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Advanced packaging : an IHS Group publication
| Advanced packaging : an IHS Group publication |
| Pubbl/distr/stampa | Libertyville, Ill., USA, : IHS Pub. Group, c1992- |
| Descrizione fisica | 1 online resource |
| Disciplina | 621.381/046/05 |
| Soggetto topico |
Hybrid integrated circuits - Design and construction
Microelectronic packaging |
| Soggetto genere / forma | Periodicals. |
| Formato | Materiale a stampa  |
| Livello bibliografico | Periodico |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910339529203321 |
| Libertyville, Ill., USA, : IHS Pub. Group, c1992- | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Advanced packaging : an IHS Group publication
| Advanced packaging : an IHS Group publication |
| Pubbl/distr/stampa | Libertyville, Ill., USA, : IHS Pub. Group, c1992- |
| Descrizione fisica | 1 online resource |
| Disciplina | 621.381/046/05 |
| Soggetto topico |
Hybrid integrated circuits - Design and construction
Microelectronic packaging |
| Soggetto genere / forma | Periodicals. |
| Formato | Materiale a stampa |
| Livello bibliografico | Periodico |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996207134503316 |
| Libertyville, Ill., USA, : IHS Pub. Group, c1992- | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
Hybrid microcircuit technology handbook : materials, processes, design, testing, and production / / by James J. Licari and Leonard R. Enlow
| Hybrid microcircuit technology handbook : materials, processes, design, testing, and production / / by James J. Licari and Leonard R. Enlow |
| Autore | Licari James J. <1930-> |
| Edizione | [2nd ed.] |
| Pubbl/distr/stampa | Westwood, N.J., : Noyes Publications, c1998 |
| Descrizione fisica | 1 online resource (603 p.) |
| Disciplina |
621.3815
621.3815 21 |
| Altri autori (Persone) | EnlowLeonard R |
| Collana | Materials science and process technology series |
| Soggetto topico |
Hybrid integrated circuits - Design and construction
Integrated circuits - Design and construction |
| ISBN |
1-282-71173-3
9786612711732 9786612011047 0-08-094659-3 1-59124-255-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Hybrid Microcircuit Technology Handbook: Materials, Processes, Design, Testing and Production; Copyright Page; Contents; Chapter 1. Introduction; 1.0 CLASSIFICATION OF MATERIALS FOR MICROELECTRONICS; 2.0 CLASSIFICATION OF PROCESSES; 3.0 DEFINITION AND CHARACTERISTICS OF HYBRID CIRCUITS; 4.0 APPLICATIONS; REFERENCES; Chapter 2. Substrates; 1.0 FUNCTIONS; 2.0 SURFACE CHARACTERISTICS; 3.0 ALUMINA SUBSTRATES; 4.0 BERYLLIA SUBSTRATES; 5.0 ALUMINUM NITRIDE; 6.0 METAL MATRIX COMPOSITES; 7.0 CERAMIC SUBSTRATE MANUFACTURE; 8.0 ENAMELED METAL SUBSTRATES
9.0 QUALITY ASSURANCE AND TEST METHODSREFERENCES; Chapter 3. Thin Film Processes; 1.0 DEPOSITION PROCESSES; 2.0 THIN FILM RESISTOR PROCESSES; 3.0 PHOTORESIST MATERIALS AND PROCESSES; 4.0 ETCHING MATERIALS AND PROCESSES; 5.0 THIN-FILM MICROBRIDGE CROSSOVER CIRCUITS; REFERENCES; Chapter 4. Thick Film Processes; 1.0 FABRICATION PROCESSES; 2.0 DIRECT WRITING; 3.0 PASTE MATERIALS; 4.0 NON-NOBLE-METAL THICK FILMS; 5.0 POLYMER THICK FILMS; REFERENCES; Chapter 5. Resistor Trimming; 1.0 LASER TRIMMING; 2.0 ABRASIVE TRIMMING; 3.0 RESISTOR PROBING/MEASUREMENT TECHNIQUES; 4.0 TYPES OF RESISTOR TRIMS 5.0 SPECIAL REQUIREMENTSREFERENCES; Chapter 6. Parts Selection; 1.0 GENERAL CONSIDERATIONS; 2.0 PACKAGES; 3.0 ACTIVE DEVICES; 4.0 PASSIVE DEVICES; REFERENCES; Chapter 7. Assembly Processes; 1.0 INTRODUCTION; 2.0 DIE AND SUBSTRATE ATTACHMENT; 3.0 INTERCONNECTIONS; 4.0 CLEANING; 5.0 PARTICLE IMMOBILIZING COATINGS; 6.0 VACUUM-BARING AND SEALING; REFERENCES; Chapter 8. Testing; 1.0 ELECTRICAL TESTING; 2.0 VISUAL INSPECTION; 3.0 NONDESTRUCTIVE SCREEN TESTS; 4.0 DESTRUCTIVE SCREEN TESTS; REFERENCES; Chapter 9. Handling and Clean Rooms; 1.0 HANDLING OF HYBRID CIRCUITS AND COMPONENTS 2.0 ELECTROSTATIC DISCHARGEREFERENCES; Chapter 10. Design Guidelines; 1.0 HYBRID MICROCIRCUIT DESIGN TRANSMITTAL; 2.0 SYSTEM REQUIREMENTS AFFECTING HYBRID CIRCUIT DESIGN; 3.0 MATERIAL AND PROCESS SELECTION; 4.0 QUALITY ASSURANCE PROVISIONS; 5.0 HYBRID DESIGN PROCESS; 6.0 SUBSTRATE PARASITICS; 7.0 THERMAL CONSIDERATIONS; 8.0 LAYOUT GUIDELINES COMMON TO BOTH THICK - AND THIN-FILM HYBRIDS; 9.0 GUIDE TO HIGH-PERFORMANCE HYBRID/MCM/PACKAGE DESIGN; 10.0 EQUATIONS; 11.0 CROSS-TALK; 12.0 SIGNAL LINE CAPACITANCE; 13.0 SIGNAL-LINE INDUCTANCE; 14.0 MICROSTRIP PROPAGATION DELAY 15.0 TYPICAL MATERIAL THICKNESSES16.0 THICK-FILM MATERIALS AND PROCESSES DESCRIPTION; 17.0 THICK-FILM DESIGN GUIDELINES; 18.0 THIN-FILM GUIDELINES; REFERENCES; Chapter 11. Documentation and Specifications; 1.0 DOCUMENTATION; 2.0 MILITARY AND GOVERNMENT SPECIFICATIONS; REFERENCES; Chapter 12. Failure Analysis; 1.0 TYPES AND CAUSES OF HYBRID FAILURES; 2.0 FAILURE ANALYSIS TECHNIQUES; 3.0 ANALYTICAL TECHNIQUES; 4.0 CAUSES OF HYBRID CIRCUIT FAILURES; 5.0 CASE HISTORIES OF HYBRID CIRCUIT FAILURES; REFERENCES; Chapter 13. Multichip Modules: A New Breed of Hybrid Microcircuits; 1.0 APPLICATIONS 2.0 INTERCONNECT SUBSTRATE DESIGNS AND FABRICATION METHODS |
| Record Nr. | UNINA-9911006866303321 |
Licari James J. <1930->
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| Westwood, N.J., : Noyes Publications, c1998 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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