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IIRW : 2018 IEEE International Integrated Reliability Workshop : Stanford Sierra Conference Center, South Lake Tahoe, CA, USA, October 7-11, 2018 / / sponsored by the Electron Devices Society and the IEEE Reliability Society
IIRW : 2018 IEEE International Integrated Reliability Workshop : Stanford Sierra Conference Center, South Lake Tahoe, CA, USA, October 7-11, 2018 / / sponsored by the Electron Devices Society and the IEEE Reliability Society
Pubbl/distr/stampa Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018
Descrizione fisica 1 online resource (69 pages)
Disciplina 621.3815
Soggetto topico Semiconductors - Reliability
Integrated circuits - Wafer-scale integratio - Reliability
Integrated circuits - Reliability
ISBN 1-5386-6039-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910326259803321
Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
IIRW : 2018 IEEE International Integrated Reliability Workshop : Stanford Sierra Conference Center, South Lake Tahoe, CA, USA, October 7-11, 2018 / / sponsored by the Electron Devices Society and the IEEE Reliability Society
IIRW : 2018 IEEE International Integrated Reliability Workshop : Stanford Sierra Conference Center, South Lake Tahoe, CA, USA, October 7-11, 2018 / / sponsored by the Electron Devices Society and the IEEE Reliability Society
Pubbl/distr/stampa Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018
Descrizione fisica 1 online resource (69 pages)
Disciplina 621.3815
Soggetto topico Semiconductors - Reliability
Integrated circuits - Wafer-scale integratio - Reliability
Integrated circuits - Reliability
ISBN 1-5386-6039-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996577955303316
Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui