Info
Advanced flip chip packaging / / edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong
| Advanced flip chip packaging / / edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong |
| Edizione | [1st ed. 2013.] |
| Pubbl/distr/stampa | New York, : Springer, 2013 |
| Descrizione fisica | 1 online resource (vii, 560 pages) : illustrations (some color) |
| Disciplina | 621.381046 |
| Altri autori (Persone) |
LaiYi-Shao
TongHo-Ming WongC. P |
| Collana | Gale eBooks |
| Soggetto topico |
Electronic packaging
Flip chip technology |
| ISBN | 1-4419-5768-5 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Flip Chip Technology Overview and Early Beginnings -- Technology Trends of Flip Chip -- Bumping Technologies -- Flip-Chip Interconnections: Past, Present and Future -- Underfill -- Conductive Adhesives for Flip Chip Applications -- Enabling Substrate Technologies: Past, Present and Future -- IC-Package-System Integrated Design -- Thermal Management of Flip Chip Packages -- Thermo-Mechanical Reliability in Flip Chip Packages -- Interfacial Reactions and Electromigration in Flip-Chip Solder Joints. |
| Record Nr. | UNINA-9910437892003321 |
| New York, : Springer, 2013 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Development of sub-mm wave flip-chip interconnect / / vorgelegt von M.Sc. Sirinpa Monayakul
| Development of sub-mm wave flip-chip interconnect / / vorgelegt von M.Sc. Sirinpa Monayakul |
| Autore | Monayakul Sirinpa |
| Edizione | [1. Auflage.] |
| Pubbl/distr/stampa | Gottingen, [Germany] : , : Cuvillier Verlag, , 2016 |
| Descrizione fisica | 1 online resource (142 pages) : illustrations (some color) |
| Disciplina | 600 |
| Collana | Innovationen mit Mikrowellen und Licht. Forschungsberichte aus dem Ferdinand-Braun-Institut, Leibniz-Institut fur Hochstfrequenztechnik |
| Soggetto topico |
Gold alloys
Eutectic alloys Flip chip technology |
| Soggetto genere / forma | Electronic books. |
| ISBN | 3-7369-8410-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910511791603321 |
Monayakul Sirinpa
|
||
| Gottingen, [Germany] : , : Cuvillier Verlag, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Development of sub-mm wave flip-chip interconnect / / Sirinpa Monayakul
| Development of sub-mm wave flip-chip interconnect / / Sirinpa Monayakul |
| Autore | Monayakul Sirinpa |
| Edizione | [1st edition.] |
| Pubbl/distr/stampa | Gottingen, Germany : , : Cuvillier Verlag, , 2016 |
| Descrizione fisica | 1 online resource (142 pages) : illustrations (some color) |
| Disciplina | 600 |
| Collana | Innovationen mit Mikrowellen und Licht. Forschungsberichte aus dem Ferdinand-Braun-Institut, Leibniz-Institut fur Hochstfrequenztechnik |
| Soggetto topico |
Gold alloys
Eutectic alloys Flip chip technology |
| ISBN | 3-7369-8410-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910794717203321 |
|
Monayakul Sirinpa
|
||
| Gottingen, Germany : , : Cuvillier Verlag, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Development of sub-mm wave flip-chip interconnect / / Sirinpa Monayakul
| Development of sub-mm wave flip-chip interconnect / / Sirinpa Monayakul |
| Autore | Monayakul Sirinpa |
| Edizione | [1st edition.] |
| Pubbl/distr/stampa | Gottingen, Germany : , : Cuvillier Verlag, , 2016 |
| Descrizione fisica | 1 online resource (142 pages) : illustrations (some color) |
| Disciplina | 600 |
| Collana | Innovationen mit Mikrowellen und Licht. Forschungsberichte aus dem Ferdinand-Braun-Institut, Leibniz-Institut fur Hochstfrequenztechnik |
| Soggetto topico |
Gold alloys
Eutectic alloys Flip chip technology |
| ISBN | 3-7369-8410-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910820800803321 |
|
Monayakul Sirinpa
|
||
| Gottingen, Germany : , : Cuvillier Verlag, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
