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1998 International Conference on Multichip Modules and High Density Packaging
| 1998 International Conference on Multichip Modules and High Density Packaging |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 1998 |
| Disciplina | 621.381/046 |
| Soggetto topico |
Multichip modules (Microelectronics) - Congresses
Microelectronic packaging Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910872663403321 |
| [Place of publication not identified], : IEEE, 1998 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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1st 1997 IEMT/IMC Symposium : April 16-18, 1997, Sonic City-Omiya, Tokyo, Japan
| 1st 1997 IEMT/IMC Symposium : April 16-18, 1997, Sonic City-Omiya, Tokyo, Japan |
| Pubbl/distr/stampa | New York : , : IEEE, , 2002 |
| Descrizione fisica | 1 online resource (xvi, 415 pages) |
| Soggetto topico |
Microelectronic packaging
Electronic apparatus and appliances - Design and construction |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996212472203316 |
| New York : , : IEEE, , 2002 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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2000 IEEE International Conference on Semiconductor Electronics Proceedings
| 2000 IEEE International Conference on Semiconductor Electronics Proceedings |
| Pubbl/distr/stampa | [Place of publication not identified], : I E E E, 2000 |
| Altri autori (Persone) |
ShaariSahbudin
MajlisBurhanuddin Yeop |
| Soggetto topico |
Semiconductors
Semiconductors - Failures Microelectronic packaging |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996199308603316 |
| [Place of publication not identified], : I E E E, 2000 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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2000 IEEE International Conference on Semiconductor Electronics Proceedings
| 2000 IEEE International Conference on Semiconductor Electronics Proceedings |
| Pubbl/distr/stampa | [Place of publication not identified], : I E E E, 2000 |
| Altri autori (Persone) |
ShaariSahbudin
MajlisBurhanuddin Yeop |
| Soggetto topico |
Semiconductors
Semiconductors - Failures Microelectronic packaging |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910872941203321 |
| [Place of publication not identified], : I E E E, 2000 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP) : 10th International Conference on Electronic Materials & Packaging (EMAP) : 22-24 October 2008, Taipei / / compiled by Institute of Electrical and Electronics Engineers
| 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP) : 10th International Conference on Electronic Materials & Packaging (EMAP) : 22-24 October 2008, Taipei / / compiled by Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2008 |
| Descrizione fisica | 1 online resource (423 pages) |
| Disciplina | 621.381046 |
| Soggetto topico |
Microelectronic packaging
Microelectromechanical systems |
| ISBN |
1-5090-8060-0
1-4244-3624-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910145427103321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2008 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP) : 10th International Conference on Electronic Materials & Packaging (EMAP) : 22-24 October 2008, Taipei / / compiled by Institute of Electrical and Electronics Engineers
| 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP) : 10th International Conference on Electronic Materials & Packaging (EMAP) : 22-24 October 2008, Taipei / / compiled by Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2008 |
| Descrizione fisica | 1 online resource (423 pages) |
| Disciplina | 621.381046 |
| Soggetto topico |
Microelectronic packaging
Microelectromechanical systems |
| ISBN |
1-5090-8060-0
1-4244-3624-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996213965703316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2008 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS : 9-11 April 2008
| 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS : 9-11 April 2008 |
| Pubbl/distr/stampa | New York : , : IEEE, , 2009 |
| Descrizione fisica | 1 online resource (392 pages) |
| Soggetto topico |
Microelectronic packaging
Microelectromechanical systems Micromachining |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996203024203316 |
| New York : , : IEEE, , 2009 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
| 2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2012 |
| Descrizione fisica | 1 online resource |
| Disciplina | 621.381 |
| Soggetto topico |
Microelectronic packaging
Optoelectronic devices Microelectromechanical systems |
| ISBN | 2-35500-021-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996213592503316 |
| [Place of publication not identified], : IEEE, 2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
| 2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2012 |
| Descrizione fisica | 1 online resource |
| Disciplina | 621.381 |
| Soggetto topico |
Microelectronic packaging
Optoelectronic devices Microelectromechanical systems |
| ISBN |
9782355000218
2355000212 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910130706403321 |
| [Place of publication not identified], : IEEE, 2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) : 1-4 April 2014 : Cannes, France / / IEEE
| 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) : 1-4 April 2014 : Cannes, France / / IEEE |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2014 |
| Descrizione fisica | 1 online resource (376 pages) |
| Disciplina | 621.381045 |
| Soggetto topico |
Optoelectronic devices
Microelectronic packaging |
| ISBN | 2-35500-027-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996280900003316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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