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Advances in abrasive technology XVII : selected, peer reviewed papers from the 17th International Symposium on Advances in Abrasive Technology (ISAAT 2014), September 22-25, 2014, Hawaii, USA / / edited by Akinori Yui, Jiwang Yan and Hideki Aoyama
| Advances in abrasive technology XVII : selected, peer reviewed papers from the 17th International Symposium on Advances in Abrasive Technology (ISAAT 2014), September 22-25, 2014, Hawaii, USA / / edited by Akinori Yui, Jiwang Yan and Hideki Aoyama |
| Pubbl/distr/stampa | Pfaffikon, Switzerland : , : TTP, , 2014 |
| Descrizione fisica | 1 online resource (837 p.) |
| Disciplina | 621.92 |
| Collana | Advanced Materials Research |
| Soggetto topico |
Abrasives
Grinding and polishing |
| Soggetto genere / forma | Electronic books. |
| ISBN | 3-03826-604-3 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Advances in Abrasive Technology XVII; Preface, Committees and Sponsors; Table of Contents; Chapter 1: Abrasive Machining; On the Profile and Microstructure Variations of Grinding-Induced Hardening Layer in A Cylindrical Workpiece; Study on Grinding Force Distribution on Cup Type Electroplated Diamond Wheel in Face Grinding of Cemented Carbide; Investigations on Belt Grinding of GH4169 Nickel-Based Superalloy; Basic Study on High Efficiency Ultra-Precision Grinding of the Optical Glass Lens; Studies on Grinding Conditions Affecting the Quality of Soft Magnetic Powder Cores
Effect of Coolant Supplied through Grinding Wheel on Residual Stress of Grinding SurfaceMulti-Hole Drilling Method by Abrasive Blasting for CFRP and Composite Materials: Investigation of a Processing Model Based on Abrasive Erosion Phenomenon; A Controllable Material Removal Strategy Considering Force-Geometry Model in Marine Propeller Five-Axis Belt Grinding; Form Accuracy of Internal Grinding of Small and Deep Holes with Coolant Supplied from Inner Side of Grinding Wheel; An Experimental Study on Grinding Fir-Tree Root Forms Using Vitrified CBN Wheels Deformation and Removal Characteristics of Multilayered Thin Film Structures in Nanoscratching and Diamond LappingInfluence of Work Speed on Surface Quality with Rapid Rotation Mirror-Like Surface Grinding; Estimation of Grinding Cycle Time Taking into Account Specific Grinding Force; Study on the Shape Error in the Cylindrical Traverse Grinding of a Workpiece with High Aspect Ratio; Research on Material Removal Mechanism of Single Grit Cutting Based on FEM Simulation; A Preliminary Study of Surface Integrity and Wheel Wear in the Grinding of Multilayered Thin Film Structures Experiment Research on ZrO2 Engineering Ceramics with Abrasive Belt GrindingResearch on Grinding of Silicon Particles Reinforced Aluminum Matrix Composites with High Volume Fraction; Investigation of Grinding Characteristics of Cemented Carbides YL10.2 and YF06; Optimization of Grinding Conditions in Non-Axisymmetric Aspherical Grinding; Study on the Grinding Machinability of 9Mn2V under Different Heat Treatment Processes; Study on Force Characteristics of Ultrasonic Vibration-Assisted Sawing Ceramics with Diamond Blade; Chapter 2: Surface Quality Investigation of Glass Polishing Motion Based on Micro-Oscillating Pressing Force with a Compact Robot and Fine Diamond StoneDevelopment of Non-Destructive Inspection System for Grinding Burn-in-Process Detection of Grinding Burn; Feature Extraction Based 3D Model Registration for Surface Finish Quality Evaluation; Dry Sliding Wear Behaviour of Full Pearlite Obtained by Cladding Low Carbon Steel to Hypoeutectoid Steel; Material Properties of a New PCD Made of Boron Doped Diamond Particles; Dynamic Friction Polishing of Diamond Utilizing High Reactive Metallic Tools Evaluation and ANN-Based Prediction on Functional Parameters of Surface Roughness in Precision Grinding of Cast Iron |
| Record Nr. | UNINA-9910459979503321 |
| Pfaffikon, Switzerland : , : TTP, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Advances in abrasive technology XVII : selected, peer reviewed papers from the 17th International Symposium on Advances in Abrasive Technology (ISAAT 2014), September 22-25, 2014, Hawaii, USA / / edited by Akinori Yui, Jiwang Yan and Hideki Aoyama
| Advances in abrasive technology XVII : selected, peer reviewed papers from the 17th International Symposium on Advances in Abrasive Technology (ISAAT 2014), September 22-25, 2014, Hawaii, USA / / edited by Akinori Yui, Jiwang Yan and Hideki Aoyama |
| Pubbl/distr/stampa | Pfaffikon, Switzerland : , : TTP, , 2014 |
| Descrizione fisica | 1 online resource (837 p.) |
| Disciplina | 621.92 |
| Collana | Advanced Materials Research |
| Soggetto topico |
Abrasives
Grinding and polishing |
| ISBN | 3-03826-604-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Advances in Abrasive Technology XVII; Preface, Committees and Sponsors; Table of Contents; Chapter 1: Abrasive Machining; On the Profile and Microstructure Variations of Grinding-Induced Hardening Layer in A Cylindrical Workpiece; Study on Grinding Force Distribution on Cup Type Electroplated Diamond Wheel in Face Grinding of Cemented Carbide; Investigations on Belt Grinding of GH4169 Nickel-Based Superalloy; Basic Study on High Efficiency Ultra-Precision Grinding of the Optical Glass Lens; Studies on Grinding Conditions Affecting the Quality of Soft Magnetic Powder Cores
Effect of Coolant Supplied through Grinding Wheel on Residual Stress of Grinding SurfaceMulti-Hole Drilling Method by Abrasive Blasting for CFRP and Composite Materials: Investigation of a Processing Model Based on Abrasive Erosion Phenomenon; A Controllable Material Removal Strategy Considering Force-Geometry Model in Marine Propeller Five-Axis Belt Grinding; Form Accuracy of Internal Grinding of Small and Deep Holes with Coolant Supplied from Inner Side of Grinding Wheel; An Experimental Study on Grinding Fir-Tree Root Forms Using Vitrified CBN Wheels Deformation and Removal Characteristics of Multilayered Thin Film Structures in Nanoscratching and Diamond LappingInfluence of Work Speed on Surface Quality with Rapid Rotation Mirror-Like Surface Grinding; Estimation of Grinding Cycle Time Taking into Account Specific Grinding Force; Study on the Shape Error in the Cylindrical Traverse Grinding of a Workpiece with High Aspect Ratio; Research on Material Removal Mechanism of Single Grit Cutting Based on FEM Simulation; A Preliminary Study of Surface Integrity and Wheel Wear in the Grinding of Multilayered Thin Film Structures Experiment Research on ZrO2 Engineering Ceramics with Abrasive Belt GrindingResearch on Grinding of Silicon Particles Reinforced Aluminum Matrix Composites with High Volume Fraction; Investigation of Grinding Characteristics of Cemented Carbides YL10.2 and YF06; Optimization of Grinding Conditions in Non-Axisymmetric Aspherical Grinding; Study on the Grinding Machinability of 9Mn2V under Different Heat Treatment Processes; Study on Force Characteristics of Ultrasonic Vibration-Assisted Sawing Ceramics with Diamond Blade; Chapter 2: Surface Quality Investigation of Glass Polishing Motion Based on Micro-Oscillating Pressing Force with a Compact Robot and Fine Diamond StoneDevelopment of Non-Destructive Inspection System for Grinding Burn-in-Process Detection of Grinding Burn; Feature Extraction Based 3D Model Registration for Surface Finish Quality Evaluation; Dry Sliding Wear Behaviour of Full Pearlite Obtained by Cladding Low Carbon Steel to Hypoeutectoid Steel; Material Properties of a New PCD Made of Boron Doped Diamond Particles; Dynamic Friction Polishing of Diamond Utilizing High Reactive Metallic Tools Evaluation and ANN-Based Prediction on Functional Parameters of Surface Roughness in Precision Grinding of Cast Iron |
| Record Nr. | UNINA-9910787026703321 |
| Pfaffikon, Switzerland : , : TTP, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Advances in abrasive technology XVII : selected, peer reviewed papers from the 17th International Symposium on Advances in Abrasive Technology (ISAAT 2014), September 22-25, 2014, Hawaii, USA / / edited by Akinori Yui, Jiwang Yan and Hideki Aoyama
| Advances in abrasive technology XVII : selected, peer reviewed papers from the 17th International Symposium on Advances in Abrasive Technology (ISAAT 2014), September 22-25, 2014, Hawaii, USA / / edited by Akinori Yui, Jiwang Yan and Hideki Aoyama |
| Pubbl/distr/stampa | Pfaffikon, Switzerland : , : TTP, , 2014 |
| Descrizione fisica | 1 online resource (837 p.) |
| Disciplina | 621.92 |
| Collana | Advanced Materials Research |
| Soggetto topico |
Abrasives
Grinding and polishing |
| ISBN | 3-03826-604-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Advances in Abrasive Technology XVII; Preface, Committees and Sponsors; Table of Contents; Chapter 1: Abrasive Machining; On the Profile and Microstructure Variations of Grinding-Induced Hardening Layer in A Cylindrical Workpiece; Study on Grinding Force Distribution on Cup Type Electroplated Diamond Wheel in Face Grinding of Cemented Carbide; Investigations on Belt Grinding of GH4169 Nickel-Based Superalloy; Basic Study on High Efficiency Ultra-Precision Grinding of the Optical Glass Lens; Studies on Grinding Conditions Affecting the Quality of Soft Magnetic Powder Cores
Effect of Coolant Supplied through Grinding Wheel on Residual Stress of Grinding SurfaceMulti-Hole Drilling Method by Abrasive Blasting for CFRP and Composite Materials: Investigation of a Processing Model Based on Abrasive Erosion Phenomenon; A Controllable Material Removal Strategy Considering Force-Geometry Model in Marine Propeller Five-Axis Belt Grinding; Form Accuracy of Internal Grinding of Small and Deep Holes with Coolant Supplied from Inner Side of Grinding Wheel; An Experimental Study on Grinding Fir-Tree Root Forms Using Vitrified CBN Wheels Deformation and Removal Characteristics of Multilayered Thin Film Structures in Nanoscratching and Diamond LappingInfluence of Work Speed on Surface Quality with Rapid Rotation Mirror-Like Surface Grinding; Estimation of Grinding Cycle Time Taking into Account Specific Grinding Force; Study on the Shape Error in the Cylindrical Traverse Grinding of a Workpiece with High Aspect Ratio; Research on Material Removal Mechanism of Single Grit Cutting Based on FEM Simulation; A Preliminary Study of Surface Integrity and Wheel Wear in the Grinding of Multilayered Thin Film Structures Experiment Research on ZrO2 Engineering Ceramics with Abrasive Belt GrindingResearch on Grinding of Silicon Particles Reinforced Aluminum Matrix Composites with High Volume Fraction; Investigation of Grinding Characteristics of Cemented Carbides YL10.2 and YF06; Optimization of Grinding Conditions in Non-Axisymmetric Aspherical Grinding; Study on the Grinding Machinability of 9Mn2V under Different Heat Treatment Processes; Study on Force Characteristics of Ultrasonic Vibration-Assisted Sawing Ceramics with Diamond Blade; Chapter 2: Surface Quality Investigation of Glass Polishing Motion Based on Micro-Oscillating Pressing Force with a Compact Robot and Fine Diamond StoneDevelopment of Non-Destructive Inspection System for Grinding Burn-in-Process Detection of Grinding Burn; Feature Extraction Based 3D Model Registration for Surface Finish Quality Evaluation; Dry Sliding Wear Behaviour of Full Pearlite Obtained by Cladding Low Carbon Steel to Hypoeutectoid Steel; Material Properties of a New PCD Made of Boron Doped Diamond Particles; Dynamic Friction Polishing of Diamond Utilizing High Reactive Metallic Tools Evaluation and ANN-Based Prediction on Functional Parameters of Surface Roughness in Precision Grinding of Cast Iron |
| Record Nr. | UNINA-9910813236103321 |
| Pfaffikon, Switzerland : , : TTP, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Chemical mechanical planarization of microelectronic materials [[electronic resource] /] / Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann
| Chemical mechanical planarization of microelectronic materials [[electronic resource] /] / Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann |
| Autore | Steigerwald Joseph M |
| Pubbl/distr/stampa | Weinheim, : Wiley-VCH, 2004 |
| Descrizione fisica | 1 online resource (339 p.) |
| Disciplina |
621.3815
621.38152 |
| Altri autori (Persone) |
MurarkaS. P
GutmannRonald J |
| Soggetto topico |
Microelectronics - Materials
Grinding and polishing |
| ISBN |
1-281-84314-8
9786611843144 3-527-61774-4 3-527-61775-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Chemical Mechanical Planarization of Microelectronic Materials; CONTENTS; Preface; 1 Chemical Mechanical Planarization - An Introduction; 1.1 Introduction; 1.2 Applications; 1.3 The CMP Process; 1.4 CMP Tools; 1.5 Process Integration; 1.6 Conclusion and Book Outline; References; 2 Historical Motivations for CMP; 2.1 Advanced Metallization Schemes; 2.1.1 Interconnect Delay Impact on Performance; 2.1.2 Methods of Reducing Interconnect Delay; 2.1.3 Planarity Requirements for Multilevel Metallization; 2.2 Planarization Schemes; 2.2.1 Smoothing and Local Planarization; 2.2.2 Global Planarization
2.3 CMP Planarization2.3.1 Advantages of CMP; 2.3.2 Disadvantages of CMP; 2.3.3 The Challenge of CMP; References; 3 CMP Variables and Manipulations; 3.1 Output Variables; 3.2 Input Variables; References; 4 Mechanical and Electrochemical Concepts for CMP; 4.1 Preston Equation; 4.2 Fluid Layer Interactions; 4.3 Boundary Layer Interactions; 4.3.1 Fluid Boundary Layer; 4.3.2 Double Layer; 4.3.3 Metal Surface Films; 4.3.4 Mechanical Abrasion; 4.4 Abrasion Modes; 4.4.1 Polishing vs. Grinding; 4.4.2 Hertzian Indentation vs. Fluid-Based Wear; 4.5 The Polishing Pad; 4.5.1 Pad Materials and Properties 4.5.2 Pad Conditioning4.6 Electrochemical Phenomena; 4.6.1 Reduction-Oxidation Reactions; 4.6.2 Pourbaix Diagrams; 4.6.3 Mixed Potential Theory; 4.6.4 Example: Copper CMP in NH3-Based Slurries; 4.6.5 Example: Copper-Titanium Interaction; 4.7 Role of Chemistry in CMP; 4.8 Abrasives; References; 5 Oxide CMP Processes - Mechanisms and Models; 5.1 The Role of Chemistry in Oxide Polishing; 5.1.1 Glass Polishing Mechanisms; 5.1.2 The Role of Water in Oxide Polishing; 5.1.3 Chemical Interactions Between Abrasive and Oxide Surface; 5.2 Oxide CMP in Practice; 5.2.1 Polish Rate Results 5.2.2 Planarization Results5.2.3 CMP in Manufacturing; 5.2.4 Yield Issues; 5.3 Summary; References; 6 Tungsten and CMP Processes; 6.1 Inlaid Metal Patterning; 6.1.1 RIE Etch Back; 6.1.2 Metal CMP; 6.2 Tungsten CMP; 6.2.1 Surface Passivation Model for Tungsten CMP; 6.2.2 Tungsten CMP Processes; 6.3 Summary; References; 7 Copper CMP; 7.1 Proposed Model for Copper CMP; 7.2 Surface Layer Formation - Planarization; 7.2.1 Formation of Native Surface Films; 7.2.2 Formation of Nonnative Cu-BTA Surface Film; 7.3 Material Dissolution; 7.3.1 Removal of Abraded Material 7.3.2 Increasing Solubility with Complexing Agent7.3.3 Increasing Dissolution Rate with Oxidizing Agents; 7.3.4 Chemical Aspect of the Copper CMP Model; 7.4 Preston Equation; 7.4.1 Preston Coefficient; 7.4.2 Polish Rates; 7.4.3 Comparison of Kp Values; 7.5 Polish-Induced Stress; 7.6 Pattern Geometry Effects; 7.6.1 Dishing and Erosion in Cu/SiO2 System; 7.6.2 Optimization of Process to Minimize Dishing and Erosion; 7.6.3 Summary; References; 8 CMP of Other Materials and New CMP Applications; 8.1 The Front-End Applications in Silicon IC Fabrication 8.1.1 Polysilicon CMP for Deep Trench Capacitor Fabrication |
| Record Nr. | UNINA-9910144581703321 |
Steigerwald Joseph M
|
||
| Weinheim, : Wiley-VCH, 2004 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Chemical mechanical planarization of microelectronic materials [[electronic resource] /] / Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann
| Chemical mechanical planarization of microelectronic materials [[electronic resource] /] / Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann |
| Autore | Steigerwald Joseph M |
| Pubbl/distr/stampa | Weinheim, : Wiley-VCH, 2004 |
| Descrizione fisica | 1 online resource (339 p.) |
| Disciplina |
621.3815
621.38152 |
| Altri autori (Persone) |
MurarkaS. P
GutmannRonald J |
| Soggetto topico |
Microelectronics - Materials
Grinding and polishing |
| ISBN |
1-281-84314-8
9786611843144 3-527-61774-4 3-527-61775-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Chemical Mechanical Planarization of Microelectronic Materials; CONTENTS; Preface; 1 Chemical Mechanical Planarization - An Introduction; 1.1 Introduction; 1.2 Applications; 1.3 The CMP Process; 1.4 CMP Tools; 1.5 Process Integration; 1.6 Conclusion and Book Outline; References; 2 Historical Motivations for CMP; 2.1 Advanced Metallization Schemes; 2.1.1 Interconnect Delay Impact on Performance; 2.1.2 Methods of Reducing Interconnect Delay; 2.1.3 Planarity Requirements for Multilevel Metallization; 2.2 Planarization Schemes; 2.2.1 Smoothing and Local Planarization; 2.2.2 Global Planarization
2.3 CMP Planarization2.3.1 Advantages of CMP; 2.3.2 Disadvantages of CMP; 2.3.3 The Challenge of CMP; References; 3 CMP Variables and Manipulations; 3.1 Output Variables; 3.2 Input Variables; References; 4 Mechanical and Electrochemical Concepts for CMP; 4.1 Preston Equation; 4.2 Fluid Layer Interactions; 4.3 Boundary Layer Interactions; 4.3.1 Fluid Boundary Layer; 4.3.2 Double Layer; 4.3.3 Metal Surface Films; 4.3.4 Mechanical Abrasion; 4.4 Abrasion Modes; 4.4.1 Polishing vs. Grinding; 4.4.2 Hertzian Indentation vs. Fluid-Based Wear; 4.5 The Polishing Pad; 4.5.1 Pad Materials and Properties 4.5.2 Pad Conditioning4.6 Electrochemical Phenomena; 4.6.1 Reduction-Oxidation Reactions; 4.6.2 Pourbaix Diagrams; 4.6.3 Mixed Potential Theory; 4.6.4 Example: Copper CMP in NH3-Based Slurries; 4.6.5 Example: Copper-Titanium Interaction; 4.7 Role of Chemistry in CMP; 4.8 Abrasives; References; 5 Oxide CMP Processes - Mechanisms and Models; 5.1 The Role of Chemistry in Oxide Polishing; 5.1.1 Glass Polishing Mechanisms; 5.1.2 The Role of Water in Oxide Polishing; 5.1.3 Chemical Interactions Between Abrasive and Oxide Surface; 5.2 Oxide CMP in Practice; 5.2.1 Polish Rate Results 5.2.2 Planarization Results5.2.3 CMP in Manufacturing; 5.2.4 Yield Issues; 5.3 Summary; References; 6 Tungsten and CMP Processes; 6.1 Inlaid Metal Patterning; 6.1.1 RIE Etch Back; 6.1.2 Metal CMP; 6.2 Tungsten CMP; 6.2.1 Surface Passivation Model for Tungsten CMP; 6.2.2 Tungsten CMP Processes; 6.3 Summary; References; 7 Copper CMP; 7.1 Proposed Model for Copper CMP; 7.2 Surface Layer Formation - Planarization; 7.2.1 Formation of Native Surface Films; 7.2.2 Formation of Nonnative Cu-BTA Surface Film; 7.3 Material Dissolution; 7.3.1 Removal of Abraded Material 7.3.2 Increasing Solubility with Complexing Agent7.3.3 Increasing Dissolution Rate with Oxidizing Agents; 7.3.4 Chemical Aspect of the Copper CMP Model; 7.4 Preston Equation; 7.4.1 Preston Coefficient; 7.4.2 Polish Rates; 7.4.3 Comparison of Kp Values; 7.5 Polish-Induced Stress; 7.6 Pattern Geometry Effects; 7.6.1 Dishing and Erosion in Cu/SiO2 System; 7.6.2 Optimization of Process to Minimize Dishing and Erosion; 7.6.3 Summary; References; 8 CMP of Other Materials and New CMP Applications; 8.1 The Front-End Applications in Silicon IC Fabrication 8.1.1 Polysilicon CMP for Deep Trench Capacitor Fabrication |
| Record Nr. | UNINA-9910830394203321 |
|
Steigerwald Joseph M
|
||
| Weinheim, : Wiley-VCH, 2004 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Chemical mechanical planarization of microelectronic materials [[electronic resource] /] / Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann
| Chemical mechanical planarization of microelectronic materials [[electronic resource] /] / Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann |
| Autore | Steigerwald Joseph M |
| Pubbl/distr/stampa | Weinheim, : Wiley-VCH, 2004 |
| Descrizione fisica | 1 online resource (339 p.) |
| Disciplina |
621.3815
621.38152 |
| Altri autori (Persone) |
MurarkaS. P
GutmannRonald J |
| Soggetto topico |
Microelectronics - Materials
Grinding and polishing |
| ISBN |
1-281-84314-8
9786611843144 3-527-61774-4 3-527-61775-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Chemical Mechanical Planarization of Microelectronic Materials; CONTENTS; Preface; 1 Chemical Mechanical Planarization - An Introduction; 1.1 Introduction; 1.2 Applications; 1.3 The CMP Process; 1.4 CMP Tools; 1.5 Process Integration; 1.6 Conclusion and Book Outline; References; 2 Historical Motivations for CMP; 2.1 Advanced Metallization Schemes; 2.1.1 Interconnect Delay Impact on Performance; 2.1.2 Methods of Reducing Interconnect Delay; 2.1.3 Planarity Requirements for Multilevel Metallization; 2.2 Planarization Schemes; 2.2.1 Smoothing and Local Planarization; 2.2.2 Global Planarization
2.3 CMP Planarization2.3.1 Advantages of CMP; 2.3.2 Disadvantages of CMP; 2.3.3 The Challenge of CMP; References; 3 CMP Variables and Manipulations; 3.1 Output Variables; 3.2 Input Variables; References; 4 Mechanical and Electrochemical Concepts for CMP; 4.1 Preston Equation; 4.2 Fluid Layer Interactions; 4.3 Boundary Layer Interactions; 4.3.1 Fluid Boundary Layer; 4.3.2 Double Layer; 4.3.3 Metal Surface Films; 4.3.4 Mechanical Abrasion; 4.4 Abrasion Modes; 4.4.1 Polishing vs. Grinding; 4.4.2 Hertzian Indentation vs. Fluid-Based Wear; 4.5 The Polishing Pad; 4.5.1 Pad Materials and Properties 4.5.2 Pad Conditioning4.6 Electrochemical Phenomena; 4.6.1 Reduction-Oxidation Reactions; 4.6.2 Pourbaix Diagrams; 4.6.3 Mixed Potential Theory; 4.6.4 Example: Copper CMP in NH3-Based Slurries; 4.6.5 Example: Copper-Titanium Interaction; 4.7 Role of Chemistry in CMP; 4.8 Abrasives; References; 5 Oxide CMP Processes - Mechanisms and Models; 5.1 The Role of Chemistry in Oxide Polishing; 5.1.1 Glass Polishing Mechanisms; 5.1.2 The Role of Water in Oxide Polishing; 5.1.3 Chemical Interactions Between Abrasive and Oxide Surface; 5.2 Oxide CMP in Practice; 5.2.1 Polish Rate Results 5.2.2 Planarization Results5.2.3 CMP in Manufacturing; 5.2.4 Yield Issues; 5.3 Summary; References; 6 Tungsten and CMP Processes; 6.1 Inlaid Metal Patterning; 6.1.1 RIE Etch Back; 6.1.2 Metal CMP; 6.2 Tungsten CMP; 6.2.1 Surface Passivation Model for Tungsten CMP; 6.2.2 Tungsten CMP Processes; 6.3 Summary; References; 7 Copper CMP; 7.1 Proposed Model for Copper CMP; 7.2 Surface Layer Formation - Planarization; 7.2.1 Formation of Native Surface Films; 7.2.2 Formation of Nonnative Cu-BTA Surface Film; 7.3 Material Dissolution; 7.3.1 Removal of Abraded Material 7.3.2 Increasing Solubility with Complexing Agent7.3.3 Increasing Dissolution Rate with Oxidizing Agents; 7.3.4 Chemical Aspect of the Copper CMP Model; 7.4 Preston Equation; 7.4.1 Preston Coefficient; 7.4.2 Polish Rates; 7.4.3 Comparison of Kp Values; 7.5 Polish-Induced Stress; 7.6 Pattern Geometry Effects; 7.6.1 Dishing and Erosion in Cu/SiO2 System; 7.6.2 Optimization of Process to Minimize Dishing and Erosion; 7.6.3 Summary; References; 8 CMP of Other Materials and New CMP Applications; 8.1 The Front-End Applications in Silicon IC Fabrication 8.1.1 Polysilicon CMP for Deep Trench Capacitor Fabrication |
| Record Nr. | UNINA-9910841734903321 |
|
Steigerwald Joseph M
|
||
| Weinheim, : Wiley-VCH, 2004 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
CMP Technology : International Conference on Planarization : 25-27 October 2007
| CMP Technology : International Conference on Planarization : 25-27 October 2007 |
| Pubbl/distr/stampa | Frankfurt am Main, Germany : , : VDE, , 2011 |
| Descrizione fisica | 1 online resource (493 pages) |
| Disciplina | 621.92 |
| Soggetto topico | Grinding and polishing |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996215978403316 |
| Frankfurt am Main, Germany : , : VDE, , 2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
Flexure strength and optical transparency of magnesium-aluminate spinel (MgAlO₄) : influence of polishing and glass coating / / by Steve M Kilczewski [and four others]
| Flexure strength and optical transparency of magnesium-aluminate spinel (MgAlO₄) : influence of polishing and glass coating / / by Steve M Kilczewski [and four others] |
| Autore | Kilczewski Steve M. |
| Pubbl/distr/stampa | Aberdeen Proving Ground, MD : , : US Army Research Laboratory, , December 2016 |
| Descrizione fisica | 1 online resource (vi, 11 pages) : illustrations (some color) |
| Soggetto topico |
Aluminum-magnesium alloys - United States
Aluminates Spinel - United States Transparent solids Grinding and polishing Strength of materials |
| Soggetto genere / forma | Technical reports. |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | Flexure strength and optical transparency of magnesium-aluminate spinel |
| Record Nr. | UNINA-9910706199903321 |
|
Kilczewski Steve M.
|
||
| Aberdeen Proving Ground, MD : , : US Army Research Laboratory, , December 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Hydrogen explosion while grinding in the vicinity of drained and open reactor coolant system
| Hydrogen explosion while grinding in the vicinity of drained and open reactor coolant system |
| Pubbl/distr/stampa | Washington, D.C. : , : United States Nuclear Regulatory Commission, Office of Inspection and Enforcement, , 1982 |
| Descrizione fisica | 1 online resource |
| Collana | Information notice |
| Soggetto topico |
Nuclear reactors - Cooling - Accidents
Explosions Grinding and polishing |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910713807303321 |
| Washington, D.C. : , : United States Nuclear Regulatory Commission, Office of Inspection and Enforcement, , 1982 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Metallographic polishing by mechanical methods [[electronic resource] /] / Leonard E. Samuels
| Metallographic polishing by mechanical methods [[electronic resource] /] / Leonard E. Samuels |
| Autore | Samuels Leonard Ernest <1922-> |
| Edizione | [4th ed.] |
| Pubbl/distr/stampa | Materials Park, OH, : ASM International, c2003 |
| Descrizione fisica | 1 online resource (359 p.) |
| Disciplina | 671.7/2 |
| Soggetto topico |
Grinding and polishing
Metallographic specimens |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-68015-959-3
1-61503-257-6 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
""Contents""; ""About the Author""; ""Preface to the Fourth Edition""; ""Preface to the Third Edition""; ""Acknowledgments""; ""CHAPTER 1 Introduction""; ""CHAPTER 2 Sectioning and Mounting""; ""CHAPTER 3 Machining with Abrasives: Principles""; ""CHAPTER 4 Machining with Abrasives: Practice""; ""CHAPTER 5 Machining with Abrasives: Surface Damage""; ""CHAPTER 6 Nonabrasive Preparation Processes""; ""CHAPTER 7 Polishing with Abrasives: Principles""; ""CHAPTER 8 Polishing with Abrasives: Surface Damage""; ""CHAPTER 9 Brittle Materials: Principles""
""CHAPTER 10 Principles of the Design of Manual Preparation Systems""""CHAPTER 11 Modifications Required to Manual Preparation Systems""; ""CHAPTER 12 Principles of the Design of Semiautomatic Preparation Systems""; ""Glossary""; ""Index"" |
| Record Nr. | UNINA-9910457158603321 |
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Samuels Leonard Ernest <1922->
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| Materials Park, OH, : ASM International, c2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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