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A brief test of the Hewlett-Packard MEMS seismic accelerometer / / by Brian D. Homeijer, Donald J. Milligan, and Charles R. Hutt
| A brief test of the Hewlett-Packard MEMS seismic accelerometer / / by Brian D. Homeijer, Donald J. Milligan, and Charles R. Hutt |
| Autore | Scharer Katherine M. |
| Pubbl/distr/stampa | Reston, Virginia : , : U.S. Department of the Interior, U.S. Geological Survey, , 2014 |
| Descrizione fisica | 1 online resource (iv, 18 pages) : illustration (chiefly color) |
| Collana | Open-file report |
| Soggetto topico |
Microelectromechanical systems - Testing
Microtechnology - Testing Accelerometers - Testing Seismometers - Testing |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | Brief test of the Hewlett-Packard Micro-ElectroMechanical Systems seismic accelerometer |
| Record Nr. | UNINA-9910711927503321 |
Scharer Katherine M.
|
||
| Reston, Virginia : , : U.S. Department of the Interior, U.S. Geological Survey, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Hermeticity testing of MEMS and microelectronic packages / / Suzanne Costello, Marc P.Y. Desmulliez
| Hermeticity testing of MEMS and microelectronic packages / / Suzanne Costello, Marc P.Y. Desmulliez |
| Autore | Costello Suzanne |
| Pubbl/distr/stampa | Boston : , : Artech House, , [2013] |
| Descrizione fisica | 1 online resource (197 p.) |
| Disciplina | 621.381 |
| Collana | Integrated microsystems series |
| Soggetto topico |
Microelectromechanical systems
Microelectronics Microelectromechanical systems - Testing Microelectronics - Testing |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-5231-1728-1
1-60807-527-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Preface; References; Part 1 Introduction to Hermetic Package; 1 The Evolution of Packages, Their Sealing Methods, and Modes of Fabrication ; 1.1 Introduction; 1.2 The Evolution of Microelectronics and MEMS Packages; 1.3 MEMS Sealing Techniques and Mode Package Fabrication; 1.3.1 Materials; 1.3.2 Sealing Techniques; 1.4 Summary of MEMS Packaging Materials and Techniques; References; 2 Assembly, Packaging, and Environmentally Induced Failures in MEMS; 2.1 Introduction; 2.2 Particle Contamination ; 2.3 Thermomechanical Constraints; 2.3.1 Thermomechanical Constraints in Di.
2.3.2 Thermomechanical Constraints in Pa2.3.3 Thermomechanical Constraints in Wa; 2.3.4 Thermomechanical Constraints in Fl; 2.4 Moisture and Gas Absorption; 2.4.1 Moisture Absorption; 2.4.2 Barrier Coatings: A Protection Aga; 2.4.3 Outgassing; 2.5 Conclusions: Reliability Demonstration and Accelerated Testing; References; 3 Packaging Requirements for Hermeticity; 3.1 The Need for Hermeticity in MEMS and; 3.2 Balancing Maximum Permissive Leak Ra; References; 4 The Different Types of Leaks in MEMS and Microelectronics Packaging; 4.1 Introduction; 4.2 Leak Channels or Capillary Leaks. 4.3 Permeation4.4 Outgassing; 4.5 Conclusion; References; Part 2 Traditional Hermeticity Test Techniques and Standards; 5 Ex Situ Hermeticity Test Methods; 5.1 Introduction; 5.2 Fine Leak Tests; 5.2.1 Helium Fine Leak Test; 5.2.2 Radioisotope Leak Detection Method; 5.3 Gross Leak Tests; 5.3.1 Fluorocarbon Liquid and Vapor Gross Leak Detection; 5.3.2 Gross Bubble Test; 5.3.3 Weight Gain; 5.3.4 Dye Penetrant Gross Leak Test; 5.4 Combinational Tests; 5.4.1 Optical Fine/Gross Leak Detection ; 5.4.2 Cumulative Helium Leak Detection (CHLD) Method; References. 6 The History of Hermeticity Standards MIL-STD-883 T.M. 1014 and MIL-STD-750 T.M. 10716.1 Introduction: The First Hermeticity Tests; 6.2 The Introduction of the Military Standards; 6.3 The First Problems with Traditional Hermeticity Tests and Standards; 6.4 Military Standard Revisions; 6.5 Summary; References; Part 3 Limitations of Existing Hermeticity Test Methods in Low Volume Packages; 7 Permeation; 7.1 Introduction; 7.2 Mathematics of Permeation; 7.3 Limitations of the Packaging Material; 7.4 Conclusions; References; 8 Outgassing and Residual Gas Analysis (RGA); 8.1 Outgassing. 8.2 Residual Gas AnalysisReferences; 9 Low-Cavity Volume Capillary Leak Limitatations; 9.1 Limitations of the Helium Fine Leak Test Method; 9.1.1 Volume Limitations; 9.1.2 Minimum Detectable Leak Rate; References; Part 4 Novel Methods of Leak Detection; 10 Q-Factor Monitoring of Resonant Microstructures as a Hermeticity Measurement Method; 10.1 Introduction; 10.2 Lumped Element Modeling of a Microresonator; 10.3 Definitions and Measurement Methods of the Quality Factor Q; 10.3.1 Definition in Terms of Stored Energy; 10.3.2 Definition in Terms of Bandwidth. |
| Record Nr. | UNINA-9910465182903321 |
|
Costello Suzanne
|
||
| Boston : , : Artech House, , [2013] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Hermeticity testing of MEMS and microelectronic packages / / Suzanne Costello, Marc P.Y. Desmulliez
| Hermeticity testing of MEMS and microelectronic packages / / Suzanne Costello, Marc P.Y. Desmulliez |
| Autore | Costello Suzanne |
| Pubbl/distr/stampa | Boston : , : Artech House, , [2013] |
| Descrizione fisica | 1 online resource (197 p.) |
| Disciplina | 621.381 |
| Collana | Integrated microsystems series |
| Soggetto topico |
Microelectromechanical systems
Microelectronics Microelectromechanical systems - Testing Microelectronics - Testing |
| ISBN |
1-5231-1728-1
1-60807-527-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Preface; References; Part 1 Introduction to Hermetic Package; 1 The Evolution of Packages, Their Sealing Methods, and Modes of Fabrication ; 1.1 Introduction; 1.2 The Evolution of Microelectronics and MEMS Packages; 1.3 MEMS Sealing Techniques and Mode Package Fabrication; 1.3.1 Materials; 1.3.2 Sealing Techniques; 1.4 Summary of MEMS Packaging Materials and Techniques; References; 2 Assembly, Packaging, and Environmentally Induced Failures in MEMS; 2.1 Introduction; 2.2 Particle Contamination ; 2.3 Thermomechanical Constraints; 2.3.1 Thermomechanical Constraints in Di.
2.3.2 Thermomechanical Constraints in Pa2.3.3 Thermomechanical Constraints in Wa; 2.3.4 Thermomechanical Constraints in Fl; 2.4 Moisture and Gas Absorption; 2.4.1 Moisture Absorption; 2.4.2 Barrier Coatings: A Protection Aga; 2.4.3 Outgassing; 2.5 Conclusions: Reliability Demonstration and Accelerated Testing; References; 3 Packaging Requirements for Hermeticity; 3.1 The Need for Hermeticity in MEMS and; 3.2 Balancing Maximum Permissive Leak Ra; References; 4 The Different Types of Leaks in MEMS and Microelectronics Packaging; 4.1 Introduction; 4.2 Leak Channels or Capillary Leaks. 4.3 Permeation4.4 Outgassing; 4.5 Conclusion; References; Part 2 Traditional Hermeticity Test Techniques and Standards; 5 Ex Situ Hermeticity Test Methods; 5.1 Introduction; 5.2 Fine Leak Tests; 5.2.1 Helium Fine Leak Test; 5.2.2 Radioisotope Leak Detection Method; 5.3 Gross Leak Tests; 5.3.1 Fluorocarbon Liquid and Vapor Gross Leak Detection; 5.3.2 Gross Bubble Test; 5.3.3 Weight Gain; 5.3.4 Dye Penetrant Gross Leak Test; 5.4 Combinational Tests; 5.4.1 Optical Fine/Gross Leak Detection ; 5.4.2 Cumulative Helium Leak Detection (CHLD) Method; References. 6 The History of Hermeticity Standards MIL-STD-883 T.M. 1014 and MIL-STD-750 T.M. 10716.1 Introduction: The First Hermeticity Tests; 6.2 The Introduction of the Military Standards; 6.3 The First Problems with Traditional Hermeticity Tests and Standards; 6.4 Military Standard Revisions; 6.5 Summary; References; Part 3 Limitations of Existing Hermeticity Test Methods in Low Volume Packages; 7 Permeation; 7.1 Introduction; 7.2 Mathematics of Permeation; 7.3 Limitations of the Packaging Material; 7.4 Conclusions; References; 8 Outgassing and Residual Gas Analysis (RGA); 8.1 Outgassing. 8.2 Residual Gas AnalysisReferences; 9 Low-Cavity Volume Capillary Leak Limitatations; 9.1 Limitations of the Helium Fine Leak Test Method; 9.1.1 Volume Limitations; 9.1.2 Minimum Detectable Leak Rate; References; Part 4 Novel Methods of Leak Detection; 10 Q-Factor Monitoring of Resonant Microstructures as a Hermeticity Measurement Method; 10.1 Introduction; 10.2 Lumped Element Modeling of a Microresonator; 10.3 Definitions and Measurement Methods of the Quality Factor Q; 10.3.1 Definition in Terms of Stored Energy; 10.3.2 Definition in Terms of Bandwidth. |
| Record Nr. | UNINA-9910792136503321 |
|
Costello Suzanne
|
||
| Boston : , : Artech House, , [2013] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Hermeticity testing of MEMS and microelectronic packages / / Suzanne Costello, Marc P.Y. Desmulliez
| Hermeticity testing of MEMS and microelectronic packages / / Suzanne Costello, Marc P.Y. Desmulliez |
| Autore | Costello Suzanne |
| Pubbl/distr/stampa | Boston : , : Artech House, , [2013] |
| Descrizione fisica | 1 online resource (197 p.) |
| Disciplina | 621.381 |
| Collana | Integrated microsystems series |
| Soggetto topico |
Microelectromechanical systems
Microelectronics Microelectromechanical systems - Testing Microelectronics - Testing |
| ISBN |
1-5231-1728-1
1-60807-527-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Preface; References; Part 1 Introduction to Hermetic Package; 1 The Evolution of Packages, Their Sealing Methods, and Modes of Fabrication ; 1.1 Introduction; 1.2 The Evolution of Microelectronics and MEMS Packages; 1.3 MEMS Sealing Techniques and Mode Package Fabrication; 1.3.1 Materials; 1.3.2 Sealing Techniques; 1.4 Summary of MEMS Packaging Materials and Techniques; References; 2 Assembly, Packaging, and Environmentally Induced Failures in MEMS; 2.1 Introduction; 2.2 Particle Contamination ; 2.3 Thermomechanical Constraints; 2.3.1 Thermomechanical Constraints in Di.
2.3.2 Thermomechanical Constraints in Pa2.3.3 Thermomechanical Constraints in Wa; 2.3.4 Thermomechanical Constraints in Fl; 2.4 Moisture and Gas Absorption; 2.4.1 Moisture Absorption; 2.4.2 Barrier Coatings: A Protection Aga; 2.4.3 Outgassing; 2.5 Conclusions: Reliability Demonstration and Accelerated Testing; References; 3 Packaging Requirements for Hermeticity; 3.1 The Need for Hermeticity in MEMS and; 3.2 Balancing Maximum Permissive Leak Ra; References; 4 The Different Types of Leaks in MEMS and Microelectronics Packaging; 4.1 Introduction; 4.2 Leak Channels or Capillary Leaks. 4.3 Permeation4.4 Outgassing; 4.5 Conclusion; References; Part 2 Traditional Hermeticity Test Techniques and Standards; 5 Ex Situ Hermeticity Test Methods; 5.1 Introduction; 5.2 Fine Leak Tests; 5.2.1 Helium Fine Leak Test; 5.2.2 Radioisotope Leak Detection Method; 5.3 Gross Leak Tests; 5.3.1 Fluorocarbon Liquid and Vapor Gross Leak Detection; 5.3.2 Gross Bubble Test; 5.3.3 Weight Gain; 5.3.4 Dye Penetrant Gross Leak Test; 5.4 Combinational Tests; 5.4.1 Optical Fine/Gross Leak Detection ; 5.4.2 Cumulative Helium Leak Detection (CHLD) Method; References. 6 The History of Hermeticity Standards MIL-STD-883 T.M. 1014 and MIL-STD-750 T.M. 10716.1 Introduction: The First Hermeticity Tests; 6.2 The Introduction of the Military Standards; 6.3 The First Problems with Traditional Hermeticity Tests and Standards; 6.4 Military Standard Revisions; 6.5 Summary; References; Part 3 Limitations of Existing Hermeticity Test Methods in Low Volume Packages; 7 Permeation; 7.1 Introduction; 7.2 Mathematics of Permeation; 7.3 Limitations of the Packaging Material; 7.4 Conclusions; References; 8 Outgassing and Residual Gas Analysis (RGA); 8.1 Outgassing. 8.2 Residual Gas AnalysisReferences; 9 Low-Cavity Volume Capillary Leak Limitatations; 9.1 Limitations of the Helium Fine Leak Test Method; 9.1.1 Volume Limitations; 9.1.2 Minimum Detectable Leak Rate; References; Part 4 Novel Methods of Leak Detection; 10 Q-Factor Monitoring of Resonant Microstructures as a Hermeticity Measurement Method; 10.1 Introduction; 10.2 Lumped Element Modeling of a Microresonator; 10.3 Definitions and Measurement Methods of the Quality Factor Q; 10.3.1 Definition in Terms of Stored Energy; 10.3.2 Definition in Terms of Bandwidth. |
| Record Nr. | UNINA-9910820781903321 |
|
Costello Suzanne
|
||
| Boston : , : Artech House, , [2013] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Measurement technology for micro-nanometer devices / / Wendong Zhang [and eight others]
| Measurement technology for micro-nanometer devices / / Wendong Zhang [and eight others] |
| Pubbl/distr/stampa | Singapore : , : Wiley : , : National Defense Industry Press, , 2017 |
| Descrizione fisica | 1 online resource (344 pages) |
| Disciplina | 681/.2 |
| Soggetto topico |
Microtechnology - Measurement
Nanotechnology - Measurement Microelectromechanical systems - Testing Physical measurements |
| Soggetto genere / forma | Electronic books. |
| ISBN | 1-118-71797-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910134877503321 |
| Singapore : , : Wiley : , : National Defense Industry Press, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Measurement technology for micro-nanometer devices / / Wendong Zhang [and eight others]
| Measurement technology for micro-nanometer devices / / Wendong Zhang [and eight others] |
| Pubbl/distr/stampa | Singapore : , : Wiley : , : National Defense Industry Press, , 2017 |
| Descrizione fisica | 1 online resource (344 pages) |
| Disciplina | 681/.2 |
| Soggetto topico |
Microtechnology - Measurement
Nanotechnology - Measurement Microelectromechanical systems - Testing Physical measurements |
| ISBN | 1-118-71797-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910830417603321 |
| Singapore : , : Wiley : , : National Defense Industry Press, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
