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2020 27th International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD) / / Institute of Electrical and Electronics Engineers (IEEE)
| 2020 27th International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD) / / Institute of Electrical and Electronics Engineers (IEEE) |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers (IEEE), , 2020 |
| Descrizione fisica | 1 online resource : illustrations |
| Disciplina | 621.381 |
| Soggetto topico |
Photovoltaic power generation
Conference papers and proceedings Flexible electronics Flat panel displays |
| ISBN | 4-9908753-8-9 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | 2020 27th International Workshop on Active-Matrix Flatpanel Displays and Devices |
| Record Nr. | UNINA-9910437201803321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers (IEEE), , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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2020 27th International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD) / / Institute of Electrical and Electronics Engineers (IEEE)
| 2020 27th International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD) / / Institute of Electrical and Electronics Engineers (IEEE) |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers (IEEE), , 2020 |
| Descrizione fisica | 1 online resource : illustrations |
| Disciplina | 621.381 |
| Soggetto topico |
Photovoltaic power generation
Conference papers and proceedings Flexible electronics Flat panel displays |
| ISBN | 4-9908753-8-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | 2020 27th International Workshop on Active-Matrix Flatpanel Displays and Devices |
| Record Nr. | UNISA-996575628003316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers (IEEE), , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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Advanced materials for printed flexible electronics / / Colin Tong
| Advanced materials for printed flexible electronics / / Colin Tong |
| Autore | Tong Xingcun Colin |
| Pubbl/distr/stampa | Cham, Switzerland : , : Springer, , [2021] |
| Descrizione fisica | 1 online resource (641 pages) |
| Disciplina | 621.381 |
| Collana | Springer Series in Materials Science |
| Soggetto topico |
Flexible electronics
Printed electronics |
| ISBN | 3-030-79804-6 |
| Classificazione | XZLUXA |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910522971903321 |
Tong Xingcun Colin
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| Cham, Switzerland : , : Springer, , [2021] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Flexible and printed electronics
| Flexible and printed electronics |
| Pubbl/distr/stampa | [Bristol] : , : IOP Publishing |
| Descrizione fisica | 1 online resource : illustrations (some color) |
| Soggetto topico |
Flexible electronics
Printed electronics |
| Soggetto genere / forma | Periodicals. |
| Formato | Materiale a stampa |
| Livello bibliografico | Periodico |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | FPE |
| Record Nr. | UNINA-9910131434903321 |
| [Bristol] : , : IOP Publishing | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Flexible bioelectronics with power autonomous sensing and data analytics / / Sameer Sonkusale, Maryam Shojaei Baghini and Shuchin Aeron
| Flexible bioelectronics with power autonomous sensing and data analytics / / Sameer Sonkusale, Maryam Shojaei Baghini and Shuchin Aeron |
| Autore | Sonkusale Sameer |
| Pubbl/distr/stampa | Cham, Switzerland : , : Springer, , [2022] |
| Descrizione fisica | 1 online resource (187 pages) |
| Disciplina | 571.45 |
| Soggetto topico |
Bioelectronics
Flexible electronics Biosensors |
| ISBN | 3-030-98538-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910578693703321 |
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Sonkusale Sameer
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| Cham, Switzerland : , : Springer, , [2022] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Flexible carbon-based electronics / / edited by Paolo Samorì and Vincenzo Palermo
| Flexible carbon-based electronics / / edited by Paolo Samorì and Vincenzo Palermo |
| Pubbl/distr/stampa | Weinheim, Germany : , : Wiley-VCH, , 2018 |
| Descrizione fisica | 1 online resource (337 pages) |
| Disciplina | 621.381 |
| Collana | Advanced Nanocarbon Materials Ser. |
| Soggetto topico | Flexible electronics |
| Soggetto genere / forma | Electronic books. |
| ISBN |
3-527-80488-9
3-527-80489-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Cover -- Title Page -- Copyright -- Contents -- About the Series Editor -- Preface -- Chapter 1 Soft Composites with Tunable Optical and Electrical Properties -- 1.1 Introduction -- 1.2 Soft Color Composites -- 1.3 Hybrid Viscoelastic Polymer Composites -- 1.4 Elastomeric Conductive Composites -- 1.5 Conclusions and Future Perspectives -- Acknowledgments -- References -- Chapter 2 Organic Semiconductors for Transparent Electronics -- 2.1 Introduction -- 2.2 Optically Transparent Semiconductor Families -- 2.2.1 Thin‐film Transistors -- 2.2.2 Oligothiophenes -- 2.2.3 Fused Heteroacenes -- 2.2.4 Rylene and Fused Aromatic Dicarboximides -- 2.2.5 Other Semiconductors -- 2.3 Conclusions and Perspectives -- References -- Chapter 3 Flexible Carbon‐based Electronics: Flexible Solar Cells -- 3.1 Introduction -- 3.2 Applications -- 3.3 Device Physics -- 3.3.1 Structure and Operating Principle -- 3.3.2 Solar Cell Characteristics -- 3.4 New Materials -- 3.5 Flexible Electrodes -- 3.6 Processing -- 3.6.1 Laboratory Scale -- 3.6.2 Industrial Scale -- 3.6.3 Solar Modules -- 3.7 Summary and Outlook -- References -- Chapter 4 Development of Organic Field‐effect Transistors for Operation at High Frequency -- 4.1 Introduction -- 4.2 The Transition Frequency ft -- 4.2.1 Measurement Methods -- 4.3 High‐frequency Organic Field‐effect Transistors -- 4.3.1 Improvement of the Effective Charge Mobility -- 4.3.2 The Reduction of the Footprint -- 4.3.3 Achieving High‐frequency Operation at a Low Bias Voltage -- 4.3.4 Integration into Upscalable Fabrication Processes -- 4.4 Conclusions and Perspectives -- References -- Chapter 5 Graphene for Flexible Electronics -- 5.1 Introduction -- 5.2 Synthesis and Transfer Process -- 5.2.1 Chemical Vapor Deposition (CVD): Scalable Growth -- 5.2.2 Transfer Process -- 5.3 Applications -- 5.3.1 Transparent Electrodes.
5.3.1.1 Touch Screen/Panel -- 5.3.1.2 Organic Light‐Emitting Diodes -- 5.3.1.3 Photovoltaic Device -- 5.3.2 Field‐effect Transistors -- 5.3.3 Sensors -- 5.3.4 Nanogenerator for Energy Harvesting -- 5.4 Conclusions and Perspectives -- References -- Chapter 6 Printing 2D Materials -- 6.1 Introduction -- 6.2 Printing Techniques -- 6.2.1 Spin Coating -- 6.2.2 Blade Coating -- 6.2.3 Rod Coating -- 6.2.4 Spray Coating -- 6.2.5 Screen Printing -- 6.2.6 Flexographic Printing -- 6.2.7 Gravure Printing -- 6.2.8 Inkjet Printing -- 6.3 Formulation and Characterization of Electronic Inks -- 6.3.1 Ink Rheology and Surface Chemistry -- 6.3.2 Dispersion of Functional Layered Materials -- 6.4 Exfoliation of Layered Crystals -- 6.4.1 Ultrasonication -- 6.4.2 Ball Milling -- 6.4.3 Shear Exfoliation -- 6.4.4 Microfluidization -- 6.5 Stabilization of Exfoliated Flakes -- 6.5.1 Surfactants -- 6.6 Formulation: From Dispersion to Ink -- 6.6.1 The Rheology of Inks -- 6.7 Printing and Coating of 2D‐crystal‐based Inks -- 6.7.1 Spin Coating -- 6.7.2 Blade and Rod Coating -- 6.7.3 Spray Coating -- 6.7.4 Screen Printing -- 6.7.5 Inkjet Printing -- 6.7.6 Characterization Techniques -- 6.8 Applications -- 6.8.1 Printed Electronics -- 6.8.2 Printed Optoelectronics -- 6.8.3 Sensors and Wearable Devices -- 6.8.4 Energy Devices -- 6.8.5 Printed THz Devices -- 6.9 Outlook and Future Perspectives -- Acknowledgments -- References -- Chapter 7 Characterization of Graphene Flexible Materials and Displays -- 7.1 Introduction to Display Systems -- 7.2 Graphene/Flexible Polymer Electrodes -- 7.2.1 Sheet Resistance and Transmittance of Graphene/Flexible Polymer Electrodes -- 7.2.2 Mechanical Robustness of Graphene/Flexible Polymer Electrodes -- 7.3 Graphene‐based Flexible Displays -- 7.4 Outlook -- References -- Chapter 8 AMOLED Display Technology and Applications -- 8.1 Introduction. 8.2 Commercial Flexible AMOLED Displays -- 8.3 OLED Displays -- 8.3.1 Structure and Electro‐optic Behavior -- 8.3.2 Lifetime Effects in OLEDs -- 8.4 AMOLED Display Design -- 8.4.1 TFT Technologies for Flexible AMOLED Displays -- 8.4.1.1 Polysilicon TFTs -- 8.4.1.2 Metal Oxide TFTs -- 8.4.2 AMOLED Pixel Design -- 8.4.3 Integrated Display Drivers -- 8.5 Substrates and Barrier Coatings -- 8.5.1 Substrates -- 8.5.2 Barrier Coatings -- 8.5.3 Additional Layers -- 8.5.4 Characterization of Flexibility -- 8.6 The Future of Flexible AMOLED Displays -- References -- Chapter 9 Flexible Batteries -- 9.1 Introduction -- 9.2 Electrochemical Power Sources - Theoretical Basics -- 9.2.1 Conventional (lithium‐ion) battery build‐up -- 9.3 Basic Material Concepts for Flexible Energy Storage Systems -- 9.3.1 Flexible Electrodes -- 9.3.2 Flexible Electrolyte -- 9.3.3 Flexible Packaging -- 9.4 Basic Design Concepts for Flexible Energy Storage Systems -- 9.4.1 Thin‐film/Printed Batteries -- 9.4.2 Fiber‐shaped/Cable‐type Batteries -- 9.4.3 Embedded Batteries -- 9.5 Summary and Outlook -- References -- Chapter 10 Flexible Organic Bioelectronics and Biosensors -- 10.1 Introduction -- 10.2 Organic Material -- 10.3 Flexible Organic Electronics for Biology -- 10.3.1 OTFTs -- 10.3.1.1 OFET Sensors -- 10.3.1.2 OECTs Sensors -- 10.3.2 Organic Electrodes -- 10.3.2.1 Biological Sensing -- 10.3.2.2 Neural Recording/Stimulation -- 10.3.2.3 Others -- 10.3.3 e‐Textiles -- 10.4 Conclusion -- References -- Index -- EULA. |
| Record Nr. | UNINA-9910555096603321 |
| Weinheim, Germany : , : Wiley-VCH, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Flexible carbon-based electronics / / edited by Paolo Samorì and Vincenzo Palermo
| Flexible carbon-based electronics / / edited by Paolo Samorì and Vincenzo Palermo |
| Pubbl/distr/stampa | Weinheim, Germany : , : Wiley-VCH, , 2018 |
| Descrizione fisica | 1 online resource (337 pages) |
| Disciplina | 621.381 |
| Collana | Advanced Nanocarbon Materials |
| Soggetto topico | Flexible electronics |
| ISBN |
3-527-80488-9
3-527-80489-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Cover -- Title Page -- Copyright -- Contents -- About the Series Editor -- Preface -- Chapter 1 Soft Composites with Tunable Optical and Electrical Properties -- 1.1 Introduction -- 1.2 Soft Color Composites -- 1.3 Hybrid Viscoelastic Polymer Composites -- 1.4 Elastomeric Conductive Composites -- 1.5 Conclusions and Future Perspectives -- Acknowledgments -- References -- Chapter 2 Organic Semiconductors for Transparent Electronics -- 2.1 Introduction -- 2.2 Optically Transparent Semiconductor Families -- 2.2.1 Thin‐film Transistors -- 2.2.2 Oligothiophenes -- 2.2.3 Fused Heteroacenes -- 2.2.4 Rylene and Fused Aromatic Dicarboximides -- 2.2.5 Other Semiconductors -- 2.3 Conclusions and Perspectives -- References -- Chapter 3 Flexible Carbon‐based Electronics: Flexible Solar Cells -- 3.1 Introduction -- 3.2 Applications -- 3.3 Device Physics -- 3.3.1 Structure and Operating Principle -- 3.3.2 Solar Cell Characteristics -- 3.4 New Materials -- 3.5 Flexible Electrodes -- 3.6 Processing -- 3.6.1 Laboratory Scale -- 3.6.2 Industrial Scale -- 3.6.3 Solar Modules -- 3.7 Summary and Outlook -- References -- Chapter 4 Development of Organic Field‐effect Transistors for Operation at High Frequency -- 4.1 Introduction -- 4.2 The Transition Frequency ft -- 4.2.1 Measurement Methods -- 4.3 High‐frequency Organic Field‐effect Transistors -- 4.3.1 Improvement of the Effective Charge Mobility -- 4.3.2 The Reduction of the Footprint -- 4.3.3 Achieving High‐frequency Operation at a Low Bias Voltage -- 4.3.4 Integration into Upscalable Fabrication Processes -- 4.4 Conclusions and Perspectives -- References -- Chapter 5 Graphene for Flexible Electronics -- 5.1 Introduction -- 5.2 Synthesis and Transfer Process -- 5.2.1 Chemical Vapor Deposition (CVD): Scalable Growth -- 5.2.2 Transfer Process -- 5.3 Applications -- 5.3.1 Transparent Electrodes.
5.3.1.1 Touch Screen/Panel -- 5.3.1.2 Organic Light‐Emitting Diodes -- 5.3.1.3 Photovoltaic Device -- 5.3.2 Field‐effect Transistors -- 5.3.3 Sensors -- 5.3.4 Nanogenerator for Energy Harvesting -- 5.4 Conclusions and Perspectives -- References -- Chapter 6 Printing 2D Materials -- 6.1 Introduction -- 6.2 Printing Techniques -- 6.2.1 Spin Coating -- 6.2.2 Blade Coating -- 6.2.3 Rod Coating -- 6.2.4 Spray Coating -- 6.2.5 Screen Printing -- 6.2.6 Flexographic Printing -- 6.2.7 Gravure Printing -- 6.2.8 Inkjet Printing -- 6.3 Formulation and Characterization of Electronic Inks -- 6.3.1 Ink Rheology and Surface Chemistry -- 6.3.2 Dispersion of Functional Layered Materials -- 6.4 Exfoliation of Layered Crystals -- 6.4.1 Ultrasonication -- 6.4.2 Ball Milling -- 6.4.3 Shear Exfoliation -- 6.4.4 Microfluidization -- 6.5 Stabilization of Exfoliated Flakes -- 6.5.1 Surfactants -- 6.6 Formulation: From Dispersion to Ink -- 6.6.1 The Rheology of Inks -- 6.7 Printing and Coating of 2D‐crystal‐based Inks -- 6.7.1 Spin Coating -- 6.7.2 Blade and Rod Coating -- 6.7.3 Spray Coating -- 6.7.4 Screen Printing -- 6.7.5 Inkjet Printing -- 6.7.6 Characterization Techniques -- 6.8 Applications -- 6.8.1 Printed Electronics -- 6.8.2 Printed Optoelectronics -- 6.8.3 Sensors and Wearable Devices -- 6.8.4 Energy Devices -- 6.8.5 Printed THz Devices -- 6.9 Outlook and Future Perspectives -- Acknowledgments -- References -- Chapter 7 Characterization of Graphene Flexible Materials and Displays -- 7.1 Introduction to Display Systems -- 7.2 Graphene/Flexible Polymer Electrodes -- 7.2.1 Sheet Resistance and Transmittance of Graphene/Flexible Polymer Electrodes -- 7.2.2 Mechanical Robustness of Graphene/Flexible Polymer Electrodes -- 7.3 Graphene‐based Flexible Displays -- 7.4 Outlook -- References -- Chapter 8 AMOLED Display Technology and Applications -- 8.1 Introduction. 8.2 Commercial Flexible AMOLED Displays -- 8.3 OLED Displays -- 8.3.1 Structure and Electro‐optic Behavior -- 8.3.2 Lifetime Effects in OLEDs -- 8.4 AMOLED Display Design -- 8.4.1 TFT Technologies for Flexible AMOLED Displays -- 8.4.1.1 Polysilicon TFTs -- 8.4.1.2 Metal Oxide TFTs -- 8.4.2 AMOLED Pixel Design -- 8.4.3 Integrated Display Drivers -- 8.5 Substrates and Barrier Coatings -- 8.5.1 Substrates -- 8.5.2 Barrier Coatings -- 8.5.3 Additional Layers -- 8.5.4 Characterization of Flexibility -- 8.6 The Future of Flexible AMOLED Displays -- References -- Chapter 9 Flexible Batteries -- 9.1 Introduction -- 9.2 Electrochemical Power Sources - Theoretical Basics -- 9.2.1 Conventional (lithium‐ion) battery build‐up -- 9.3 Basic Material Concepts for Flexible Energy Storage Systems -- 9.3.1 Flexible Electrodes -- 9.3.2 Flexible Electrolyte -- 9.3.3 Flexible Packaging -- 9.4 Basic Design Concepts for Flexible Energy Storage Systems -- 9.4.1 Thin‐film/Printed Batteries -- 9.4.2 Fiber‐shaped/Cable‐type Batteries -- 9.4.3 Embedded Batteries -- 9.5 Summary and Outlook -- References -- Chapter 10 Flexible Organic Bioelectronics and Biosensors -- 10.1 Introduction -- 10.2 Organic Material -- 10.3 Flexible Organic Electronics for Biology -- 10.3.1 OTFTs -- 10.3.1.1 OFET Sensors -- 10.3.1.2 OECTs Sensors -- 10.3.2 Organic Electrodes -- 10.3.2.1 Biological Sensing -- 10.3.2.2 Neural Recording/Stimulation -- 10.3.2.3 Others -- 10.3.3 e‐Textiles -- 10.4 Conclusion -- References -- Index -- EULA. |
| Record Nr. | UNINA-9910831029403321 |
| Weinheim, Germany : , : Wiley-VCH, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Flexible Electronic Packaging and Encapsulation Technology
| Flexible Electronic Packaging and Encapsulation Technology |
| Autore | Meng Hong |
| Edizione | [1st ed.] |
| Pubbl/distr/stampa | Newark : , : John Wiley & Sons, Incorporated, , 2024 |
| Descrizione fisica | 1 online resource (379 pages) |
| Disciplina | 621.381046 |
| Altri autori (Persone) | HuangWei |
| Soggetto topico |
Flexible electronics
Electronic packaging |
| ISBN |
9783527845729
3527845720 9783527845705 3527845704 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Cover -- Title Page -- Copyright -- Contents -- Preface -- Chapter 1 Overview of Flexible Electronic Encapsulating Technology -- 1.1 Flexible Electronics Overview -- 1.2 Development of Flexible Electronic Encapsulating Technology -- 1.2.1 Flip Chip Process -- 1.2.2 Progress of CIF‐Based Flexible Electronic Encapsulating Technology -- 1.3 Encapsulating Technology of Several Important Flexible Electronic Devices -- 1.3.1 Organic Light‐Emitting Diode -- 1.3.2 Flexible Solar Cell Encapsulating -- 1.3.3 Flexible Amorphous Silicon Solar Cells -- 1.3.4 Flexible Perovskite Solar Cells -- 1.4 Flexible Electronic Encapsulating Materials -- 1.4.1 Selection Principle of Flexible Electronic Encapsulating Materials -- 1.4.2 Desirable Properties of Flexible Electronic Encapsulating Materials -- 1.5 Overview of the Development of Flexible Electronic Packaging at Home and Abroad -- References -- Chapter 2 Basic Concepts Related to Flexible Electronic Packaging -- 2.1 Composition of Flexible Electronic Packaging -- 2.1.1 Flexible Substrate -- 2.1.2 Electronic Components -- 2.1.3 Crosslinked Conductive Materials -- 2.1.4 Adhesive Layer -- 2.1.5 Coating Layer -- 2.2 Flexible Electronic Packaging Structure -- 2.2.1 Curved Structures of Hard Thin Films -- 2.2.2 Island‐Bridge Structure -- 2.2.3 Pre‐strained Super‐Soft Interconnect Structure -- 2.2.4 Open Grid Structure -- 2.3 Encapsulation Principle -- 2.3.1 Basic Principle of Penetration -- 2.3.2 Permeation Mechanism of Water Vapor and Gas -- 2.3.3 Barrier Performance Measurement -- 2.3.4 Thin‐Film Barrier Technology for Organic Devices -- 2.3.4.1 Single‐Layer Film Package -- 2.3.4.2 Multilayer Film Packaging -- 2.3.5 Film Encapsulation Mechanics -- 2.4 Packaging Technology -- 2.4.1 Local Multilayer Packaging -- 2.4.2 Multilayer Barrier Film Packaging -- 2.4.3 Online Thin‐Film Encapsulation.
2.4.4 Atomic Layer Deposition (ALD) Encapsulation -- 2.4.5 Inkjet Packaging -- 2.4.6 Flexible Glass Packaging -- 2.5 Packaging Stability -- 2.6 Encapsulated Products -- 2.7 Chapter Summary -- References -- Chapter 3 Flexible Substrates -- 3.1 Concept and Connotation of Flexible Substrates -- 3.2 Development History of Flexible Substrates -- 3.3 Flexible Substrate Materials -- 3.3.1 Polydimethylsiloxane -- 3.3.2 Polyvinyl Alcohol -- 3.3.3 Polycarbonate -- 3.3.4 Polyester -- 3.3.5 Polyimide -- 3.3.6 Polyurethane -- 3.3.7 Parylene -- 3.3.8 Liquid Crystal Polymer -- 3.3.9 Hydrogel -- 3.4 Molding Technology of Flexible Substrate -- 3.4.1 Coating Technology -- 3.4.1.1 Dip Coating Method -- 3.4.1.2 Air Knife Coating Method -- 3.4.1.3 Scraper Coating Method -- 3.4.1.4 Rotary Coating Method -- 3.4.2 Melt Extrusion Molding -- 3.4.3 Melt Extrusion Blow Molding -- 3.4.4 Solution Tape Casting -- 3.4.5 Bidirectional Drawing Molding -- 3.4.6 Chemical Vapor Deposition -- 3.5 Performance Evaluation of Flexible Substrates -- 3.5.1 Mechanical Flexibility -- 3.5.2 Ductility -- 3.5.3 Adhesive Property -- 3.5.4 Barrier Property -- 3.5.5 Electrical Property -- 3.5.6 Chemical Stability -- 3.5.7 Dimensional Stability -- 3.5.8 Surface Smoothness and Thickness Uniformity -- 3.5.9 Optical Clarity (Transmittance) -- 3.5.10 Biocompatibility -- 3.5.11 Bioabsorbability -- 3.6 Application of Flexible Substrates -- 3.6.1 Flexible Display Substrates -- 3.6.2 Flexible Electrode Substrates -- 3.6.3 Flexible Sensing Substrates -- 3.7 Development Trend of Flexible Substrates -- 3.7.1 Intelligent and Functional Flexible Substrates -- 3.7.2 Green Degradable Flexible Substrates -- 3.7.3 Optimization of Interface Compatibility of Flexible Substrates -- References -- Chapter 4 Test Methods -- 4.1 Sealing Test -- 4.1.1 Direct Diffusion Method -- 4.1.1.1 Weight Cup Test. 4.1.1.2 Differential Pressure Method -- 4.1.1.3 Balancing Method -- 4.1.1.4 Tunable Diode Laser Absorption Spectrometry -- 4.1.1.5 Isotope Labeling Mass Spectrometry -- 4.1.2 Indirect Optical Method -- 4.1.3 Indirect Electrical Method -- 4.1.3.1 Calcium Electrical Test -- 4.1.3.2 Dielectric Measurement Method -- 4.1.4 Indirect Electrochemical Method -- 4.1.4.1 Electrochemical Impedance Spectroscopy (EIS) -- 4.1.4.2 Leakage Current Monitoring Method (LCM) -- 4.1.4.3 Linear Scanning Voltammetry (LSV) -- 4.1.5 Indirect Electromechanical Method -- 4.2 Bending Test -- 4.2.1 Static Bending and Dynamic Bending -- 4.2.2 Three‐Point Bending and Four‐Point Bending -- 4.2.3 Push Bending and Roll Bending -- 4.2.3.1 Push Bending -- 4.2.3.2 Rolling Bend -- 4.3 Mechanical Performance Testing -- 4.4 Stability Testing -- References -- Chapter 5 Flexible Electronic Encapsulation -- 5.1 Inorganic Encapsulating Material -- 5.1.1 Metal Encapsulating Material -- 5.1.1.1 Copper, Aluminum -- 5.1.1.2 Favorable Alloys -- 5.1.1.3 Copper-Tungsten Alloy (Cu-W) -- 5.1.2 Ceramic Encapsulating Material -- 5.1.2.1 Al2O3 Ceramic Encapsulation Material -- 5.1.2.2 AlN Ceramic Encapsulation Materials -- 5.1.2.3 BeO Ceramic Encapsulation Material -- 5.1.2.4 BN Ceramic Encapsulation Materials -- 5.1.3 New Trend in Inorganic Encapsulating Materials Combined with Flexible Electronic Technology -- 5.2 Organic Encapsulating Material -- 5.2.1 Polymer Encapsulating Material -- 5.2.1.1 Epoxy Resins -- 5.2.1.2 Polyimide Resins -- 5.2.1.3 Organic Silicon -- 5.2.1.4 Bismaleimide -- 5.2.1.5 Bismaleimide Triazine Resin -- 5.2.2 Development Trend of Organic Encapsulating Materials in Flexible Electronic Devices -- 5.3 Organic-Inorganic Hybrid Encapsulating Material -- 5.3.1 Application of Organic-Inorganic Hybrid Materials in Flexible Electronics -- 5.3.1.1 Strain and Pressure Sensors. 5.3.1.2 Temperature Sensor -- 5.3.1.3 Humidity Sensor -- 5.3.1.4 Optical Sensors -- 5.3.1.5 Other Types of Sensing Devices -- 5.3.2 Development Trends of Organic-Inorganic Hybrid Materials -- References -- Chapter 6 Development of Flexible Electronics Packaging Technology -- 6.1 Flexible Electronics Packaging -- 6.1.1 Single‐Layer Thin‐Film Packaging -- 6.1.2 Multi‐Layer Thin‐Film Packaging -- 6.1.2.1 Barix Multilayer Thin‐Film Packaging -- 6.1.2.2 Other Multilayer Thin‐Film Packaging -- 6.2 Thin‐Film Packaging Technology -- 6.2.1 PECVD Atomic Layer Deposition Packaging Technology -- 6.2.1.1 Introduction to PECVD Technology -- 6.2.1.2 Development of PECVD Technology -- 6.2.2 ALD Atomic Layer Deposition Packaging Technology -- 6.2.2.1 Introduction to ALD Technology -- 6.2.2.2 Development of ALD Technology -- 6.2.3 Inkjet Packaging Technology -- 6.2.3.1 Introduction to Inkjet Encapsulation Technology -- 6.2.3.2 Continuous Inkjet Printing -- 6.2.3.3 Drop‐on‐Demand Inkjet Printing -- 6.2.3.4 Development of Inkjet Printing Technology -- References -- Chapter 7 Application of Flexible Electronics Packaging -- 7.1 Industry Chain Analysis of Flexible Electronics Packaging -- 7.1.1 Upstream, Midstream, and Downstream of the Flexible Electronics Industry Chain -- 7.1.2 Overview of the Development of Flexible Packaging Materials -- 7.2 Packaging Applications of Flexible OLED Devices -- 7.2.1 Stability Issues of Flexible OLED Devices -- 7.2.2 Flexible OLED Packaging Technology -- 7.2.2.1 Lack of Breakthrough in Encapsulating Technology -- 7.2.2.2 Low Yield Rate -- 7.3 Packaging Applications for Flexible Solar Cells -- 7.3.1 Inorganic Flexible Solar Cells -- 7.3.2 Organic Flexible Solar Cells -- 7.3.3 Dye‐Sensitized Solar Cells -- 7.3.3.1 Structure of Dye‐Sensitized Solar Cells -- 7.3.3.2 Light Anode -- 7.3.3.3 Counter Electrode. 7.4 Packaging Applications for Flexible Electronic Devices -- 7.4.1 Basic Structure of Flexible Electronic Devices -- 7.4.2 Application of Flexible Electronic Devices -- 7.4.2.1 Optoelectronics -- 7.4.2.2 Robot -- 7.4.2.3 Biomedical -- 7.4.2.4 Energy Equipment -- 7.5 Packaging Applications for Flexible Electronics Sensors -- 7.5.1 Common Materials of Flexible Sensors -- 7.5.1.1 Flexible Substrate -- 7.5.1.2 Metal Materials -- 7.5.1.3 Inorganic Semiconductor Materials -- 7.5.1.4 Organic Materials -- 7.5.1.5 Carbon Materials -- 7.5.2 Flexible Gas Sensors -- 7.5.3 Flexible Pressure Sensors -- 7.5.4 Flexible Humidity Sensor -- 7.5.5 Normal Sensors Compare with Flexible Sensors -- References -- Chapter 8 Testing Standards -- 8.1 Terminology and Alphabetic Symbols -- 8.1.1 Scope -- 8.1.2 Terms and Definitions -- 8.1.2.1 Terminology Classification -- 8.1.2.2 General Terms -- 8.1.2.3 Physical Characteristics Related Terms -- 8.1.2.4 Terms Related to Construction Elements -- 8.1.2.5 Symbols Related to Performances and Specifications -- 8.1.2.6 Terms Related to the Production Process -- 8.1.3 Alphabetic Symbols (Quantity Symbols/Unit Symbols) -- 8.1.3.1 Classification -- 8.1.3.2 Symbols -- 8.2 Mechanical Test Method (Deformation Test) -- 8.2.1 Cyclic Bending Test -- 8.2.1.1 Purpose -- 8.2.1.2 Testing Device -- 8.2.1.3 Test Procedure -- 8.2.1.4 Test Conditions and Reports -- 8.2.2 Static Bending Test -- 8.2.2.1 Purpose -- 8.2.2.2 Testing Device -- 8.2.2.3 Test Steps -- 8.2.2.4 Test Conditions and Reports -- 8.2.3 Combined Bending Test -- 8.2.3.1 Purpose -- 8.2.3.2 Testing Device -- 8.2.3.3 Test Procedure -- 8.2.3.4 Test Conditions and Reports -- 8.2.4 Rolling Test -- 8.2.4.1 Purpose -- 8.2.4.2 Testing Device -- 8.2.4.3 Test Procedure -- 8.2.4.4 Test Conditions and Reports -- 8.2.5 Static Rolling Test -- 8.2.5.1 Purpose -- 8.2.5.2 Testing Device. 8.2.5.3 Test Procedure. |
| Record Nr. | UNINA-9911020272603321 |
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Meng Hong
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| Newark : , : John Wiley & Sons, Incorporated, , 2024 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Flexible Electronics : Theory and Method of Structural Design / / Yongan Huang, YeWang Su, and Shan Jiang
| Flexible Electronics : Theory and Method of Structural Design / / Yongan Huang, YeWang Su, and Shan Jiang |
| Autore | Huang YongAn |
| Edizione | [1st ed. 2022.] |
| Pubbl/distr/stampa | Singapore ; ; Beijing, China : , : Springer : , : Science Press, , [2022] |
| Descrizione fisica | 1 online resource (423 pages) |
| Disciplina | 621.381 |
| Soggetto topico | Flexible electronics |
| ISBN | 981-19-6623-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Chapter 1. Introduction of flexible electronics -- Chapter 2. Buckling of film-on-substrate -- Chapter 3. Buckling of fibers-on-substrate -- Chapter 4. Self-similar design without substrate -- Chapter 5. Self-similar design with substrate -- Chapter 6. Conformal design with rigid substrate -- Chapter 7. Conformal design with soft substrate -- Chapter 8. Deformation instability under compression -- Chapter 9. Deformation instability under stretching -- Chapter 10. Multiple neutral layer design for flexible electronics -- Chapter 11. Liquid metal for stretchable electronics -- Chapter 12. Devices and applications of flexible electronics. |
| Record Nr. | UNISA-996503462803316 |
|
Huang YongAn
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| Singapore ; ; Beijing, China : , : Springer : , : Science Press, , [2022] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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Flexible energy conversion and storage devices / / edited by Chunyi Zhi and Liming Dai
| Flexible energy conversion and storage devices / / edited by Chunyi Zhi and Liming Dai |
| Autore | Zhi Chunyi |
| Edizione | [1st edition] |
| Pubbl/distr/stampa | Weinheim, Germany : , : Wiley-VCH, , [2018] |
| Descrizione fisica | 1 online resource (515 pages) |
| Disciplina | 621.381 |
| Soggetto topico |
Flexible electronics
Energy storage Energy conversion |
| ISBN |
3-527-34262-1
3-527-34260-5 3-527-34263-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910555096103321 |
|
Zhi Chunyi
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| Weinheim, Germany : , : Wiley-VCH, , [2018] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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