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Catching up and leapfrogging : the new latecomers in the integrated circuits industry / / Xiao-Shan Yap and Rajah Rasiah
| Catching up and leapfrogging : the new latecomers in the integrated circuits industry / / Xiao-Shan Yap and Rajah Rasiah |
| Autore | Yap Xiao-Shan |
| Pubbl/distr/stampa | London ; ; New York, N.Y. : , : Routledge, , 2017 |
| Descrizione fisica | 1 online resource (171 pages) : illustrations, tables |
| Disciplina | 621.3815068/4 |
| Altri autori (Persone) | RasiahRajah |
| Collana | Routledge Studies in Global Competition |
| Soggetto topico | Integrated circuits industry |
| ISBN |
1-315-44986-2
1-315-44988-9 1-315-44987-0 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | 1. Introduction -- 2. Technical regimes, catch-up and organizational dynamics -- 3. Technological regimes, organizational boundaries and patterns of innovation -- 4. Resource acquisition strategies and catching up -- 5. Coevolutionary lock-in as a strategic mechanism -- 6. Synthesis and implications. |
| Record Nr. | UNINA-9910154873503321 |
Yap Xiao-Shan
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| London ; ; New York, N.Y. : , : Routledge, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Handbook of Integrated Circuit Industry / / edited by Yangyuan Wang [and three others]
| Handbook of Integrated Circuit Industry / / edited by Yangyuan Wang [and three others] |
| Edizione | [First edition.] |
| Pubbl/distr/stampa | Singapore : , : Springer, , [2024] |
| Descrizione fisica | 1 online resource (1014 illus., 5 illus. in color. eReference.) |
| Disciplina | 354.81150006 |
| Soggetto topico | Integrated circuits industry |
| ISBN | 981-9928-36-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Technology and Industrial Development of Integrated Circuits -- Classification and Applications of Integrated Circuit Products -- Economy and Investment of Integrated Circuit Industry -- Establishment and construction of Manufacturing Lines for Integrated Circuits -- Design of Integrated Circuits -- Integrated Circuit Manufacturing Technology and Management -- Testing and Packaging Technology for Integrated Circuits -- Manufacturing Equipment and Testing Instruments for Integrated Circuits -- Special Materials for Integrated Circuit Manufacturing -- Fundamental Research and Development of Advanced Technology for Integrated Circuits. |
| Record Nr. | UNINA-9910766893903321 |
| Singapore : , : Springer, , [2024] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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HCS : 2006 IEEE Hot Chips 18 Symposium : 20-22 August 2006
| HCS : 2006 IEEE Hot Chips 18 Symposium : 20-22 August 2006 |
| Pubbl/distr/stampa | New York : , : IEEE, , 2016 |
| Descrizione fisica | 1 online resource (320 pages) |
| Soggetto topico |
Integrated circuits
Integrated circuits industry |
| ISBN | 1-4673-8867-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996279487903316 |
| New York : , : IEEE, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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HCS : 2012 IEEE Hot Chips 24 Symposium : 27-29 August 2012
| HCS : 2012 IEEE Hot Chips 24 Symposium : 27-29 August 2012 |
| Pubbl/distr/stampa | New York : , : IEEE, , 2016 |
| Descrizione fisica | 1 online resource (147 pages) |
| Soggetto topico |
Integrated circuits
Integrated circuits industry |
| ISBN | 1-4673-8879-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996279488103316 |
| New York : , : IEEE, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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HCS : 2006 IEEE Hot Chips 18 Symposium : 20-22 August 2006
| HCS : 2006 IEEE Hot Chips 18 Symposium : 20-22 August 2006 |
| Pubbl/distr/stampa | New York : , : IEEE, , 2016 |
| Descrizione fisica | 1 online resource (320 pages) |
| Soggetto topico |
Integrated circuits
Integrated circuits industry |
| ISBN | 1-4673-8867-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910136983403321 |
| New York : , : IEEE, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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HCS : 2012 IEEE Hot Chips 24 Symposium : 27-29 August 2012
| HCS : 2012 IEEE Hot Chips 24 Symposium : 27-29 August 2012 |
| Pubbl/distr/stampa | New York : , : IEEE, , 2016 |
| Descrizione fisica | 1 online resource (147 pages) |
| Soggetto topico |
Integrated circuits
Integrated circuits industry |
| ISBN | 1-4673-8879-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910318356603321 |
| New York : , : IEEE, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Speeding-up radio-frequency integrated circuit sizing with neural networks / / João L. C. P. Domingues [and five others]
| Speeding-up radio-frequency integrated circuit sizing with neural networks / / João L. C. P. Domingues [and five others] |
| Autore | Domingues João L. C. P. |
| Edizione | [1st ed. 2023.] |
| Pubbl/distr/stampa | Cham, Switzerland : , : Springer, , [2023] |
| Descrizione fisica | 1 online resource (115 pages) |
| Disciplina | 621.3815 |
| Collana | SpringerBriefs in Computational Intelligence |
| Soggetto topico |
Integrated circuits - Design and construction
Integrated circuits industry Neural networks (Computer science) |
| ISBN | 3-031-25099-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Chapter 1. Introduction -- Chapter 2. Related Work: Machine Learning and Electronic Design Automation -- Chapter 3. Convergence Classifier & Frequency Guess Predictor based on ANNs -- Chapter 4. Process, Voltage and Temperature Corner Performance Estimator using ANNs -- Chapter 5. Conclusions. |
| Record Nr. | UNINA-9910682562203321 |
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Domingues João L. C. P.
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| Cham, Switzerland : , : Springer, , [2023] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Speeding-up radio-frequency integrated circuit sizing with neural networks / / João L. C. P. Domingues [and five others]
| Speeding-up radio-frequency integrated circuit sizing with neural networks / / João L. C. P. Domingues [and five others] |
| Autore | Domingues João L. C. P. |
| Edizione | [1st ed. 2023.] |
| Pubbl/distr/stampa | Cham, Switzerland : , : Springer, , [2023] |
| Descrizione fisica | 1 online resource (115 pages) |
| Disciplina | 621.3815 |
| Collana | SpringerBriefs in Computational Intelligence |
| Soggetto topico |
Integrated circuits - Design and construction
Integrated circuits industry Neural networks (Computer science) |
| ISBN | 3-031-25099-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Chapter 1. Introduction -- Chapter 2. Related Work: Machine Learning and Electronic Design Automation -- Chapter 3. Convergence Classifier & Frequency Guess Predictor based on ANNs -- Chapter 4. Process, Voltage and Temperature Corner Performance Estimator using ANNs -- Chapter 5. Conclusions. |
| Record Nr. | UNISA-996546820603316 |
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Domingues João L. C. P.
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| Cham, Switzerland : , : Springer, , [2023] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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Understanding fabless IC technology [[electronic resource] /] / Jeorge S. Hurtarte, Evert A. Wolsheimer, Lisa M. Tafoya
| Understanding fabless IC technology [[electronic resource] /] / Jeorge S. Hurtarte, Evert A. Wolsheimer, Lisa M. Tafoya |
| Autore | Hurtarte Jeorge S |
| Edizione | [1st edition] |
| Pubbl/distr/stampa | Amsterdam ; ; Boston, : Elsevier/Newnes, c2007 |
| Descrizione fisica | 1 online resource (294 p.) |
| Disciplina | 621.3815 |
| Altri autori (Persone) |
WolsheimerEvert A
TafoyaLisa M |
| Collana | Communications engineering series |
| Soggetto topico |
Integrated circuits - Design and construction
Integrated circuits industry |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-281-03653-6
9786611036539 0-08-055119-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Understanding Fabless IC Technology; Copyright Page; Contents; Acknowledgements; Preface; PART 1 - Manufacturing Strategies: Understanding Fabless IC Technology; Chapter 1: More than a Decade of Transition in the Semiconductor Industry; 1.1 FSA is Established; 1.2 Early Success; 1.3 Early Success Trend Continues; 1.4 Semiconductor Business Models; 1.5 Outsourcing Will Accelerate; 1.6 IDMs are Going Fabless; 1.7 A Case Study: Cypress Semiconductor; 1.8 More IDMs are Outsourcing; 1.9 Geographic Manufacturing Centers; Chapter 2: Fabless Semiconductor Manufacturing
2.1 Foundry Revenue Growth2.2 Semiconductor Back-End Services; 2.3 Semiconductor Equipment; Chapter 3: Qualities of Successful Fabless Companies; 3.1 Defining Events for the Fabless Market; 3.2 Thriving in the Fabless Model; 3.3 Key Qualities for Success; 3.4 The Future of Fabless; PART 2 - An In-Depth Understanding of the Fabless Semiconductor Business Model; Chapter 4: Semiconductor Manufacturing Basics; 4.1 Semiconductor Processes; 4.2 Semiconductor Manufacturing Steps; 4.3 Wafer Size; 4.4 Manufacturing Costs; 4.5 Conclusion; Chapter 5: Fabless ASICs; 5.1 Introduction 5.2 Origins of the ASIC Industry5.3 Emergence of the Fabless ASIC Business Model; 5.4 The Fabless ASIC Model: How It Works; 5.5 The Services and Capabilities of a Fabless ASIC Supplier; 5.6 Conclusion; Chapter 6: Electronic Design Automation; 6.1 Fabless EDA Overview; 6.2 Fabless EDA Selection Process; 6.3 Physical Design EDA; Chapter 7: Intellectual Property; 7.1 SIP Industry Overview; 7.2 SIP Business Environment; 7.3 Sourcing SIP Products; 7.4 Baseline Terminology; 7.5 Finding SIP and Related Products; 7.6 Evaluating SIP Business Models; 7.7 SIP Product Enablers 7.8 Examples by SIP Product Type7.9 Licensing SIP Products; 7.10 Provider and Buyer Perspectives; 7.11 The Evolution of the IP Industry; 7.12 Intellectual Property Considerations; 7.13 IP Outsourcing; 7.14 Making IP Work in the Fabless Semiconductor Community; 7.15 IP Acquisition Considerations for Fabless IC Companies; Chapter 8: e-Commerce; 8.1 The Virtual Fab Challenge; 8.2 Semiconductor & Fabless Manufacturing: What is Different?; 8.3 ""Build to Forecast"" for Outsourced Manufacturing; 8.4 ERP System Solutions; 8.5 The Information Ecosystem: Where Communication is Key Chapter 9: Quality and Reliability9.1 General; 9.2 Front-End; 9.3 Back-End; 9.4 Environment, Health and Safety; Chapter 10: Test Development; 10.1 Simplifying Outsourced Test Development; 10.2 Preparation; 10.3 Evaluation; 10.4 Conclusion; PART 3 - Becoming a Best-in-Class Fabless Company; Chapter 11: Best Practices for Fabless Companies; 11.1 Achieving Best-in-Class Operations Practices; 11.2 A Foundry Manager's Role in a Fabless Company; 11.3 Closing the Loop: Understanding the Manufacturing Flow; 11.4 Managing a Virtual Manufacturing Chain; Chapter 12: Building the Right Partnerships 12.1 Suppliers are (Almost) Just as Important as Customers |
| Record Nr. | UNINA-9910457066503321 |
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Hurtarte Jeorge S
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| Amsterdam ; ; Boston, : Elsevier/Newnes, c2007 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Understanding fabless IC technology [[electronic resource] /] / Jeorge S. Hurtarte, Evert A. Wolsheimer, Lisa M. Tafoya
| Understanding fabless IC technology [[electronic resource] /] / Jeorge S. Hurtarte, Evert A. Wolsheimer, Lisa M. Tafoya |
| Autore | Hurtarte Jeorge S |
| Edizione | [1st edition] |
| Pubbl/distr/stampa | Amsterdam ; ; Boston, : Elsevier/Newnes, c2007 |
| Descrizione fisica | 1 online resource (294 p.) |
| Disciplina | 621.3815 |
| Altri autori (Persone) |
WolsheimerEvert A
TafoyaLisa M |
| Collana | Communications engineering series |
| Soggetto topico |
Integrated circuits - Design and construction
Integrated circuits industry |
| ISBN |
1-281-03653-6
9786611036539 0-08-055119-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Understanding Fabless IC Technology; Copyright Page; Contents; Acknowledgements; Preface; PART 1 - Manufacturing Strategies: Understanding Fabless IC Technology; Chapter 1: More than a Decade of Transition in the Semiconductor Industry; 1.1 FSA is Established; 1.2 Early Success; 1.3 Early Success Trend Continues; 1.4 Semiconductor Business Models; 1.5 Outsourcing Will Accelerate; 1.6 IDMs are Going Fabless; 1.7 A Case Study: Cypress Semiconductor; 1.8 More IDMs are Outsourcing; 1.9 Geographic Manufacturing Centers; Chapter 2: Fabless Semiconductor Manufacturing
2.1 Foundry Revenue Growth2.2 Semiconductor Back-End Services; 2.3 Semiconductor Equipment; Chapter 3: Qualities of Successful Fabless Companies; 3.1 Defining Events for the Fabless Market; 3.2 Thriving in the Fabless Model; 3.3 Key Qualities for Success; 3.4 The Future of Fabless; PART 2 - An In-Depth Understanding of the Fabless Semiconductor Business Model; Chapter 4: Semiconductor Manufacturing Basics; 4.1 Semiconductor Processes; 4.2 Semiconductor Manufacturing Steps; 4.3 Wafer Size; 4.4 Manufacturing Costs; 4.5 Conclusion; Chapter 5: Fabless ASICs; 5.1 Introduction 5.2 Origins of the ASIC Industry5.3 Emergence of the Fabless ASIC Business Model; 5.4 The Fabless ASIC Model: How It Works; 5.5 The Services and Capabilities of a Fabless ASIC Supplier; 5.6 Conclusion; Chapter 6: Electronic Design Automation; 6.1 Fabless EDA Overview; 6.2 Fabless EDA Selection Process; 6.3 Physical Design EDA; Chapter 7: Intellectual Property; 7.1 SIP Industry Overview; 7.2 SIP Business Environment; 7.3 Sourcing SIP Products; 7.4 Baseline Terminology; 7.5 Finding SIP and Related Products; 7.6 Evaluating SIP Business Models; 7.7 SIP Product Enablers 7.8 Examples by SIP Product Type7.9 Licensing SIP Products; 7.10 Provider and Buyer Perspectives; 7.11 The Evolution of the IP Industry; 7.12 Intellectual Property Considerations; 7.13 IP Outsourcing; 7.14 Making IP Work in the Fabless Semiconductor Community; 7.15 IP Acquisition Considerations for Fabless IC Companies; Chapter 8: e-Commerce; 8.1 The Virtual Fab Challenge; 8.2 Semiconductor & Fabless Manufacturing: What is Different?; 8.3 ""Build to Forecast"" for Outsourced Manufacturing; 8.4 ERP System Solutions; 8.5 The Information Ecosystem: Where Communication is Key Chapter 9: Quality and Reliability9.1 General; 9.2 Front-End; 9.3 Back-End; 9.4 Environment, Health and Safety; Chapter 10: Test Development; 10.1 Simplifying Outsourced Test Development; 10.2 Preparation; 10.3 Evaluation; 10.4 Conclusion; PART 3 - Becoming a Best-in-Class Fabless Company; Chapter 11: Best Practices for Fabless Companies; 11.1 Achieving Best-in-Class Operations Practices; 11.2 A Foundry Manager's Role in a Fabless Company; 11.3 Closing the Loop: Understanding the Manufacturing Flow; 11.4 Managing a Virtual Manufacturing Chain; Chapter 12: Building the Right Partnerships 12.1 Suppliers are (Almost) Just as Important as Customers |
| Record Nr. | UNINA-9910784353303321 |
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Hurtarte Jeorge S
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| Amsterdam ; ; Boston, : Elsevier/Newnes, c2007 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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