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Electroplating of lead free solder for electronics / / Shany Joseph and Girish Phatak
Electroplating of lead free solder for electronics / / Shany Joseph and Girish Phatak
Autore Joseph Shany
Pubbl/distr/stampa Hauppauge, New York : , : Nova Science Publishers, , [2011]
Descrizione fisica 1 online resource (69 pages) : illustrations
Disciplina 621.381
Collana Electrical engineering developments
Soggetto topico Lead-free electronics manufacturing processes
Electroplating
Solder and soldering
ISBN 1-61728-260-X
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto The changing face of soldering in electronics -- Options in solder materials -- Electroplating baths for promising lead-free system.
Record Nr. UNINA-9910148727703321
Joseph Shany  
Hauppauge, New York : , : Nova Science Publishers, , [2011]
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Lead-free electronics : iNEMI projects lead to successful manufacturing / / edited by Edwin Bradley ... [et al.]
Lead-free electronics : iNEMI projects lead to successful manufacturing / / edited by Edwin Bradley ... [et al.]
Pubbl/distr/stampa Hoboken, N. J. : , : Wiley, , c2007
Descrizione fisica 1 online resource (468 p.)
Disciplina 621.381531
Altri autori (Persone) BradleyEdwin
Soggetto topico Lead-free electronics manufacturing processes
Solder and soldering
ISBN 1-281-03248-4
9786611032487
0-470-17147-2
0-470-17146-4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Preface (Ronald W. Gedney) -- Contributors -- Introduction (Jasbir Bath and Carol A. Handwerker) -- Lead-Free Assembly Project -- Alloy Group -- Process Group -- Component Group -- Reliability Group -- Follow-On Projects/Work -- 1. Alloy Selection (Carol A. Handwerker, Ursula Kattner, Kilwon Moon, Jasbir Bath, Edwin Bradley, and Polina Snugovsky) -- 1.1. Introduction -- 1.2. Lead-Free Alloys Considered by iNEMI in 1999 as Replacements for Tin-Lead Eutectic Solder -- 1.3. Fundamental Properties of Lead-Free Solder Alloys Affecting Manufacturing and Reliability -- 1.4. R&D Issues Remaining in Lead-Free Solder Implementation -- 1.5. Summary -- References -- 2. Review and Analysis of Lead-Free Solder Material Properties (Jean-Paul Clech) -- 2.1. Introduction -- 2.2. Tin-Lead Properties and Models -- 2.3. Tin-Silver Properties and Creep Data -- 2.4. Tin-Silver-Copper Properties and Creep Data -- 2.5. Alloy Comparisons -- 2.6. General Conclusions/Recommendations -- Appendix A: Tin-Silver Creep Data -- Appendix B: Tin-Silver-Copper Creep Data -- Acknowledgments -- References -- 3. Lead-Free Solder Paste Technology (Ning-Cheng Lee) -- 3.1. Introduction -- 3.2. Materials -- 3.3. Rheology -- 3.4. Applications -- 3.5. Reflow Soldering -- 3.6. Microstructures of Reflowed Joints -- 3.7. Challenges of Lead-Free Reflow Soldering -- 3.8. Summary -- References -- 4. Impact of Elevated Reflow Temperatures on Component Performance (Richard D. Parker, Jack MCCullen, Nick Lycoudes, and R. J. Arvikar) -- 4.1. Introduction to Component "Lead-Freé Issues -- 4.2. Moisture/Reflow Impact on Packaged Integrated Circuits -- 4.3. Impact of Increased Solder Peak Reflow Temperatures on Moisture Sensitivity Level Ratings -- 4.4. Impact of Increased Solder Peak Reflow Temperatures -- 4.5. Observations on Profiling for the Lead-Free Reflow Processes -- 4.6. IC Package Improvement Options for Better Package MSL at Higher Lead-Free Solder Reflow Temperatures.
4.7. Frequency Control Products -- 4.8. "Lead-Freé Cost Impact on Components -- 4.9. Packaging Identification of Lead-free Packaged ICs -- 4.10. Conclusions -- Acknowledgments -- References -- 5. Lead-Free Assembly Reliability--General (Edwin Bradley) -- 5.1. Introduction -- 5.2. Basic Physical Properties of Solder -- 5.3. Creep Deformation -- 5.4. Thermal Fatigue -- 5.5. Creep Rupture -- 5.6. Isothermal (Mechanical) Fatigue -- 5.7. Out-of-Plane Bending -- 5.8. Impact/Shock Loading -- 5.9. Effect of Rework on Reliability -- 5.10. High-Temperature Operating Life (HTOL) -- 5.11. Electrochemical Migration -- 5.12. Tin Whiskering -- 5.13. Tin Pest -- 5.14. Summary -- Acknowledgments -- References -- 6. Lead-Free Assembly Reliability: iNEMI Evaluation and Results (Elizabeth Benedetto and John Sohn) -- 6.1. Reliability Team Goals -- 6.2. Reliability Test Matrix -- 6.3. Component-Paste-Board Finish Combinations -- 6.4. Components -- 6.5. Test Vehicles -- 6.6. Pre-Test/Post-Assembly Information -- 6.7. CTE Determination: Component and Boards -- 6.8. Thermal Cycling Conditions -- 6.9. Failure Criteria -- 6.10. Thermal Cycle Relative Performance -- 6.11. Failure Data, Analysis Packages -- 6.12. Weibull Analyses -- 6.13. Post-Cycling Failure Analysis -- 6.14. Bend Testing -- 6.15. Electrochemical Migration Testing [36, 37] -- 6.16. iNEMI Team Conclusions -- 6.17. Overall Summary, Conclusions -- 6.18. ASTM Test Methods -- References -- 7. Tin Whiskers: Mitigation Strategies and Testing (Heidi L. Reynolds, C. J. Lee, and Joe Smetana) -- 7.1. Introduction -- 7.2. Mitigation Strategies -- 7.3. Tin Whisker Test Development -- 7.4. Summary -- Acknowledgments -- References -- 8. Lead-Free Reflow and Rework (Jasbir Bath) -- 8.1. Introduction -- 8.2. Printability of Lead-Free Solder Pastes -- 8.3. Soak Versus Ramp Temperature Profiles -- 8.4. Effect of Peak Temperature Versus Reflow Performance -- 8.5. Effect of Reflow Atmosphere on Solderability of Lead-Free Solder.
8.6. Convection Versus IR Reflow Ovens -- 8.7. Reflow Temperature Delta on Boards and Components -- 8.8. Visual Inspection of Lead-Free Soldered Joints -- 8.9. Automated Optical Inspection (AOI) -- 8.10. X-ray Inspection of Lead-Free Soldered Joints -- 8.11. Acoustic Microscopy Inspection of Components Before and After Lead-Free Reflow -- 8.12. Lead-Free Rework of BGA/CSP Soldered Joints -- 8.13. Lead-Free Hand-Soldering Rework -- 8.14. In-Circuit Testing and Functional Testing (ICT/FT) of Soldered Joints -- 8.15. Yield Data -- 8.16. Surface-Mount Fillet Lifting and Reliability of Reflowed Soldered Joints -- 8.17. Conclusions -- 8.18. Future Work -- Acknowledgments -- References -- 9. Case Study: Pb-Free Assembly, Rework, and Reliability Analysis of IPC Class 2 Assemblies (Jerry Gleason, Charlie Reynolds, Matt Kelly, Jasbir Bath, Quyen Chu, Ken Lyjak, and Patrick Roubaud) -- 9.1. Introduction -- 9.2. Approach and Strategy -- 9.3. Observations and Results -- 9.4. Conclusions -- 9.5. Summary -- Acknowledgments -- References -- 10. Implementing RoHS and WEEE-Compliant Products (Jim MCElroy and Cynthia Williams) -- 10.1. Introduction -- 10.2. Are Your Products within the Scope of the EU ROHS? -- 10.3. Ten Steps to ROHS Compliance -- 10.4. Part Numbering Important for Differentiating Lead-Free from Tin-Lead Components and Boards -- 10.5. A Standards-Based Approach to Materials Declaration -- 10.6. Standards -- 10.7. High-Reliability Requirements -- 10.8. Business Impact of Supply Chain Conversion -- 10.9. Summary -- References -- Index.
Record Nr. UNINA-9910144575603321
Hoboken, N. J. : , : Wiley, , c2007
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Lead-free electronics : iNEMI projects lead to successful manufacturing / / edited by Edwin Bradley ... [et al.]
Lead-free electronics : iNEMI projects lead to successful manufacturing / / edited by Edwin Bradley ... [et al.]
Pubbl/distr/stampa Hoboken, N. J. : , : Wiley, , c2007
Descrizione fisica 1 online resource (468 p.)
Disciplina 621.381531
Altri autori (Persone) BradleyEdwin
Soggetto topico Lead-free electronics manufacturing processes
Solder and soldering
ISBN 1-281-03248-4
9786611032487
0-470-17147-2
0-470-17146-4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Preface (Ronald W. Gedney) -- Contributors -- Introduction (Jasbir Bath and Carol A. Handwerker) -- Lead-Free Assembly Project -- Alloy Group -- Process Group -- Component Group -- Reliability Group -- Follow-On Projects/Work -- 1. Alloy Selection (Carol A. Handwerker, Ursula Kattner, Kilwon Moon, Jasbir Bath, Edwin Bradley, and Polina Snugovsky) -- 1.1. Introduction -- 1.2. Lead-Free Alloys Considered by iNEMI in 1999 as Replacements for Tin-Lead Eutectic Solder -- 1.3. Fundamental Properties of Lead-Free Solder Alloys Affecting Manufacturing and Reliability -- 1.4. R&D Issues Remaining in Lead-Free Solder Implementation -- 1.5. Summary -- References -- 2. Review and Analysis of Lead-Free Solder Material Properties (Jean-Paul Clech) -- 2.1. Introduction -- 2.2. Tin-Lead Properties and Models -- 2.3. Tin-Silver Properties and Creep Data -- 2.4. Tin-Silver-Copper Properties and Creep Data -- 2.5. Alloy Comparisons -- 2.6. General Conclusions/Recommendations -- Appendix A: Tin-Silver Creep Data -- Appendix B: Tin-Silver-Copper Creep Data -- Acknowledgments -- References -- 3. Lead-Free Solder Paste Technology (Ning-Cheng Lee) -- 3.1. Introduction -- 3.2. Materials -- 3.3. Rheology -- 3.4. Applications -- 3.5. Reflow Soldering -- 3.6. Microstructures of Reflowed Joints -- 3.7. Challenges of Lead-Free Reflow Soldering -- 3.8. Summary -- References -- 4. Impact of Elevated Reflow Temperatures on Component Performance (Richard D. Parker, Jack MCCullen, Nick Lycoudes, and R. J. Arvikar) -- 4.1. Introduction to Component "Lead-Freé Issues -- 4.2. Moisture/Reflow Impact on Packaged Integrated Circuits -- 4.3. Impact of Increased Solder Peak Reflow Temperatures on Moisture Sensitivity Level Ratings -- 4.4. Impact of Increased Solder Peak Reflow Temperatures -- 4.5. Observations on Profiling for the Lead-Free Reflow Processes -- 4.6. IC Package Improvement Options for Better Package MSL at Higher Lead-Free Solder Reflow Temperatures.
4.7. Frequency Control Products -- 4.8. "Lead-Freé Cost Impact on Components -- 4.9. Packaging Identification of Lead-free Packaged ICs -- 4.10. Conclusions -- Acknowledgments -- References -- 5. Lead-Free Assembly Reliability--General (Edwin Bradley) -- 5.1. Introduction -- 5.2. Basic Physical Properties of Solder -- 5.3. Creep Deformation -- 5.4. Thermal Fatigue -- 5.5. Creep Rupture -- 5.6. Isothermal (Mechanical) Fatigue -- 5.7. Out-of-Plane Bending -- 5.8. Impact/Shock Loading -- 5.9. Effect of Rework on Reliability -- 5.10. High-Temperature Operating Life (HTOL) -- 5.11. Electrochemical Migration -- 5.12. Tin Whiskering -- 5.13. Tin Pest -- 5.14. Summary -- Acknowledgments -- References -- 6. Lead-Free Assembly Reliability: iNEMI Evaluation and Results (Elizabeth Benedetto and John Sohn) -- 6.1. Reliability Team Goals -- 6.2. Reliability Test Matrix -- 6.3. Component-Paste-Board Finish Combinations -- 6.4. Components -- 6.5. Test Vehicles -- 6.6. Pre-Test/Post-Assembly Information -- 6.7. CTE Determination: Component and Boards -- 6.8. Thermal Cycling Conditions -- 6.9. Failure Criteria -- 6.10. Thermal Cycle Relative Performance -- 6.11. Failure Data, Analysis Packages -- 6.12. Weibull Analyses -- 6.13. Post-Cycling Failure Analysis -- 6.14. Bend Testing -- 6.15. Electrochemical Migration Testing [36, 37] -- 6.16. iNEMI Team Conclusions -- 6.17. Overall Summary, Conclusions -- 6.18. ASTM Test Methods -- References -- 7. Tin Whiskers: Mitigation Strategies and Testing (Heidi L. Reynolds, C. J. Lee, and Joe Smetana) -- 7.1. Introduction -- 7.2. Mitigation Strategies -- 7.3. Tin Whisker Test Development -- 7.4. Summary -- Acknowledgments -- References -- 8. Lead-Free Reflow and Rework (Jasbir Bath) -- 8.1. Introduction -- 8.2. Printability of Lead-Free Solder Pastes -- 8.3. Soak Versus Ramp Temperature Profiles -- 8.4. Effect of Peak Temperature Versus Reflow Performance -- 8.5. Effect of Reflow Atmosphere on Solderability of Lead-Free Solder.
8.6. Convection Versus IR Reflow Ovens -- 8.7. Reflow Temperature Delta on Boards and Components -- 8.8. Visual Inspection of Lead-Free Soldered Joints -- 8.9. Automated Optical Inspection (AOI) -- 8.10. X-ray Inspection of Lead-Free Soldered Joints -- 8.11. Acoustic Microscopy Inspection of Components Before and After Lead-Free Reflow -- 8.12. Lead-Free Rework of BGA/CSP Soldered Joints -- 8.13. Lead-Free Hand-Soldering Rework -- 8.14. In-Circuit Testing and Functional Testing (ICT/FT) of Soldered Joints -- 8.15. Yield Data -- 8.16. Surface-Mount Fillet Lifting and Reliability of Reflowed Soldered Joints -- 8.17. Conclusions -- 8.18. Future Work -- Acknowledgments -- References -- 9. Case Study: Pb-Free Assembly, Rework, and Reliability Analysis of IPC Class 2 Assemblies (Jerry Gleason, Charlie Reynolds, Matt Kelly, Jasbir Bath, Quyen Chu, Ken Lyjak, and Patrick Roubaud) -- 9.1. Introduction -- 9.2. Approach and Strategy -- 9.3. Observations and Results -- 9.4. Conclusions -- 9.5. Summary -- Acknowledgments -- References -- 10. Implementing RoHS and WEEE-Compliant Products (Jim MCElroy and Cynthia Williams) -- 10.1. Introduction -- 10.2. Are Your Products within the Scope of the EU ROHS? -- 10.3. Ten Steps to ROHS Compliance -- 10.4. Part Numbering Important for Differentiating Lead-Free from Tin-Lead Components and Boards -- 10.5. A Standards-Based Approach to Materials Declaration -- 10.6. Standards -- 10.7. High-Reliability Requirements -- 10.8. Business Impact of Supply Chain Conversion -- 10.9. Summary -- References -- Index.
Record Nr. UNINA-9910830113103321
Hoboken, N. J. : , : Wiley, , c2007
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Lead-free electronics : iNEMI projects lead to successful manufacturing / / edited by Edwin Bradley ... [et al.]
Lead-free electronics : iNEMI projects lead to successful manufacturing / / edited by Edwin Bradley ... [et al.]
Pubbl/distr/stampa Hoboken, N. J., : Wiley
Descrizione fisica 1 online resource (468 p.)
Disciplina 621.381531
Altri autori (Persone) BradleyEdwin
Soggetto topico Lead-free electronics manufacturing processes
Solder and soldering
ISBN 1-281-03248-4
9786611032487
0-470-17147-2
0-470-17146-4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Preface (Ronald W. Gedney) -- Contributors -- Introduction (Jasbir Bath and Carol A. Handwerker) -- Lead-Free Assembly Project -- Alloy Group -- Process Group -- Component Group -- Reliability Group -- Follow-On Projects/Work -- 1. Alloy Selection (Carol A. Handwerker, Ursula Kattner, Kilwon Moon, Jasbir Bath, Edwin Bradley, and Polina Snugovsky) -- 1.1. Introduction -- 1.2. Lead-Free Alloys Considered by iNEMI in 1999 as Replacements for Tin-Lead Eutectic Solder -- 1.3. Fundamental Properties of Lead-Free Solder Alloys Affecting Manufacturing and Reliability -- 1.4. R&D Issues Remaining in Lead-Free Solder Implementation -- 1.5. Summary -- References -- 2. Review and Analysis of Lead-Free Solder Material Properties (Jean-Paul Clech) -- 2.1. Introduction -- 2.2. Tin-Lead Properties and Models -- 2.3. Tin-Silver Properties and Creep Data -- 2.4. Tin-Silver-Copper Properties and Creep Data -- 2.5. Alloy Comparisons -- 2.6. General Conclusions/Recommendations -- Appendix A: Tin-Silver Creep Data -- Appendix B: Tin-Silver-Copper Creep Data -- Acknowledgments -- References -- 3. Lead-Free Solder Paste Technology (Ning-Cheng Lee) -- 3.1. Introduction -- 3.2. Materials -- 3.3. Rheology -- 3.4. Applications -- 3.5. Reflow Soldering -- 3.6. Microstructures of Reflowed Joints -- 3.7. Challenges of Lead-Free Reflow Soldering -- 3.8. Summary -- References -- 4. Impact of Elevated Reflow Temperatures on Component Performance (Richard D. Parker, Jack MCCullen, Nick Lycoudes, and R. J. Arvikar) -- 4.1. Introduction to Component "Lead-Freé Issues -- 4.2. Moisture/Reflow Impact on Packaged Integrated Circuits -- 4.3. Impact of Increased Solder Peak Reflow Temperatures on Moisture Sensitivity Level Ratings -- 4.4. Impact of Increased Solder Peak Reflow Temperatures -- 4.5. Observations on Profiling for the Lead-Free Reflow Processes -- 4.6. IC Package Improvement Options for Better Package MSL at Higher Lead-Free Solder Reflow Temperatures.
4.7. Frequency Control Products -- 4.8. "Lead-Freé Cost Impact on Components -- 4.9. Packaging Identification of Lead-free Packaged ICs -- 4.10. Conclusions -- Acknowledgments -- References -- 5. Lead-Free Assembly Reliability--General (Edwin Bradley) -- 5.1. Introduction -- 5.2. Basic Physical Properties of Solder -- 5.3. Creep Deformation -- 5.4. Thermal Fatigue -- 5.5. Creep Rupture -- 5.6. Isothermal (Mechanical) Fatigue -- 5.7. Out-of-Plane Bending -- 5.8. Impact/Shock Loading -- 5.9. Effect of Rework on Reliability -- 5.10. High-Temperature Operating Life (HTOL) -- 5.11. Electrochemical Migration -- 5.12. Tin Whiskering -- 5.13. Tin Pest -- 5.14. Summary -- Acknowledgments -- References -- 6. Lead-Free Assembly Reliability: iNEMI Evaluation and Results (Elizabeth Benedetto and John Sohn) -- 6.1. Reliability Team Goals -- 6.2. Reliability Test Matrix -- 6.3. Component-Paste-Board Finish Combinations -- 6.4. Components -- 6.5. Test Vehicles -- 6.6. Pre-Test/Post-Assembly Information -- 6.7. CTE Determination: Component and Boards -- 6.8. Thermal Cycling Conditions -- 6.9. Failure Criteria -- 6.10. Thermal Cycle Relative Performance -- 6.11. Failure Data, Analysis Packages -- 6.12. Weibull Analyses -- 6.13. Post-Cycling Failure Analysis -- 6.14. Bend Testing -- 6.15. Electrochemical Migration Testing [36, 37] -- 6.16. iNEMI Team Conclusions -- 6.17. Overall Summary, Conclusions -- 6.18. ASTM Test Methods -- References -- 7. Tin Whiskers: Mitigation Strategies and Testing (Heidi L. Reynolds, C. J. Lee, and Joe Smetana) -- 7.1. Introduction -- 7.2. Mitigation Strategies -- 7.3. Tin Whisker Test Development -- 7.4. Summary -- Acknowledgments -- References -- 8. Lead-Free Reflow and Rework (Jasbir Bath) -- 8.1. Introduction -- 8.2. Printability of Lead-Free Solder Pastes -- 8.3. Soak Versus Ramp Temperature Profiles -- 8.4. Effect of Peak Temperature Versus Reflow Performance -- 8.5. Effect of Reflow Atmosphere on Solderability of Lead-Free Solder.
8.6. Convection Versus IR Reflow Ovens -- 8.7. Reflow Temperature Delta on Boards and Components -- 8.8. Visual Inspection of Lead-Free Soldered Joints -- 8.9. Automated Optical Inspection (AOI) -- 8.10. X-ray Inspection of Lead-Free Soldered Joints -- 8.11. Acoustic Microscopy Inspection of Components Before and After Lead-Free Reflow -- 8.12. Lead-Free Rework of BGA/CSP Soldered Joints -- 8.13. Lead-Free Hand-Soldering Rework -- 8.14. In-Circuit Testing and Functional Testing (ICT/FT) of Soldered Joints -- 8.15. Yield Data -- 8.16. Surface-Mount Fillet Lifting and Reliability of Reflowed Soldered Joints -- 8.17. Conclusions -- 8.18. Future Work -- Acknowledgments -- References -- 9. Case Study: Pb-Free Assembly, Rework, and Reliability Analysis of IPC Class 2 Assemblies (Jerry Gleason, Charlie Reynolds, Matt Kelly, Jasbir Bath, Quyen Chu, Ken Lyjak, and Patrick Roubaud) -- 9.1. Introduction -- 9.2. Approach and Strategy -- 9.3. Observations and Results -- 9.4. Conclusions -- 9.5. Summary -- Acknowledgments -- References -- 10. Implementing RoHS and WEEE-Compliant Products (Jim MCElroy and Cynthia Williams) -- 10.1. Introduction -- 10.2. Are Your Products within the Scope of the EU ROHS? -- 10.3. Ten Steps to ROHS Compliance -- 10.4. Part Numbering Important for Differentiating Lead-Free from Tin-Lead Components and Boards -- 10.5. A Standards-Based Approach to Materials Declaration -- 10.6. Standards -- 10.7. High-Reliability Requirements -- 10.8. Business Impact of Supply Chain Conversion -- 10.9. Summary -- References -- Index.
Record Nr. UNINA-9910876716703321
Hoboken, N. J., : Wiley
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Lead-free electronics [[electronic resource] /] / edited by Sanka Ganesan, Michael Pecht
Lead-free electronics [[electronic resource] /] / edited by Sanka Ganesan, Michael Pecht
Pubbl/distr/stampa Hoboken, N.J., : Wiley-Interscience, c2006
Descrizione fisica 1 online resource (796 p.)
Disciplina 621.381
Altri autori (Persone) GanesanSanka
PechtMichael
Soggetto topico Electronic apparatus and appliances
Lead-free electronics manufacturing processes
Soggetto genere / forma Electronic books.
ISBN 1-280-34963-8
9786610349630
0-470-00780-X
0-470-00779-6
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Lead-free Electronics; Contents; Preface; Editors; Contributors; Acknowledgments; Chapter 1 Lead-free Electronics: Overview; 1.1 What Is Lead-free?; 1.2 Why Lead-free?; 1.2.1 Legislation; 1.2.2 Market differentiation; 1.2.3 Environmental stewardship; 1.3 Who Are the First Consumers for Lead-free Products?; 1.3.1 Affluent societies; 1.3.2 Social/cultural motivation; 1.3.3 Consumer response to lead-free electronics; 1.4 Are There Any Technical Barriers to Lead-free Electronics?; 1.4.1 Technical issues; 1.4.2 Reliability concerns; 1.5 How Will We Migrate to Lead-free Electronics?
1.5.1 Potential mismatches: obsolescence and compatibility1.5.2 Supply chain issues; 1.6 When Will Lead-free Products Be Widely Available?; 1.6.1 Recycling and material recovery systems; 1.7 summary; 1.8 References; Chapter 2 Lead-free Legislations, Exemptions, and Compliance; 2.1 Overview of the Lead-free Legislation; 2.1.1 WEEE Directive; 2.1.2 RoHS Directive; 2.1.3 Electronic Waste Recycling Act in California; 2.1.4 Hazardous material ban in China; 2.2 Exemptions; 2.2.1 Lead in glass of cathode ray tubes, electronic components and fluorescent tubes
2.2.2 Lead in high melting temperature type solders2.2.3 Lead in solders for servers, storage and storage array systems; 2.2.4 Lead in solders for network infrastructure equipment; 2.2.5 Lead in electronic ceramic parts; 2.3 Impact of Exemptions; 2.3.1 Military electronics; 2.3.2 Automotive electronics; 2.3.3 Avionics; 2.3.4 Oil and gas well electronics; 2.3.5 Medical electronics; 2.3.6 Industrial. network infrastructure, server and storage electronics; 2.3.7 Risks due to exemptions; 2.4 Compliance with the Legislation; 2.5 Recommendations and Conclusions; 2.6 References
Chapter 3 Lead-free Alloys: Overview3.1 Lead-Free Alloys Requirements; 3.2 Binary Alloys; 3.3 Ternary and Quaternary Alloys; 3.3.1 Tin-silver-copper alloys; 3.3.2 Tin-silver-bismuth alloys; 3.3.3 Tin-silver-copper-bismuth alloy; 3.3.4 Tin-silver-copper-antimony alloy; 3.3.5 Tin-zinc-bismuth alloy; 3.3.6 Worldwide suppliers for lead-free alloys; 3.4 Summary; 3.5 References; Chapter 4 Lead-free Manufacturing; 4.1 Introduction; 4.2 Alloy Selection; 4.2.1 Sn58Bi; 4.2.2 SnZnBi; 4.2.3 SnAgBi; 4.2.4 Sn3.5Ag; 4.2.5 Sn0.7Cu; 4.2.6 SnAgCU; 4.2.7 Summary of alloy selection for reflow soldering
4.3 Alloy Selection for Wave Soldering4.4 Characteristics of Selected Tin-Silver-Copper Alloy; 4.4.1 Various compositions; 4.4.2 Reflow characteristics; 4.5 Considerations and Tests for Lead-free Components; 4.5.1 Suggested test requirements for lead-free components; 4.6 Assuring Material Readiness for Lead-free Assembly; 4.7 Tracing Lead-free Systems; 4.7.1 Process change notices (PCN); 4.7.2 Component part numbers (CPN); 4.8 Solder Paste Handling; 4.9 Surface-Mount Assembly Process; 4.9.1 Screen printing; 4.9.2 Pick and place; 4.9.3 Reflow; 4.10 Wave Solder Process
4.10.1 Materials considerations for wave soldering
Record Nr. UNINA-9910143420603321
Hoboken, N.J., : Wiley-Interscience, c2006
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Lead-free electronics [[electronic resource] /] / edited by Sanka Ganesan, Michael Pecht
Lead-free electronics [[electronic resource] /] / edited by Sanka Ganesan, Michael Pecht
Pubbl/distr/stampa Hoboken, N.J., : Wiley-Interscience, c2006
Descrizione fisica 1 online resource (796 p.)
Disciplina 621.381
Altri autori (Persone) GanesanSanka
PechtMichael
Soggetto topico Electronic apparatus and appliances
Lead-free electronics manufacturing processes
ISBN 1-280-34963-8
9786610349630
0-470-00780-X
0-470-00779-6
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Lead-free Electronics; Contents; Preface; Editors; Contributors; Acknowledgments; Chapter 1 Lead-free Electronics: Overview; 1.1 What Is Lead-free?; 1.2 Why Lead-free?; 1.2.1 Legislation; 1.2.2 Market differentiation; 1.2.3 Environmental stewardship; 1.3 Who Are the First Consumers for Lead-free Products?; 1.3.1 Affluent societies; 1.3.2 Social/cultural motivation; 1.3.3 Consumer response to lead-free electronics; 1.4 Are There Any Technical Barriers to Lead-free Electronics?; 1.4.1 Technical issues; 1.4.2 Reliability concerns; 1.5 How Will We Migrate to Lead-free Electronics?
1.5.1 Potential mismatches: obsolescence and compatibility1.5.2 Supply chain issues; 1.6 When Will Lead-free Products Be Widely Available?; 1.6.1 Recycling and material recovery systems; 1.7 summary; 1.8 References; Chapter 2 Lead-free Legislations, Exemptions, and Compliance; 2.1 Overview of the Lead-free Legislation; 2.1.1 WEEE Directive; 2.1.2 RoHS Directive; 2.1.3 Electronic Waste Recycling Act in California; 2.1.4 Hazardous material ban in China; 2.2 Exemptions; 2.2.1 Lead in glass of cathode ray tubes, electronic components and fluorescent tubes
2.2.2 Lead in high melting temperature type solders2.2.3 Lead in solders for servers, storage and storage array systems; 2.2.4 Lead in solders for network infrastructure equipment; 2.2.5 Lead in electronic ceramic parts; 2.3 Impact of Exemptions; 2.3.1 Military electronics; 2.3.2 Automotive electronics; 2.3.3 Avionics; 2.3.4 Oil and gas well electronics; 2.3.5 Medical electronics; 2.3.6 Industrial. network infrastructure, server and storage electronics; 2.3.7 Risks due to exemptions; 2.4 Compliance with the Legislation; 2.5 Recommendations and Conclusions; 2.6 References
Chapter 3 Lead-free Alloys: Overview3.1 Lead-Free Alloys Requirements; 3.2 Binary Alloys; 3.3 Ternary and Quaternary Alloys; 3.3.1 Tin-silver-copper alloys; 3.3.2 Tin-silver-bismuth alloys; 3.3.3 Tin-silver-copper-bismuth alloy; 3.3.4 Tin-silver-copper-antimony alloy; 3.3.5 Tin-zinc-bismuth alloy; 3.3.6 Worldwide suppliers for lead-free alloys; 3.4 Summary; 3.5 References; Chapter 4 Lead-free Manufacturing; 4.1 Introduction; 4.2 Alloy Selection; 4.2.1 Sn58Bi; 4.2.2 SnZnBi; 4.2.3 SnAgBi; 4.2.4 Sn3.5Ag; 4.2.5 Sn0.7Cu; 4.2.6 SnAgCU; 4.2.7 Summary of alloy selection for reflow soldering
4.3 Alloy Selection for Wave Soldering4.4 Characteristics of Selected Tin-Silver-Copper Alloy; 4.4.1 Various compositions; 4.4.2 Reflow characteristics; 4.5 Considerations and Tests for Lead-free Components; 4.5.1 Suggested test requirements for lead-free components; 4.6 Assuring Material Readiness for Lead-free Assembly; 4.7 Tracing Lead-free Systems; 4.7.1 Process change notices (PCN); 4.7.2 Component part numbers (CPN); 4.8 Solder Paste Handling; 4.9 Surface-Mount Assembly Process; 4.9.1 Screen printing; 4.9.2 Pick and place; 4.9.3 Reflow; 4.10 Wave Solder Process
4.10.1 Materials considerations for wave soldering
Record Nr. UNINA-9910831170003321
Hoboken, N.J., : Wiley-Interscience, c2006
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Lead-free electronics / / edited by Sanka Ganesan, Michael Pecht
Lead-free electronics / / edited by Sanka Ganesan, Michael Pecht
Pubbl/distr/stampa Hoboken, N.J., : Wiley-Interscience, c2006
Descrizione fisica 1 online resource (796 p.)
Disciplina 621.3815
Altri autori (Persone) GanesanSanka
PechtMichael
Soggetto topico Electronic apparatus and appliances
Lead-free electronics manufacturing processes
ISBN 1-280-34963-8
9786610349630
0-470-00780-X
0-470-00779-6
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Lead-free Electronics; Contents; Preface; Editors; Contributors; Acknowledgments; Chapter 1 Lead-free Electronics: Overview; 1.1 What Is Lead-free?; 1.2 Why Lead-free?; 1.2.1 Legislation; 1.2.2 Market differentiation; 1.2.3 Environmental stewardship; 1.3 Who Are the First Consumers for Lead-free Products?; 1.3.1 Affluent societies; 1.3.2 Social/cultural motivation; 1.3.3 Consumer response to lead-free electronics; 1.4 Are There Any Technical Barriers to Lead-free Electronics?; 1.4.1 Technical issues; 1.4.2 Reliability concerns; 1.5 How Will We Migrate to Lead-free Electronics?
1.5.1 Potential mismatches: obsolescence and compatibility1.5.2 Supply chain issues; 1.6 When Will Lead-free Products Be Widely Available?; 1.6.1 Recycling and material recovery systems; 1.7 summary; 1.8 References; Chapter 2 Lead-free Legislations, Exemptions, and Compliance; 2.1 Overview of the Lead-free Legislation; 2.1.1 WEEE Directive; 2.1.2 RoHS Directive; 2.1.3 Electronic Waste Recycling Act in California; 2.1.4 Hazardous material ban in China; 2.2 Exemptions; 2.2.1 Lead in glass of cathode ray tubes, electronic components and fluorescent tubes
2.2.2 Lead in high melting temperature type solders2.2.3 Lead in solders for servers, storage and storage array systems; 2.2.4 Lead in solders for network infrastructure equipment; 2.2.5 Lead in electronic ceramic parts; 2.3 Impact of Exemptions; 2.3.1 Military electronics; 2.3.2 Automotive electronics; 2.3.3 Avionics; 2.3.4 Oil and gas well electronics; 2.3.5 Medical electronics; 2.3.6 Industrial. network infrastructure, server and storage electronics; 2.3.7 Risks due to exemptions; 2.4 Compliance with the Legislation; 2.5 Recommendations and Conclusions; 2.6 References
Chapter 3 Lead-free Alloys: Overview3.1 Lead-Free Alloys Requirements; 3.2 Binary Alloys; 3.3 Ternary and Quaternary Alloys; 3.3.1 Tin-silver-copper alloys; 3.3.2 Tin-silver-bismuth alloys; 3.3.3 Tin-silver-copper-bismuth alloy; 3.3.4 Tin-silver-copper-antimony alloy; 3.3.5 Tin-zinc-bismuth alloy; 3.3.6 Worldwide suppliers for lead-free alloys; 3.4 Summary; 3.5 References; Chapter 4 Lead-free Manufacturing; 4.1 Introduction; 4.2 Alloy Selection; 4.2.1 Sn58Bi; 4.2.2 SnZnBi; 4.2.3 SnAgBi; 4.2.4 Sn3.5Ag; 4.2.5 Sn0.7Cu; 4.2.6 SnAgCU; 4.2.7 Summary of alloy selection for reflow soldering
4.3 Alloy Selection for Wave Soldering4.4 Characteristics of Selected Tin-Silver-Copper Alloy; 4.4.1 Various compositions; 4.4.2 Reflow characteristics; 4.5 Considerations and Tests for Lead-free Components; 4.5.1 Suggested test requirements for lead-free components; 4.6 Assuring Material Readiness for Lead-free Assembly; 4.7 Tracing Lead-free Systems; 4.7.1 Process change notices (PCN); 4.7.2 Component part numbers (CPN); 4.8 Solder Paste Handling; 4.9 Surface-Mount Assembly Process; 4.9.1 Screen printing; 4.9.2 Pick and place; 4.9.3 Reflow; 4.10 Wave Solder Process
4.10.1 Materials considerations for wave soldering
Record Nr. UNINA-9910877721803321
Hoboken, N.J., : Wiley-Interscience, c2006
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Lead-free solder interconnect reliability [[electronic resource] /] / edited by Dongkai Shangguan
Lead-free solder interconnect reliability [[electronic resource] /] / edited by Dongkai Shangguan
Pubbl/distr/stampa Materials Park, OH, : ASM International, 2005
Descrizione fisica 1 online resource (302 p.)
Disciplina 621.381/046
Altri autori (Persone) ShangguanDongkai <1963->
Soggetto topico Microelectronic packaging - Reliability
Solder and soldering
Lead-free electronics manufacturing processes
Soggetto genere / forma Electronic books.
ISBN 1-61503-093-X
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto ""Contents""; ""Foreword""; ""Preface""; ""Lead-Free Soldering and Environmental Compliance: An Overview""; ""Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects""; ""Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties""; ""Lead-Free Solder Joint Reliability Trends""; ""Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects""; ""Tin Whisker Growth on Lead-Free Solder Finishes""; ""Accelerated Testing Methodology for Lead-Free Solder Interconnects""
""Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects""""Design for Reliability Finite Element Modeling of Lead-Free Solder Interconnects""; ""Characterization and Failure Analyses of Lead-Free Solder Defects""; ""Reliability of Interconnects with Conductive Adhesives""; ""Lead-Free Solder Interconnect Reliability Outlook""; ""Index""
Record Nr. UNINA-9910458703703321
Materials Park, OH, : ASM International, 2005
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Lead-free solder interconnect reliability [[electronic resource] /] / edited by Dongkai Shangguan
Lead-free solder interconnect reliability [[electronic resource] /] / edited by Dongkai Shangguan
Pubbl/distr/stampa Materials Park, OH, : ASM International, 2005
Descrizione fisica 1 online resource (302 p.)
Disciplina 621.381/046
Altri autori (Persone) ShangguanDongkai <1963->
Soggetto topico Microelectronic packaging - Reliability
Solder and soldering
Lead-free electronics manufacturing processes
ISBN 1-61503-093-X
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto ""Contents""; ""Foreword""; ""Preface""; ""Lead-Free Soldering and Environmental Compliance: An Overview""; ""Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects""; ""Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties""; ""Lead-Free Solder Joint Reliability Trends""; ""Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects""; ""Tin Whisker Growth on Lead-Free Solder Finishes""; ""Accelerated Testing Methodology for Lead-Free Solder Interconnects""
""Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects""""Design for Reliability Finite Element Modeling of Lead-Free Solder Interconnects""; ""Characterization and Failure Analyses of Lead-Free Solder Defects""; ""Reliability of Interconnects with Conductive Adhesives""; ""Lead-Free Solder Interconnect Reliability Outlook""; ""Index""
Record Nr. UNINA-9910791454203321
Materials Park, OH, : ASM International, 2005
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Lead-free solder interconnect reliability / / edited by Dongkai Shangguan
Lead-free solder interconnect reliability / / edited by Dongkai Shangguan
Edizione [1st ed.]
Pubbl/distr/stampa Materials Park, OH, : ASM International, 2005
Descrizione fisica 1 online resource (302 p.)
Disciplina 621.381/046
Altri autori (Persone) ShangguanDongkai <1963->
Soggetto topico Microelectronic packaging - Reliability
Solder and soldering
Lead-free electronics manufacturing processes
ISBN 1-61503-093-X
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto ""Contents""; ""Foreword""; ""Preface""; ""Lead-Free Soldering and Environmental Compliance: An Overview""; ""Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects""; ""Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties""; ""Lead-Free Solder Joint Reliability Trends""; ""Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects""; ""Tin Whisker Growth on Lead-Free Solder Finishes""; ""Accelerated Testing Methodology for Lead-Free Solder Interconnects""
""Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects""""Design for Reliability Finite Element Modeling of Lead-Free Solder Interconnects""; ""Characterization and Failure Analyses of Lead-Free Solder Defects""; ""Reliability of Interconnects with Conductive Adhesives""; ""Lead-Free Solder Interconnect Reliability Outlook""; ""Index""
Record Nr. UNINA-9910809229003321
Materials Park, OH, : ASM International, 2005
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui