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2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) / / Institute of Electrical and Electronics Engineers
| 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : IEEE, , 2017 |
| Descrizione fisica | 1 online resource |
| Disciplina | 621.381 |
| Soggetto topico |
Electronic apparatus and appliances - Thermal properties
Heat sinks (Electronics) |
| ISBN | 1-5090-2994-X |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems |
| Record Nr. | UNISA-996278302003316 |
| Piscataway, New Jersey : , : IEEE, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) / / Institute of Electrical and Electronics Engineers
| 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : IEEE, , 2017 |
| Descrizione fisica | 1 online resource |
| Disciplina | 621.381 |
| Soggetto topico |
Electronic apparatus and appliances - Thermal properties
Heat sinks (Electronics) |
| ISBN | 1-5090-2994-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems |
| Record Nr. | UNINA-9910213055003321 |
| Piscataway, New Jersey : , : IEEE, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Analysis of ultimate-heat-sink spray ponds / / R. Codell
| Analysis of ultimate-heat-sink spray ponds / / R. Codell |
| Autore | Codell R (Richard) |
| Pubbl/distr/stampa | Washington, D.C. : , : Division of Engineering, Office of Nuclear Reactor Regulation, U.S. Nuclear Regulatory Commission, , August 1981 |
| Descrizione fisica | 1 online resource (various pagings) : illustrations |
| Soggetto topico |
Heat sinks (Electronics)
Cooling ponds - Measurement - Computer programs Evaporation (Meteorology) - Computer programs Cooling ponds - Climatic factors |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | Analysis of ultimate heat sink spray ponds |
| Record Nr. | UNINA-9910705604203321 |
Codell R (Richard)
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| Washington, D.C. : , : Division of Engineering, Office of Nuclear Reactor Regulation, U.S. Nuclear Regulatory Commission, , August 1981 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Defective heat sink adhesive and seismically induced chatter in relays within printed circuit cards
| Defective heat sink adhesive and seismically induced chatter in relays within printed circuit cards |
| Pubbl/distr/stampa | Washington, D.C. : , : United States Nuclear Regulatory Commission, Office of Inspection and Enforcement, , 1983 |
| Descrizione fisica | 1 online resource |
| Collana | Information notice |
| Soggetto topico |
Heat sinks (Electronics) - Defects
Electric relays Smart cards Heat sinks (Electronics) |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910713950403321 |
| Washington, D.C. : , : United States Nuclear Regulatory Commission, Office of Inspection and Enforcement, , 1983 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Flow boiling in microgap channels : experiment, visualization and analysis / / Tamanna Alam, Poh Seng Lee, Li-Wen Jin
| Flow boiling in microgap channels : experiment, visualization and analysis / / Tamanna Alam, Poh Seng Lee, Li-Wen Jin |
| Autore | Alam Tamanna |
| Edizione | [1st ed. 2014.] |
| Pubbl/distr/stampa | New York, : Springer, 2014 |
| Descrizione fisica | 1 online resource (xi, 84 pages) : illustrations (some color) |
| Disciplina | 621.4021 |
| Altri autori (Persone) |
LeePoh Seng
JinLi-Wen |
| Collana | SpringerBriefs in applied sciences and technology : thermal engineering and applied science |
| Soggetto topico |
Electronic apparatus and appliances - Thermal properties
Electronic apparatus and appliances - Protection Heat sinks (Electronics) Electronic packaging System failures (Engineering) - Prevention |
| ISBN | 1-4614-7190-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction -- Design and Operating Parameters -- Characteristics of Two-Phase Flow Boiling in Microgap Channel -- Comparison of Flow Boiling Characteristics between Microgap and Microchannel -- Optimization of Microgap Channel Dimension and Operating Condition -- Surface Roughness Effect on Microgap Channel -- Two-Phase Microgap Channel in Mitigating Flow Instabilities and Flow Reversal -- Two-Phase Microgap Channel Cooling Technology for Hotspots Mitigation -- Conclusions and Recommendations -- Appendix A: Uncertainty Analysis for Experimental Data -- Appendix B: Nomenclature -- Appendix C: Data Reduction. |
| Record Nr. | UNINA-9910299751903321 |
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Alam Tamanna
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| New York, : Springer, 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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ITHERM 2006 : Thermal and Thermomechanical proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006 : May 30, 2006-June 2, 2006
| ITHERM 2006 : Thermal and Thermomechanical proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006 : May 30, 2006-June 2, 2006 |
| Pubbl/distr/stampa | New York : , : IEEE, , 2006 |
| Descrizione fisica | 1 online resource (200 pages) |
| Soggetto topico |
Electronic apparatus and appliances - Thermal properties
Heat sinks (Electronics) Ball grid array technology |
| ISBN | 1-5090-9087-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996207512903316 |
| New York : , : IEEE, , 2006 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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ITHERM 2006 : Thermal and Thermomechanical proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006 : May 30, 2006-June 2, 2006
| ITHERM 2006 : Thermal and Thermomechanical proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006 : May 30, 2006-June 2, 2006 |
| Pubbl/distr/stampa | New York : , : IEEE, , 2006 |
| Descrizione fisica | 1 online resource (200 pages) |
| Soggetto topico |
Electronic apparatus and appliances - Thermal properties
Heat sinks (Electronics) Ball grid array technology |
| ISBN | 1-5090-9087-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910145608403321 |
| New York : , : IEEE, , 2006 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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ITherm 2018 : proceedings of the seventeenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems : May 29 - June 1, 2018, Sharaton Harbor Island Hotel, San Diego, CA USA / / Institute of Electrical and Electronics Engineers
| ITherm 2018 : proceedings of the seventeenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems : May 29 - June 1, 2018, Sharaton Harbor Island Hotel, San Diego, CA USA / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (603 pages) |
| Disciplina | 621.381 |
| Soggetto topico |
Electronic apparatus and appliances - Thermal properties
Heat sinks (Electronics) |
| ISBN | 1-5386-1272-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996279585803316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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ITherm 2018 : proceedings of the seventeenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems : May 29 - June 1, 2018, Sharaton Harbor Island Hotel, San Diego, CA USA / / Institute of Electrical and Electronics Engineers
| ITherm 2018 : proceedings of the seventeenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems : May 29 - June 1, 2018, Sharaton Harbor Island Hotel, San Diego, CA USA / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (603 pages) |
| Disciplina | 621.381 |
| Soggetto topico |
Electronic apparatus and appliances - Thermal properties
Heat sinks (Electronics) |
| ISBN | 1-5386-1272-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910282259003321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Potential loss of direct access to ultimate heat sink
| Potential loss of direct access to ultimate heat sink |
| Pubbl/distr/stampa | Washington, D.C. : , : United States Nuclear Regulatory Commission, Office of Inspection and Enforcement, , 1981 |
| Descrizione fisica | 1 online resource (3 pages) |
| Collana | Information notice |
| Soggetto topico |
Feed-water
Marine debris Heat sinks (Electronics) |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910713400303321 |
| Washington, D.C. : , : United States Nuclear Regulatory Commission, Office of Inspection and Enforcement, , 1981 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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