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Biblioteca

MARC Lista (tabellare)
2837-2023 - IEEE Guide for Technical Requirements for Hybrid High-Voltage Direct Current Transmission Protection and Control Equipment / / IEEE
2837-2023 - IEEE Guide for Technical Requirements for Hybrid High-Voltage Direct Current Transmission Protection and Control Equipment / / IEEE
Pubbl/distr/stampa New York, USA : , : IEEE, , 2023
Descrizione fisica 1 online resource (37 pages)
Disciplina 621.3
Soggetto topico Hybrid integrated circuits
ISBN 1-5044-9986-7
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996551158303316
New York, USA : , : IEEE, , 2023
Materiale a stampa
Lo trovi qui: Univ. di Salerno
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Development of a qualification standard for adhesives used in hybrid microcircuits / / J.J. Licari, B.L. Weigand, and C.A. Soykin
Development of a qualification standard for adhesives used in hybrid microcircuits / / J.J. Licari, B.L. Weigand, and C.A. Soykin
Autore Licari James J. <1930->
Pubbl/distr/stampa [Huntsville], Ala. : , : National Aeronautics and Space Administration, George C. Marshall Space Flight Center, , [1981]
Descrizione fisica 1 online resource (viii, pages 109) : illustrations
Altri autori (Persone) WeigandB. L
SoykinC. A
Collana NASA contractor report
Soggetto topico Hybrid integrated circuits
Adhesion tests
Adhesives
Microelectronics
Procedures
Specifications
Standards
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910701479703321
Licari James J. <1930->  
[Huntsville], Ala. : , : National Aeronautics and Space Administration, George C. Marshall Space Flight Center, , [1981]
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Handbook of Thick- and Thin-Film Hybrid Microelectronics
Handbook of Thick- and Thin-Film Hybrid Microelectronics
Autore Gupta Tapan K
Pubbl/distr/stampa [Place of publication not identified], : Wiley Interscience Imprint, 2003
Descrizione fisica 1 online resource (419 pages)
Disciplina 621.381
Soggetto topico Hybrid integrated circuits
Thick-film circuits
Thin-film circuits
ISBN 1-280-55712-5
9786610557127
0-470-30791-9
0-471-72366-5
0-471-72367-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Preface -- 1 Introduction -- 1.1 Hybrid Microcircuit Family, -- 1.1.1 Printed Circuit Board, -- 1.1.2 Thick Film, -- 1.1.3 Thin Film, -- 1.1.4 Integrated Circuit, -- 1.1.5 Modules, -- 1.2 Need for Hybrid Microcircuits, -- 1.2.1 Multilayer Circuits, -- 1.2.2 Military Applications, -- 1.2.3 Data Processing, -- 1.2.4 Telecommunications, -- 1.2.5 Automotive Industry, -- 1.2.6 Medical Science, -- 1.2.7 Aerospace Systems, -- 1.2.8 High-Frequency Circuits, -- 1.3 Why Hybrid Microcircuits? -- 1.4 Applications of Hybrid Microcircuits, -- 1.4.1 Automotive Industry, -- 1.4.2 Commercial Products, -- 1.4.3 Medical Science, -- 1.4.4 Telecommunications, -- 1.4.5 Consumer Electronics, -- 1.4.6 Military Applications, -- 1.5 Typical Microelectronic Products, -- 1.5.1 Consumer Electronics, -- 1.5.2 Industrial Applications, -- 1.5.3 Military and Aerospace Applications, -- 1.5.4 Automotive Industry, -- 1.5.5 Microwave Engineering, -- 1.5.6 Multichip Modules, -- 1.6 Summary, -- References, -- Recommended Reading, -- 2 Mathematical Foundations, Circuit Design, and Layout Rules for Hybrid Microcircuits -- 2.1 Mathematical Foundations, -- 2.1.1 Factors Affecting the Value of a Resistor, -- 2.1.2 Mathematical Model for Thick-Film Deposition, -- 2.1.3 Theoretical Model for Screen-Printed Film Thickness, -- 2.1.4 Thick-Film Resistor Design, -- 2.1.5 Theoretical Model for Thin-Film Thickness, -- 2.1.6 Dissipation Factor or Dielectric Loss within a Dielectric Material, -- 2.1.7 Inductors, -- 2.1.8 Theoretical Model for Transport Properties during Hermetic Sealing, -- 2.2 Circuit Design and Layout Rules, -- 2.2.1 Hybrid Circuit Design Elements, -- 2.2.2 Thick-Film Hybrid Circuit Design, -- 2.2.3 Basic Rules for Laying Out Hybrid Microcircuits, -- References, -- Recommended Reading, -- 3 Computer-Aided Design and Pattern Generation Techniques -- 3.1 Computer-Aided Design Techniques, -- 3.1.1 S ze and Complexity of Hybrid Microcircuits, -- 3.1.2 CALMA Online Design Process, -- 3.1.3 Computer-Aided Engineering to Design Hybrid Microcircuits, -- 3.1.4 Circuit Layout Design, -- 3.2 Pattern Generation Techniques, -- 3.2.1 Additive Processes, -- 3.2.2 Subtractive Processes, -- 3.2.3 Photolithography, -- References, -- Recommended Reading, -- 4 Thick-Film Fundamentals -- 4.1 Thick-Film Substrates, -- 4.1.1 Substrate Materials, -- 4.1.2 Physical Properties, -- 4.1.3 Substrate Fabrication, -- 4.1.4 Electrical Properties, -- 4.1.5 Multilayer Technology Using LTCC, -- 4.2 Thick-Film Conductors, -- 4.2.1 Conduction in Metals, -- 4.2.2 Conductor Materials, -- 4.2.3 Conductor Pastes, -- 4.3 Thick-Film Resistors, -- 4.3.1 Physical Properties, -- 4.3.2 Resistor Characteristics, -- 4.4 Dielectric Inks and Pastes, -- 4.4.1 Low-K Dielectric Materials, -- 4.4.2 High-K Dielectric Materials, -- 4.5 Thick-Film Inductors, -- References, -- Recommended Reading, -- 5 Thick-Film Deposition Techniques -- 5.1 Thick-Film Processing, -- 5.2 Screen Printing, -- 5.2.1 Screen Printer, -- 5.2.2 Drying and Firing, -- References, -- Recommended Reading, -- 6 Thin-Film Fundamentals -- 180 -- 6.1 Thin-Film Substrates, -- 6.1.1 Substrate Materials, -- 6.2 Physical Characteristics, -- 6.2.1 Characteristics of Substrates, -- 6.2.2 Characteristics of Metals, -- 6.3 Thin-Film Conductors, -- 6.3.1 Conductor Materials and Properties, -- 6.4 Thin-Film Resistors, -- 6.4.1 Resistor Properties, -- 6.4.2 Resistor Materials, -- 6.5 Thin-Film Capacitors, -- 6.5.1 Capacitor Properties, -- 6.5.2 Capacitor Materials, -- 6.6 Thin-Film Inductors, -- 6.7 Technologies of the Twenty-First Century, -- References, -- Recommended Reading, -- 219 -- 7 Thin-Film Deposition Techniques -- 7.1 Physical Vapor Deposition, -- 7.1.1 Turbo Pump, -- 7.1.2 Cryogenic Pump, -- 7.2 Flash Evaporation, -- 7.3 Sputter ng, -- 7.4 Chemical Vapor Deposition, -- 7.5 Ion-Beam Deposition, -- 7.5.1 Ion-Beam Sputter Deposition, -- 7.5.2 Ion-Beam-Assisted Deposition, -- 7.6 Pulsed-Laser Deposition (Laser Ablation), -- 7.7 High-Density Plasma-Assisted Deposition, -- 7.8 Electroplating, -- 7.8.1 Electrode Electroplating, -- 7.8.2 Electroless Electroplating, -- 7.9 Sol-Gel Coating, -- 7.10 Atomic Layer Deposition, -- 7.11 Summary, -- References, -- Recommended Reading, -- 8 Component Assembly and Interconnections -- 8.1 Component Assembly, -- 8.1.1 S licon-Gold Eutectic Bonding, -- 8.1.2 Adhesive and Epoxy Bonding, -- 8.1.3 Solder Joint Bonding, -- 8.1.4 Solder Alloys, -- 8.1.5 Solder Reflow System, -- 8.1.6 Lead-Free Interconnects, -- 8.2 Interconnections, -- 8.2.1 Thermocompression Wire Bonding, -- 8.2.2 Thermosonic Wire Bonding, -- 8.2.3 Ultrasonic Wire Bonding, -- 8.2.4 Automated Single-Point Tape Automated Bonding, -- 8.2.5 Laser Wire Bonding, -- 8.2.6 Flip-Chip Bonding, -- References, -- Recommended Reading, -- 9 Adjustment of Passive Components -- 9.l Airbrasive Trimming, -- 9.2 Laser Trimming, -- 9.2.1 Carbon Dioxide Laser, -- 9.2.2 Yttrium-Aluminum-Garnet Laser, -- 9.3 Laser Trimming Systems, -- 9.3.1 Trimming Procedure, -- 9.3.2 Design Criteria for Resistor Trimming, -- 9.4 Definitions, -- References, -- Recommended Reading, -- 10 Packaging and Thermal Considerations -- 10.1 Packaging Materials, -- 10.2 Packaging Systems, -- 10.2.1 TO Packages, -- 10.2.2 Flat-Case Packages, -- 10.2.3 Chip Carriers, -- 10.2.4 Small-Outline Packages, -- 10.2.5 Systems on a Chip, -- 10.2.6 Chip-Scale Packages, -- 10.2.7 Wafer-Level Packaging, -- 10.2.8 Three-Dimensional Packaging, -- 10.3 Package Sealing, -- 10.4 Thermal Effects on Electronic Packaging, -- 10.4.1 Power Dissipation, -- 10.4.2 Thermal Design Calculations, -- 10.5 Non-Steady-State Heat Transfer Model, -- 10.5.1 Thermal Resistance inside the Substrate, -- 10.5.2 Natural Convection, -- 10.5.3 Thermal Radiation, -- 10.5.4 Thermal Resistance of Nitrogen Gas, -- 10.5.5 Heat Conduction inside the Kovar Shell, -- 10.6 Flip-Chip Technology, -- 10.7 Packaging Material Reliability, -- References, -- Recommended Reading, -- 11 Multichip Module and Microwave Hybrid Circuits -- 331 -- 11.1 Multichip Module Circuits, -- 11.1.1 Conductor Materials, -- 11.1.2 Summary, -- 11.2 Microwave Hybrid Circuits, -- 344 -- 11.2.1 Major Circuit Requirements, -- 11.2.2 Waveguides, -- 11.2.3 Transmission Lines, -- 11.2.4 Lumped Circuit Elements, -- 11.2.5 Directional Couplers, -- 11.2.6 Impedance Matching, -- 11.2.7 Microwave Integrated Circuits, -- 11.2.8 Dielectric Resonators, -- References, -- Glossary -- Index -- Index397 -- 1558608168 -- Foreword -- Acknowledgements -- Introduction -- PART I THE MODEL -- 1 Foundations -- 1.1 A Core Concept -- 1.1.1 Life Is a Document -- 1.1.2 Scripture -- 1.1.3 Other Forms of Documents -- 1.2 Linear Concepts -- 1.2.1 Sequence -- 1.2.2 Hierarchy -- 1.3 Nonlinear Concepts -- 1.3.1 Bags -- 1.3.2 Annotations -- 1.3.3 Cross-References -- 1.4 Document-Centric vs.
Data-Centric Content -- 1.5 Document Schemata -- 1.5.1 A First Schema -- 1.5.2 Choice -- 1.5.3 Recursion -- 1.6 Grammars -- 1.6.1 Formal Grammars -- 1.6.2 Backus-Naur-Form (BNF) -- 1.6.3 Regular Sets and Regular Expressions -- 1.6.4 Trees, Hedges, and Forests -- 1.7 Regular Types -- 1.7.1 Types as Regular Expressions -- 1.7.2 Basic Composition -- 1.7.3 Basic Type Algebra -- 1.7.4 Subtypes -- 1.7.5 Generic Types -- 1.7.6 Deterministic Types -- 2 Conceptual Modeling -- 2.1 Motivation -- 2.2 Principles of Conceptual Modeling -- 2.3 Entity Relationship Diagrams -- 2.4 Reality of Conceptual Modeling -- 2.5 Introducing Asset Oriented Modeling -- 2.5.1 AOM Basics -- 2.5.2 Assets -- 2.5.3 Arcs and Clusters -- 2.5.4 Properties -- 2.5.5 Types -- 2.5.6 Inheritance -- 2.5.7 Constraints -- 2.5.8 Level 2 Structures -- 2.5.9 Models and Namespaces -- 2.5.10 Summary -- 3 Everybody Likes jazz -- 3.1 Informal Description -- 3.2 The Conceptual Model, First Draft -- 3.3 Asset or Property? -- 3.3.1 The Jazz Model -- 3.4 Normalization -- 3.5 Partitioned Normal Form -- 3.6 Resolving is a Relationships -- 3.7 Introducing Level 2 Structures -- PART II THE IMPLEMENTATION -- 4 XML Basics -- 4.1 Namespaces -- 4.2 The XML Information Model -- 4.2.1 Overview -- 4.2.2 Document Node -- 4.2.3 Elements -- 4.2.4 Attributes -- 4.2.5 Processing Instructions -- 4.2.6 Unexpanded Entity Reference -- 4.2.7 Character -- 4.2.8 Comment -- 4.2.9 Document Type Declaration -- 4.2.10 Unparsed Entity -- 4.2.11 Notation -- 4.2.12 Namespace -- 4.2.13 An Example -- 4.3 XML Canonical Form -- 4.3.1 Canonical Text -- 4.3.2 Canonical Whitespace -- 4.3.3 Resolved References -- 4.3.4 Removal of Redundant Nodes -- 4.3.5 Canonical Elements -- 4.3.6 Canonical Attributes -- 4.3.7 Canonical Processing Instructions -- 4.3.8 Canonical Comments -- 4.4 The Document Type Definition (DTD) -- 4.4.1 Document -- 4.4.2 Elements -- 4.4.3 Attributes -- 4.4.4 Cross-References -- 4.4.5 Extension Mechanisms -- 4.4.6 Document Composition -- 4.4.7 Schema Composition and Reuse Mechanisms -- 4.4.8 DTD Deficiencies -- 5 XML Schema -- 5.1 An Appetizer -- 5.2 Simple Data Types -- 5.2.1 Value Space -- 5.2.2 Lexical Representations and Canonical Representation -- 5.2.3 Fundamental Facets -- 5.2.4 Built-in Primitive Data Types -- 5.2.5 Constructed Types -- 5.2.6 Extending Data Types by List -- 5.2.7 Restricted Data Types -- 5.2.8 Built-in Constructed Data Types -- 5.2.9 The Hierarchy of Built-in Primitive and Constructed Data Types -- 5.2.10 Union Types -- 5.2.11 User-Defined Data Types -- 5.3 Structure in XML Schema -- 5.3.1 Hierarchy -- 5.3.2 Elements and Complex Types -- 5.3.3 Particles and Model Groups -- 5.3.4 Cardinality Constraints -- 5.3.5 Default Values and Fixed Values -- 5.3.6 Mixed Content -- 5.3.7 Simple Content -- 5.3.8 Complex Content -- 5.3.9 Type Hierarchies -- 5.3.10 Empty Elements -- 5.3.11 Attributes -- 5.3.12 Global and Local Types -- 5.3.13 Global Elements and Attributes -- 5.3.14 Recursive Structures -- 5.3.15 Wildcards -- 5.3.16 Nullability -- 5.3.17 Uniqueness, Keys, Reference -- 5.3.18 Deterministic Types -- 6 Authoring XML Schema -- 6.1 Namespaces -- 6.1.1 Target Namespace -- 6.1.2 Qualified and Unqualified Names -- 6.1.3 Wildcards -- 6.1.4 Schema Default Namespace -- 6.2 Reuse Mechanisms -- 6.2.1 Global Elements and Global Types -- 6.2.2 Groups -- 6.2.3 Attribute Groups -- 6.2.4 Instance Type Overriding -- 6.2.5 Substitution Groups -- 6.3 Schema Composition -- 6.3.1 The Schema Clause -- 6.3.2 Locating Schemata -- 6.3.3 Include -- 6.3.4 Redefine -- 6.3.5 Import -- 6.3.6 Notation -- 6.3.7 Annotations -- 6.4 Usage Patterns -- 6.4.1 Chameleon Components and Type Libraries -- 6.4.2 Defining Schema Families -- 7 Relax NG -- 7.1 Structure -- 7.1.1 The Relax NG Data Model -- 7.1.2 Elements and Attributes -- 7.1.3 Model Groups and Particles -- 7.1.4 Empty and not Allowed -- 7.1.5 Annotations -- 7.1.6 Default and Fixed Values -- 7.2 Types, Grammars, Patterns 226 -- 7.2.1 Data Types in Relax NG -- 7.2.2 Grammars and Named Patterns -- 7.2.3 External Patterns and Grammars -- 7.2.4 Keys and Key References -- 7.3 Namespaces and Name Classes -- 7.3.1 Namespaces -- 7.3.2 Name Classes and Wildcards -- 7.3.3 Comparison with DTDs -- 7.3.4 Comparison with XML Schema -- 7.3.5 Tool Support for Relax NG -- 8 From Conceptual Model to Schema -- 8.1 A Knowledge Base -- 8.1.1 Jazz Musicians -- 8.1.2 Styles -- 8.1.3 Collaborations -- 8.1.4 Albums -- 8.1.5 Reviews -- 8.1.6 Critics -- 8.2 Implementation in XML Schema -- 8.2.1 Design Options -- 8.2.2 Business Objects -- 8.2.3 Creating a Type Library -- 8.2.4 Handling Inheritance -- 8.2.5 The Complete Type Library -- 8.2.6 Implementing a Business Object -- 8.2.7 Dealing with Cross-References -- 8.2.8 Using Substitution Groups -- 8.2.9 Implementing Clusters -- 8.2.10 Business Objects critic and style -- 8.3 Implementation in Relax NG -- 8.3.1 Creating a Type Library -- 8.3.2 Handling Inheritance -- 8.3.3 The Complete Type Library -- 8.3.4 Implementing a Business Object -- 8.3.5 Dealing with Cross-References -- 8.3.6 Resolving Multiple Display Labels -- 8.3.7 Implementing Clusters -- 8.3.8 Business Objects critic and style -- 8.4 Summary -- 8.4.1 Synopsis of Implementation Steps -- 8.4.2 Remarks -- 9 Validation beyond XML Schema -- 9.1 About Meaning -- 9.2 Constraints -- 9.2.1 Constraints in XML Schema -- 9.2.2 Constraints beyond XML Schema -- 9.3 Constraints in Conceptual Models -- 9.4 Validation of General Constraints -- 9.4.1 Hard-Coded Constraint Checks -- 9.4.2 XSLT -- 9.4.3 Schematron -- 9.5 An XML Processing Model -- 9.6 A Framework for Schema Languages -- PART III THE ENVIRONMENT -- 10 Reality Check: The World Is Object-Oriented -- 10.1 Object-Oriented Implementations of the XML Data Model -- 10.2 Encapsulation and Behavior -- 10.3 Class, Instance, Type -- 10.3.1 Class Hierarchies -- 10.3.2 Type Hierarchies Based on Behavior -- 10.3.3 Type Hierarchies Based on Syntax -- 10.3.4 Object-Oriented Types vs. XML Types -- 10.4 Simple Types -- 10.4.1 String Data Types -- 10.4.2 Binary Data Types -- 10.4.3 The Boolean Data Type -- 10.4.4 Exact Numeric Types -- 10.4.5 Approximate Numeric Types -- 10.4.6 Date and Time -- 10.4.7 Other Data Types -- 10.4.8 Type Restrictions -- 10.4.9 Type Extensions -- 10.4.10 Null Values -- 10.4.11 Implementing a Type Hierarchy -- 10.5 Complex Types -- 10.5.1 Hierarchy -- 10.5.2 Sequence -- 10.5.3 Repetition -- 10.5.4 Choice -- 10.5.5 Recursion -- 10.5.6 Global and Local Elements -- 10.6 Global Types -- 10.7 Inheritance -- 10.8 Polymorphism -- 10.9 Dynamic Marshaling -- 10.10 Constraints -- 10.10.1 Simple Types -- 10.10.2 Cross-References -- 10.10.3 When to Check -- 10.10.4 Conceptual Constraints -- 10.10.5 Automatic Code Generation -- 10.11 Identity -- 10.12 Visibility -- 11 Reality Check: The World Is Relational -- 11.1 Motivation -- 11.2 Databases -- 11.3 The Relational Data Model -- 11.4 The Relational Algebra -- 11.5 Normalization -- 11.5.1 Defining the Target Format -- 11.5.2 The Original Schema -- 11.5.3 Steamrolling the Schema -- 11.5.4 Introducing Key Relationships -- 11.5.5 Preserving Sequential Order -- 11.5.6 Recomposing Original Document Nodes -- 11.6 Brief Introduction to SQL -- 11.6.1 Queries -- 11.6.2 Table Creation -- 11.6.3 Table Modification -- 11.6.4 Views -- 11.6.5 SQL-99 -- 11.7 Simple Data Types -- 11.7.1 String Data Types -- 11.7.2 Binary Data Types -- 11.7.3 The Boolean Data Type -- 11.7.4 Exact Numeric Types -- 11.7.5 Approximate Numeric Types -- 11.7.6 Date and Time -- 11.7.7 Other Data Types -- 11.7.8 Type Restrictions -- 11.7.9 Type Extensions -- 11.7.10 Null Values -- 11.8 Complex Types -- 11.8.1 Hierarchy -- 11.8.2 Sequence -- 11.8.3 Choice -- 11.8.4 Recursion -- 11.9 Constraints -- 11.10 From Relational Tables to XML Schema -- 11.11 Mediation between RDBMS and XML Databases -- 11.11.1 Tamino X-Node -- 11.11.2 Experanto -- 12 Schema Evolution -- 12.1 Derived Types -- 12.1.1 Schema-Conservative Evolution -- 12.1.2 Using Chameleon Components -- 12.1.3 Creating Derived Schemata -- 12.1.4 Dialecting with Substitution Groups -- 12.1.5 Inhibiting Change -- 12.2 Authoring for Redefinition -- 12.2.1 Adding an Attribute to a Simple Type Element -- 12.2.2 Appending Child Nodes to Nested Structures -- 12.2.3 Inserting Elements at an Arbitrary Position -- 12.2.4 Allowing Choices -- 12.2.5 Conservative Schema Modification -- 12.3 Open Content Model -- 12.4 Versioning -- 13 Schemata in Large Environments -- 13.1 Combining
Diverse Schemata -- 13.1.1 The Problem -- 13.1.2 Model Fusion -- 13.1.3 Combining Document Instance Sets -- 13.1.4 Schema-Driven View Definition -- 13.1.5 Embedded Queries -- 13.1.6 Model-Driven Schema Mediation -- 13.2 Centralized and Decentralized Change Management -- 13.2.1 Decentralized Change Management of Document Instances -- 13.2.2 Decentralized Change Management of Document Schemata -- 14 Outlook -- 14.1 Integration of Core Technologies -- 14.2 Grammar-Driven Data Models -- 14.2.1 XML as a Mainstream Technology -- Appendix -- Glossary -- Bibliography -- Index -- About the Author.
Record Nr. UNINA-9910830324803321
Gupta Tapan K  
[Place of publication not identified], : Wiley Interscience Imprint, 2003
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Handbook of Thick- and Thin-Film Hybrid Microelectronics
Handbook of Thick- and Thin-Film Hybrid Microelectronics
Autore Gupta Tapan K
Pubbl/distr/stampa [Place of publication not identified], : Wiley Interscience Imprint, 2003
Descrizione fisica 1 online resource (419 pages)
Disciplina 621.381
Soggetto topico Hybrid integrated circuits
Thick-film circuits
Thin-film circuits
ISBN 1-280-55712-5
9786610557127
0-470-30791-9
0-471-72366-5
0-471-72367-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Preface -- 1 Introduction -- 1.1 Hybrid Microcircuit Family, -- 1.1.1 Printed Circuit Board, -- 1.1.2 Thick Film, -- 1.1.3 Thin Film, -- 1.1.4 Integrated Circuit, -- 1.1.5 Modules, -- 1.2 Need for Hybrid Microcircuits, -- 1.2.1 Multilayer Circuits, -- 1.2.2 Military Applications, -- 1.2.3 Data Processing, -- 1.2.4 Telecommunications, -- 1.2.5 Automotive Industry, -- 1.2.6 Medical Science, -- 1.2.7 Aerospace Systems, -- 1.2.8 High-Frequency Circuits, -- 1.3 Why Hybrid Microcircuits? -- 1.4 Applications of Hybrid Microcircuits, -- 1.4.1 Automotive Industry, -- 1.4.2 Commercial Products, -- 1.4.3 Medical Science, -- 1.4.4 Telecommunications, -- 1.4.5 Consumer Electronics, -- 1.4.6 Military Applications, -- 1.5 Typical Microelectronic Products, -- 1.5.1 Consumer Electronics, -- 1.5.2 Industrial Applications, -- 1.5.3 Military and Aerospace Applications, -- 1.5.4 Automotive Industry, -- 1.5.5 Microwave Engineering, -- 1.5.6 Multichip Modules, -- 1.6 Summary, -- References, -- Recommended Reading, -- 2 Mathematical Foundations, Circuit Design, and Layout Rules for Hybrid Microcircuits -- 2.1 Mathematical Foundations, -- 2.1.1 Factors Affecting the Value of a Resistor, -- 2.1.2 Mathematical Model for Thick-Film Deposition, -- 2.1.3 Theoretical Model for Screen-Printed Film Thickness, -- 2.1.4 Thick-Film Resistor Design, -- 2.1.5 Theoretical Model for Thin-Film Thickness, -- 2.1.6 Dissipation Factor or Dielectric Loss within a Dielectric Material, -- 2.1.7 Inductors, -- 2.1.8 Theoretical Model for Transport Properties during Hermetic Sealing, -- 2.2 Circuit Design and Layout Rules, -- 2.2.1 Hybrid Circuit Design Elements, -- 2.2.2 Thick-Film Hybrid Circuit Design, -- 2.2.3 Basic Rules for Laying Out Hybrid Microcircuits, -- References, -- Recommended Reading, -- 3 Computer-Aided Design and Pattern Generation Techniques -- 3.1 Computer-Aided Design Techniques, -- 3.1.1 S ze and Complexity of Hybrid Microcircuits, -- 3.1.2 CALMA Online Design Process, -- 3.1.3 Computer-Aided Engineering to Design Hybrid Microcircuits, -- 3.1.4 Circuit Layout Design, -- 3.2 Pattern Generation Techniques, -- 3.2.1 Additive Processes, -- 3.2.2 Subtractive Processes, -- 3.2.3 Photolithography, -- References, -- Recommended Reading, -- 4 Thick-Film Fundamentals -- 4.1 Thick-Film Substrates, -- 4.1.1 Substrate Materials, -- 4.1.2 Physical Properties, -- 4.1.3 Substrate Fabrication, -- 4.1.4 Electrical Properties, -- 4.1.5 Multilayer Technology Using LTCC, -- 4.2 Thick-Film Conductors, -- 4.2.1 Conduction in Metals, -- 4.2.2 Conductor Materials, -- 4.2.3 Conductor Pastes, -- 4.3 Thick-Film Resistors, -- 4.3.1 Physical Properties, -- 4.3.2 Resistor Characteristics, -- 4.4 Dielectric Inks and Pastes, -- 4.4.1 Low-K Dielectric Materials, -- 4.4.2 High-K Dielectric Materials, -- 4.5 Thick-Film Inductors, -- References, -- Recommended Reading, -- 5 Thick-Film Deposition Techniques -- 5.1 Thick-Film Processing, -- 5.2 Screen Printing, -- 5.2.1 Screen Printer, -- 5.2.2 Drying and Firing, -- References, -- Recommended Reading, -- 6 Thin-Film Fundamentals -- 180 -- 6.1 Thin-Film Substrates, -- 6.1.1 Substrate Materials, -- 6.2 Physical Characteristics, -- 6.2.1 Characteristics of Substrates, -- 6.2.2 Characteristics of Metals, -- 6.3 Thin-Film Conductors, -- 6.3.1 Conductor Materials and Properties, -- 6.4 Thin-Film Resistors, -- 6.4.1 Resistor Properties, -- 6.4.2 Resistor Materials, -- 6.5 Thin-Film Capacitors, -- 6.5.1 Capacitor Properties, -- 6.5.2 Capacitor Materials, -- 6.6 Thin-Film Inductors, -- 6.7 Technologies of the Twenty-First Century, -- References, -- Recommended Reading, -- 219 -- 7 Thin-Film Deposition Techniques -- 7.1 Physical Vapor Deposition, -- 7.1.1 Turbo Pump, -- 7.1.2 Cryogenic Pump, -- 7.2 Flash Evaporation, -- 7.3 Sputter ng, -- 7.4 Chemical Vapor Deposition, -- 7.5 Ion-Beam Deposition, -- 7.5.1 Ion-Beam Sputter Deposition, -- 7.5.2 Ion-Beam-Assisted Deposition, -- 7.6 Pulsed-Laser Deposition (Laser Ablation), -- 7.7 High-Density Plasma-Assisted Deposition, -- 7.8 Electroplating, -- 7.8.1 Electrode Electroplating, -- 7.8.2 Electroless Electroplating, -- 7.9 Sol-Gel Coating, -- 7.10 Atomic Layer Deposition, -- 7.11 Summary, -- References, -- Recommended Reading, -- 8 Component Assembly and Interconnections -- 8.1 Component Assembly, -- 8.1.1 S licon-Gold Eutectic Bonding, -- 8.1.2 Adhesive and Epoxy Bonding, -- 8.1.3 Solder Joint Bonding, -- 8.1.4 Solder Alloys, -- 8.1.5 Solder Reflow System, -- 8.1.6 Lead-Free Interconnects, -- 8.2 Interconnections, -- 8.2.1 Thermocompression Wire Bonding, -- 8.2.2 Thermosonic Wire Bonding, -- 8.2.3 Ultrasonic Wire Bonding, -- 8.2.4 Automated Single-Point Tape Automated Bonding, -- 8.2.5 Laser Wire Bonding, -- 8.2.6 Flip-Chip Bonding, -- References, -- Recommended Reading, -- 9 Adjustment of Passive Components -- 9.l Airbrasive Trimming, -- 9.2 Laser Trimming, -- 9.2.1 Carbon Dioxide Laser, -- 9.2.2 Yttrium-Aluminum-Garnet Laser, -- 9.3 Laser Trimming Systems, -- 9.3.1 Trimming Procedure, -- 9.3.2 Design Criteria for Resistor Trimming, -- 9.4 Definitions, -- References, -- Recommended Reading, -- 10 Packaging and Thermal Considerations -- 10.1 Packaging Materials, -- 10.2 Packaging Systems, -- 10.2.1 TO Packages, -- 10.2.2 Flat-Case Packages, -- 10.2.3 Chip Carriers, -- 10.2.4 Small-Outline Packages, -- 10.2.5 Systems on a Chip, -- 10.2.6 Chip-Scale Packages, -- 10.2.7 Wafer-Level Packaging, -- 10.2.8 Three-Dimensional Packaging, -- 10.3 Package Sealing, -- 10.4 Thermal Effects on Electronic Packaging, -- 10.4.1 Power Dissipation, -- 10.4.2 Thermal Design Calculations, -- 10.5 Non-Steady-State Heat Transfer Model, -- 10.5.1 Thermal Resistance inside the Substrate, -- 10.5.2 Natural Convection, -- 10.5.3 Thermal Radiation, -- 10.5.4 Thermal Resistance of Nitrogen Gas, -- 10.5.5 Heat Conduction inside the Kovar Shell, -- 10.6 Flip-Chip Technology, -- 10.7 Packaging Material Reliability, -- References, -- Recommended Reading, -- 11 Multichip Module and Microwave Hybrid Circuits -- 331 -- 11.1 Multichip Module Circuits, -- 11.1.1 Conductor Materials, -- 11.1.2 Summary, -- 11.2 Microwave Hybrid Circuits, -- 344 -- 11.2.1 Major Circuit Requirements, -- 11.2.2 Waveguides, -- 11.2.3 Transmission Lines, -- 11.2.4 Lumped Circuit Elements, -- 11.2.5 Directional Couplers, -- 11.2.6 Impedance Matching, -- 11.2.7 Microwave Integrated Circuits, -- 11.2.8 Dielectric Resonators, -- References, -- Glossary -- Index -- Index397 -- 1558608168 -- Foreword -- Acknowledgements -- Introduction -- PART I THE MODEL -- 1 Foundations -- 1.1 A Core Concept -- 1.1.1 Life Is a Document -- 1.1.2 Scripture -- 1.1.3 Other Forms of Documents -- 1.2 Linear Concepts -- 1.2.1 Sequence -- 1.2.2 Hierarchy -- 1.3 Nonlinear Concepts -- 1.3.1 Bags -- 1.3.2 Annotations -- 1.3.3 Cross-References -- 1.4 Document-Centric vs.
Data-Centric Content -- 1.5 Document Schemata -- 1.5.1 A First Schema -- 1.5.2 Choice -- 1.5.3 Recursion -- 1.6 Grammars -- 1.6.1 Formal Grammars -- 1.6.2 Backus-Naur-Form (BNF) -- 1.6.3 Regular Sets and Regular Expressions -- 1.6.4 Trees, Hedges, and Forests -- 1.7 Regular Types -- 1.7.1 Types as Regular Expressions -- 1.7.2 Basic Composition -- 1.7.3 Basic Type Algebra -- 1.7.4 Subtypes -- 1.7.5 Generic Types -- 1.7.6 Deterministic Types -- 2 Conceptual Modeling -- 2.1 Motivation -- 2.2 Principles of Conceptual Modeling -- 2.3 Entity Relationship Diagrams -- 2.4 Reality of Conceptual Modeling -- 2.5 Introducing Asset Oriented Modeling -- 2.5.1 AOM Basics -- 2.5.2 Assets -- 2.5.3 Arcs and Clusters -- 2.5.4 Properties -- 2.5.5 Types -- 2.5.6 Inheritance -- 2.5.7 Constraints -- 2.5.8 Level 2 Structures -- 2.5.9 Models and Namespaces -- 2.5.10 Summary -- 3 Everybody Likes jazz -- 3.1 Informal Description -- 3.2 The Conceptual Model, First Draft -- 3.3 Asset or Property? -- 3.3.1 The Jazz Model -- 3.4 Normalization -- 3.5 Partitioned Normal Form -- 3.6 Resolving is a Relationships -- 3.7 Introducing Level 2 Structures -- PART II THE IMPLEMENTATION -- 4 XML Basics -- 4.1 Namespaces -- 4.2 The XML Information Model -- 4.2.1 Overview -- 4.2.2 Document Node -- 4.2.3 Elements -- 4.2.4 Attributes -- 4.2.5 Processing Instructions -- 4.2.6 Unexpanded Entity Reference -- 4.2.7 Character -- 4.2.8 Comment -- 4.2.9 Document Type Declaration -- 4.2.10 Unparsed Entity -- 4.2.11 Notation -- 4.2.12 Namespace -- 4.2.13 An Example -- 4.3 XML Canonical Form -- 4.3.1 Canonical Text -- 4.3.2 Canonical Whitespace -- 4.3.3 Resolved References -- 4.3.4 Removal of Redundant Nodes -- 4.3.5 Canonical Elements -- 4.3.6 Canonical Attributes -- 4.3.7 Canonical Processing Instructions -- 4.3.8 Canonical Comments -- 4.4 The Document Type Definition (DTD) -- 4.4.1 Document -- 4.4.2 Elements -- 4.4.3 Attributes -- 4.4.4 Cross-References -- 4.4.5 Extension Mechanisms -- 4.4.6 Document Composition -- 4.4.7 Schema Composition and Reuse Mechanisms -- 4.4.8 DTD Deficiencies -- 5 XML Schema -- 5.1 An Appetizer -- 5.2 Simple Data Types -- 5.2.1 Value Space -- 5.2.2 Lexical Representations and Canonical Representation -- 5.2.3 Fundamental Facets -- 5.2.4 Built-in Primitive Data Types -- 5.2.5 Constructed Types -- 5.2.6 Extending Data Types by List -- 5.2.7 Restricted Data Types -- 5.2.8 Built-in Constructed Data Types -- 5.2.9 The Hierarchy of Built-in Primitive and Constructed Data Types -- 5.2.10 Union Types -- 5.2.11 User-Defined Data Types -- 5.3 Structure in XML Schema -- 5.3.1 Hierarchy -- 5.3.2 Elements and Complex Types -- 5.3.3 Particles and Model Groups -- 5.3.4 Cardinality Constraints -- 5.3.5 Default Values and Fixed Values -- 5.3.6 Mixed Content -- 5.3.7 Simple Content -- 5.3.8 Complex Content -- 5.3.9 Type Hierarchies -- 5.3.10 Empty Elements -- 5.3.11 Attributes -- 5.3.12 Global and Local Types -- 5.3.13 Global Elements and Attributes -- 5.3.14 Recursive Structures -- 5.3.15 Wildcards -- 5.3.16 Nullability -- 5.3.17 Uniqueness, Keys, Reference -- 5.3.18 Deterministic Types -- 6 Authoring XML Schema -- 6.1 Namespaces -- 6.1.1 Target Namespace -- 6.1.2 Qualified and Unqualified Names -- 6.1.3 Wildcards -- 6.1.4 Schema Default Namespace -- 6.2 Reuse Mechanisms -- 6.2.1 Global Elements and Global Types -- 6.2.2 Groups -- 6.2.3 Attribute Groups -- 6.2.4 Instance Type Overriding -- 6.2.5 Substitution Groups -- 6.3 Schema Composition -- 6.3.1 The Schema Clause -- 6.3.2 Locating Schemata -- 6.3.3 Include -- 6.3.4 Redefine -- 6.3.5 Import -- 6.3.6 Notation -- 6.3.7 Annotations -- 6.4 Usage Patterns -- 6.4.1 Chameleon Components and Type Libraries -- 6.4.2 Defining Schema Families -- 7 Relax NG -- 7.1 Structure -- 7.1.1 The Relax NG Data Model -- 7.1.2 Elements and Attributes -- 7.1.3 Model Groups and Particles -- 7.1.4 Empty and not Allowed -- 7.1.5 Annotations -- 7.1.6 Default and Fixed Values -- 7.2 Types, Grammars, Patterns 226 -- 7.2.1 Data Types in Relax NG -- 7.2.2 Grammars and Named Patterns -- 7.2.3 External Patterns and Grammars -- 7.2.4 Keys and Key References -- 7.3 Namespaces and Name Classes -- 7.3.1 Namespaces -- 7.3.2 Name Classes and Wildcards -- 7.3.3 Comparison with DTDs -- 7.3.4 Comparison with XML Schema -- 7.3.5 Tool Support for Relax NG -- 8 From Conceptual Model to Schema -- 8.1 A Knowledge Base -- 8.1.1 Jazz Musicians -- 8.1.2 Styles -- 8.1.3 Collaborations -- 8.1.4 Albums -- 8.1.5 Reviews -- 8.1.6 Critics -- 8.2 Implementation in XML Schema -- 8.2.1 Design Options -- 8.2.2 Business Objects -- 8.2.3 Creating a Type Library -- 8.2.4 Handling Inheritance -- 8.2.5 The Complete Type Library -- 8.2.6 Implementing a Business Object -- 8.2.7 Dealing with Cross-References -- 8.2.8 Using Substitution Groups -- 8.2.9 Implementing Clusters -- 8.2.10 Business Objects critic and style -- 8.3 Implementation in Relax NG -- 8.3.1 Creating a Type Library -- 8.3.2 Handling Inheritance -- 8.3.3 The Complete Type Library -- 8.3.4 Implementing a Business Object -- 8.3.5 Dealing with Cross-References -- 8.3.6 Resolving Multiple Display Labels -- 8.3.7 Implementing Clusters -- 8.3.8 Business Objects critic and style -- 8.4 Summary -- 8.4.1 Synopsis of Implementation Steps -- 8.4.2 Remarks -- 9 Validation beyond XML Schema -- 9.1 About Meaning -- 9.2 Constraints -- 9.2.1 Constraints in XML Schema -- 9.2.2 Constraints beyond XML Schema -- 9.3 Constraints in Conceptual Models -- 9.4 Validation of General Constraints -- 9.4.1 Hard-Coded Constraint Checks -- 9.4.2 XSLT -- 9.4.3 Schematron -- 9.5 An XML Processing Model -- 9.6 A Framework for Schema Languages -- PART III THE ENVIRONMENT -- 10 Reality Check: The World Is Object-Oriented -- 10.1 Object-Oriented Implementations of the XML Data Model -- 10.2 Encapsulation and Behavior -- 10.3 Class, Instance, Type -- 10.3.1 Class Hierarchies -- 10.3.2 Type Hierarchies Based on Behavior -- 10.3.3 Type Hierarchies Based on Syntax -- 10.3.4 Object-Oriented Types vs. XML Types -- 10.4 Simple Types -- 10.4.1 String Data Types -- 10.4.2 Binary Data Types -- 10.4.3 The Boolean Data Type -- 10.4.4 Exact Numeric Types -- 10.4.5 Approximate Numeric Types -- 10.4.6 Date and Time -- 10.4.7 Other Data Types -- 10.4.8 Type Restrictions -- 10.4.9 Type Extensions -- 10.4.10 Null Values -- 10.4.11 Implementing a Type Hierarchy -- 10.5 Complex Types -- 10.5.1 Hierarchy -- 10.5.2 Sequence -- 10.5.3 Repetition -- 10.5.4 Choice -- 10.5.5 Recursion -- 10.5.6 Global and Local Elements -- 10.6 Global Types -- 10.7 Inheritance -- 10.8 Polymorphism -- 10.9 Dynamic Marshaling -- 10.10 Constraints -- 10.10.1 Simple Types -- 10.10.2 Cross-References -- 10.10.3 When to Check -- 10.10.4 Conceptual Constraints -- 10.10.5 Automatic Code Generation -- 10.11 Identity -- 10.12 Visibility -- 11 Reality Check: The World Is Relational -- 11.1 Motivation -- 11.2 Databases -- 11.3 The Relational Data Model -- 11.4 The Relational Algebra -- 11.5 Normalization -- 11.5.1 Defining the Target Format -- 11.5.2 The Original Schema -- 11.5.3 Steamrolling the Schema -- 11.5.4 Introducing Key Relationships -- 11.5.5 Preserving Sequential Order -- 11.5.6 Recomposing Original Document Nodes -- 11.6 Brief Introduction to SQL -- 11.6.1 Queries -- 11.6.2 Table Creation -- 11.6.3 Table Modification -- 11.6.4 Views -- 11.6.5 SQL-99 -- 11.7 Simple Data Types -- 11.7.1 String Data Types -- 11.7.2 Binary Data Types -- 11.7.3 The Boolean Data Type -- 11.7.4 Exact Numeric Types -- 11.7.5 Approximate Numeric Types -- 11.7.6 Date and Time -- 11.7.7 Other Data Types -- 11.7.8 Type Restrictions -- 11.7.9 Type Extensions -- 11.7.10 Null Values -- 11.8 Complex Types -- 11.8.1 Hierarchy -- 11.8.2 Sequence -- 11.8.3 Choice -- 11.8.4 Recursion -- 11.9 Constraints -- 11.10 From Relational Tables to XML Schema -- 11.11 Mediation between RDBMS and XML Databases -- 11.11.1 Tamino X-Node -- 11.11.2 Experanto -- 12 Schema Evolution -- 12.1 Derived Types -- 12.1.1 Schema-Conservative Evolution -- 12.1.2 Using Chameleon Components -- 12.1.3 Creating Derived Schemata -- 12.1.4 Dialecting with Substitution Groups -- 12.1.5 Inhibiting Change -- 12.2 Authoring for Redefinition -- 12.2.1 Adding an Attribute to a Simple Type Element -- 12.2.2 Appending Child Nodes to Nested Structures -- 12.2.3 Inserting Elements at an Arbitrary Position -- 12.2.4 Allowing Choices -- 12.2.5 Conservative Schema Modification -- 12.3 Open Content Model -- 12.4 Versioning -- 13 Schemata in Large Environments -- 13.1 Combining
Diverse Schemata -- 13.1.1 The Problem -- 13.1.2 Model Fusion -- 13.1.3 Combining Document Instance Sets -- 13.1.4 Schema-Driven View Definition -- 13.1.5 Embedded Queries -- 13.1.6 Model-Driven Schema Mediation -- 13.2 Centralized and Decentralized Change Management -- 13.2.1 Decentralized Change Management of Document Instances -- 13.2.2 Decentralized Change Management of Document Schemata -- 14 Outlook -- 14.1 Integration of Core Technologies -- 14.2 Grammar-Driven Data Models -- 14.2.1 XML as a Mainstream Technology -- Appendix -- Glossary -- Bibliography -- Index -- About the Author.
Record Nr. UNINA-9911019501703321
Gupta Tapan K  
[Place of publication not identified], : Wiley Interscience Imprint, 2003
Materiale a stampa
Lo trovi qui: Univ. Federico II
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IMAPS-CMPT Poland 2015 / / guest editor Agata Skwarek
IMAPS-CMPT Poland 2015 / / guest editor Agata Skwarek
Pubbl/distr/stampa Bradford, England : , : Emerald Group Publishing Limited, , 2016
Descrizione fisica 1 online resource (65 pages) : illustrations, tables, graphs, charts
Disciplina 621.381
Collana Microelectronics International
Soggetto topico Microelectronics
Hybrid integrated circuits
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910798737603321
Bradford, England : , : Emerald Group Publishing Limited, , 2016
Materiale a stampa
Lo trovi qui: Univ. Federico II
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IMAPS-CMPT Poland 2015 / / guest editor Agata Skwarek
IMAPS-CMPT Poland 2015 / / guest editor Agata Skwarek
Pubbl/distr/stampa Bradford, England : , : Emerald Group Publishing Limited, , 2016
Descrizione fisica 1 online resource (65 pages) : illustrations, tables, graphs, charts
Disciplina 621.381
Collana Microelectronics International
Soggetto topico Microelectronics
Hybrid integrated circuits
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910821015003321
Bradford, England : , : Emerald Group Publishing Limited, , 2016
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Linear integrated networks : fundamentals / [by] George S. Moschytz
Linear integrated networks : fundamentals / [by] George S. Moschytz
Autore Moschytz, George S.
Pubbl/distr/stampa New York : Van Nostrand Reinhold Co., 1974
Descrizione fisica xvii, 583 p. : ill. ; 23 cm.
Collana Bell Laboratories series
Soggetto topico Hybrid integrated circuits
ISBN 0442255810
Classificazione 621.3.1
621.3.2.5
621.381'71
TK7874.M5345
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISALENTO-991001059049707536
Moschytz, George S.  
New York : Van Nostrand Reinhold Co., 1974
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Microelectronics international : journal of ISHM--Europe, the Microelectronics Society--Europe
Microelectronics international : journal of ISHM--Europe, the Microelectronics Society--Europe
Pubbl/distr/stampa Isle of Man, : Wela Publications, ©1995-
Descrizione fisica 1 online resource
Disciplina 621.381
Soggetto topico Microelectronics
Hybrid integrated circuits
Semiconductors
Electronic packaging
Soggetto genere / forma Periodicals.
ISSN 1758-812X
Formato Materiale a stampa
Livello bibliografico Periodico
Lingua di pubblicazione eng
Record Nr. UNISA-996398436203316
Isle of Man, : Wela Publications, ©1995-
Materiale a stampa
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Microelectronics international
Microelectronics international
Pubbl/distr/stampa Bradford, England, : MCB University Press
Descrizione fisica 1 online resource
Disciplina 621.381
Soggetto topico Microelectronics
Hybrid integrated circuits
Semiconductors
Electronic packaging
Soggetto genere / forma Periodicals.
ISSN 1758-812X
Formato Materiale a stampa
Livello bibliografico Periodico
Lingua di pubblicazione eng
Record Nr. UNINA-9910139429403321
Bradford, England, : MCB University Press
Materiale a stampa
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