, Tokyo, Japan, January 15-18, 2007 s / / IEEE Components, Packaging and Manufacturing Technology Society |
| Pubbl/distr/stampa | IEEE |
| Soggetto topico |
Microelectronic packaging - Materials
Polymers Integrated circuits - Reliability Photonics - Materials Polymeric composites |
| ISBN | 1-5090-8992-6 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti |
Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics
Electronics Communications and Computers |
| Record Nr. | UNISA-996281139003316 |
| IEEE | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
